Granted Patent B2

US 12,733,104 · App. 17/536,184 · Granted Sep 8, 2026

Inventors: Sooyeon Han (Yongin-si, KR); Chanjae Park (Yongin-si, KR); Kichun Song (Yongin-si, KR); Chelgou Lim (Yongin-si, KR)

Assignee: SAMSUNG DISPLAY CO., LTD.

H05K1/189B23K20/106H10D86/021H10K71/00

Abstract

Claims (35)

1 . A method of manufacturing a display device, the method comprising:

arranging a display panel on a first stage;

arranging a head portion connected to a booster portion, such that a driving chip corresponds to a pad of the display panel;

bonding the driving chip to the pad of the display panel by applying heat to the head portion and vibrating the head portion;

blocking the heat of the head portion from moving toward the booster portion, by supplying a gas to the booster portion,

wherein the gas is introduced into the booster portion and is moved through an inside of the booster portion and discharged to an outside of the booster portion; and

moving the gas along an outer surface of the booster portion.

2 . The method of claim 1 , wherein the head portion is vibrated by a converter portion connected to the booster portion.

3 . The method of claim 2 , further comprising cooling an inside of the converter portion.

4 . The method of claim 2 , further comprising cooling the outside of the booster portion and an outside of the converter portion.

5 . The method of claim 1 , further comprising arranging a film member between the driving chip and the display panel.

6 . The method of claim 1 , further comprising cooling the booster portion.

7 . The method of claim 1 , further comprising heating the head portion.

8 . A method of manufacturing a display device, the method comprising:

arranging a display panel on a first stage;

arranging a head portion connected to a booster portion, such that a driving chip corresponds to a pad of the display panel;

bonding the driving chip to the pad of the display panel by applying heat to the head portion and vibrating the head portion;

blocking the heat of the head portion from moving toward the booster portion, by supplying a gas to the booster portion,

wherein the head portion is vibrated by a converter portion connected to the booster portion,

wherein the gas is introduced into the booster portion and is moved through an inside of at least the booster portion, discharged to an outside of the booster portion, moved through an inside of the converter portion, and discharged to an outside of the converter portion; and

moving the gas along an outer surface of the booster portion and an outer surface of the converter portion.

9 . A method of manufacturing a display device, the method comprising:

arranging a display panel on a first stage;

arranging a head portion such that a driving chip corresponds to a pad of the display panel;

bonding the driving chip to the pad of the display panel by applying heat to the head portion and vibrating the head portion by using a converter portion connected to the head portion;

cooling the converter portion by supplying a gas to an inner surface of the converter portion; and

surrounding an outer surface of the converter portion with a cooling pocket,

wherein the gas is moved from an outer surface of the cooling pocket to the inner surface of the converter portion and moved along the inner surface of the converter portion in a first direction, and then from the inner surface of the converter portion to an outer surface of the converter portion and then moved along the outer surface of the converter portion within the cooling pocket in a second direction opposite the first direction and discharged out the cooling pocket.

10 . The method of claim 9 , wherein the converter portion is connected to the head portion via a booster portion.

11 . The method of claim 10 , further comprising cooling the booster portion by supplying the gas to the outer surface of the booster portion.

12 . The method of claim 10 , wherein the cooling pocket is in contact with a nodal point arranged at the booster portion or the converter portion.

13 . The method of claim 9 , further comprising heating the head portion through a heater portion arranged in the head portion.

14 . The method of claim 9 , further comprising fixing the driving chip on a tip portion protruding from the head portion.

15 . The method of claim 9 , further comprising arranging the driving chip on a second stage.

16 . The method of claim 15 , further comprising transferring the driving chip on the second stage to the head portion.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (52)