Granted Patent B2

US 12,296,549 · App. 17/539,969 · Granted May 13, 2025

Inventors: Sharad D. Bhagat (Austin, TX); Chieh Chang (Cedar Park, TX); Christophe Peroz (Tokyo, JP)

Assignee: Magic Leap, Inc.

B29D11/00663B29C35/0888B29C39/26B29C2035/0827B29L2011/0075

Abstract

Claims (38)

1. A method for forming a waveguide part, the method comprising:

dispensing a photocurable material between a first mold portion and a second mold portion opposite the first mold portion;

irradiating the photocurable material with radiation suitable for photocuring the photocurable material to form a cured waveguide film so that different portions of the cured waveguide film have different rigidity;

separating the cured waveguide film from the first and second mold portions; and

singulating the waveguide part from the cured waveguide film,

wherein the waveguide part corresponds to portions of the cured waveguide film having a higher rigidity than other portions of the cured waveguide film.

2. The method of claim 1 , wherein different portions of the photocurable material are irradiated with different amounts of radiation.

3. The method of claim 2 , wherein portions of the photocurable material irradiated with larger amounts of radiation correspond to portions of the cured waveguide film having higher rigidity than portions of the cured waveguide film corresponding to portions of the photocurable material irradiated with smaller amounts of radiation.

4. The method of claim 2 , wherein different amounts of radiation are supplied by irradiating the photocurable material through a mask.

5. The method of claim 4 , wherein the mask includes apertures corresponding to a predetermined shape of the waveguide part.

6. The method of claim 1 , wherein the waveguide part has a thickness of no more than 1000 μm and an area of at least 1 cm 2 .

7. The method of claim 1 , wherein at least some of the other portions of the cured waveguide film enclose the portions of the cured waveguide film corresponding to the waveguide part.

8. The method of claim 1 , further comprising:

singulating a plurality of waveguide parts from the cured waveguide film,

wherein the plurality of waveguide parts corresponds to portions of the cured waveguide film having a higher rigidity than other portions of the cured waveguide film.

9. A method for forming a waveguide part, the method comprising:

dispensing a photocurable material between a first mold portion and a second mold portion opposite the first mold portion;

irradiating the photocurable material with radiation suitable for photocuring the photocurable material to form a cured waveguide film;

singulating a portion of the cured waveguide film from the cured waveguide film; and

annealing the singulated portion to provide the waveguide part,

wherein the waveguide part has a rigidity higher than a rigidity of the cured waveguide film.

10. The method of claim 9 , wherein the singulated portion is annealed by irradiating the singulated portion with radiation suitable for photocuring the photocurable material.

11. The method of claim 9 , wherein the singulated portion is annealed by heating the singulated portion.

12. The method of claim 9 , wherein the waveguide part has a thickness of no more than 1000 μm and an area of at least 1 cm 2 .

13. The method of claim 9 , further comprising:

singulating a plurality of portions of the cured waveguide film from the cured waveguide film; and

annealing the plurality of singulated portions to provide a plurality of waveguide parts.

14. A method for forming a waveguide part, the method comprising:

positioning a frame between a first mold portion and a second mold portion, the frame having a first rigidity, and the frame defining an aperture;

dispensing a photocurable material into the aperture of the frame;

irradiating the photocurable material in the aperture with radiation suitable for photocuring the photocurable material to form a cured waveguide film having a second rigidity different from the first rigidity; and

singulating the waveguide part from the cured waveguide film by cutting a path along the frame, the path at least partially encircling the aperture, and extracting, from the frame along the path.

15. The method of claim 14 , wherein the frame defines a plurality of apertures.

16. The method of claim 15 , wherein the photocurable material is dispensed into each of the apertures of the frame.

17. The method of claim 16 , wherein the photocurable material in each of the apertures is simultaneously irradiated with the radiation.

18. The method of claim 17 , wherein the cured waveguide film comprises the cured photocurable material in each of the apertures.

19. The method of claim 14 , wherein the waveguide part has a thickness of no more than 1000 μm and an area of at least 1 cm 2 .

20. The method of claim 14 , wherein the first rigidity is greater than the second rigidity.

Assignments (3)

Continuity (3)

References Cited (102)