Semiconductor device and termination structure
Provided is a highly reliable semiconductor device in which an influence on device characteristics can be reduced while improving a high temperature and high humidity bias resistance of a termination structure (termination region) of a chip by a relatively simple method. The semiconductor device includes an active region disposed on a main surface of a semiconductor substrate, and a termination region disposed on the main surface so as to surround the active region. The termination region includes an interlayer insulating film formed on the main surface of the semiconductor substrate, and an organic protective film formed so as to cover the interlayer insulating film. An insulating film having a thickness of 100 nm or less and containing nitrogen is provided between the interlayer insulating film and the organic protective film.
1. A semiconductor device comprising:
an active region disposed on a main surface of a semiconductor substrate; and
a termination region disposed on the main surface so as to surround the active region, wherein
the termination region includes an interlayer insulating film formed on the main surface of the semiconductor substrate, and an organic protective film formed so as to cover the interlayer insulating film,
an insulating film having a thickness of 100 nm or less and containing nitrogen is provided between the interlayer insulating film and the organic protective film, and
a gate electrode formed within the interlayer insulating film.
2. The semiconductor device according to claim 1 , wherein the termination region includes a guard ring formed on the main surface of the semiconductor substrate.
3. The semiconductor device according to claim 2 , wherein the termination region includes a field plate electrode formed on the interlayer insulating film and connected to the guard ring by penetrating through an opening formed in the interlayer insulating film.
4. The semiconductor device according to claim 3 , wherein the organic protective film is formed so as to cover the interlayer insulating film and the field plate electrode.
5. The semiconductor device according to claim 1 , wherein the insulating film containing nitrogen has a thickness of 50 nm or less.
6. The semiconductor device according to claim 1 , wherein the insulating film containing nitrogen has a thickness of 10 nm or more.
7. The semiconductor device according to claim 1 , wherein the insulating film containing nitrogen has a thickness of 20 nm or more.
8. The semiconductor device according to claim 4 , wherein the insulating film containing nitrogen is provided between the organic protective film and the interlayer insulating film and the field plate electrode so as to cover the interlayer insulating film and the field plate electrode.
9. The semiconductor device according to claim 4 , wherein the insulating film containing nitrogen is also provided between the interlayer insulating film and the field plate electrode.
10. The semiconductor device according to claim 4 , wherein the insulating film containing nitrogen is not provided on an upper surface of the field plate electrode.
11. The semiconductor device according to claim 4 , wherein the active region includes a pad electrode formed on the main surface of the semiconductor substrate, and the insulating film containing nitrogen is provided on at least a part of a surface of the pad electrode.
12. The semiconductor device according to claim 4 , wherein the insulating film containing nitrogen is provided between the organic protective film and the interlayer insulating film and the field plate electrode so as to cover the interlayer insulating film and the field plate electrode.
13. The semiconductor device according to claim 1 , wherein the insulating film containing nitrogen is a silicon nitride film or a silicon oxynitride film.