IP Library › Granted Patent US 12,592,533
Granted Patent B2
US 12,592,533 · App. 17/541,005 · Granted Mar 31, 2026

Terminal fixing method

Inventor: Yuta Matsunaga (Shizuoka, JP)
Assignee: YAZAKI CORPORATION
H01R43/0221B23K1/0016B23K1/0056B23K26/009B23K26/067H01R43/0249H01R43/0256B23K2101/42H01R12/67H05K1/118H05K5/0069H05K2201/094H05K2201/09409
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Quick Facts
Patent No.
US 12,592,533
App. No.
17/541,005
Granted
Mar 31, 2026
Kind
B2
Abstract

A terminal fixing method, for fixing one or more terminals to a plurality of lands provided on a substrate by laser welding, includes: constructing the plurality of lands by one or more terminal installation lands on which the terminals are installed and one or more dummy lands each larger than each of the terminal installation lands; irradiating each of divided laser beams emitted from a laser oscillator toward a corresponding land of two or more lands in the plurality of lands by the laser welding; and constructing the two or more lands by two or more terminal installation lands in the terminal installation lands, or one or more terminal installation lands in the terminal installation lands and the one or more dummy lands.

Claims (12)

1 . A terminal fixing method for fixing one or more terminals to a plurality of lands provided on a substrate by laser welding, comprising:

constructing the plurality of lands by one or more terminal installation lands on which the terminals are installed and one or more dummy lands on which no terminals are installed each larger than each of the terminal installation lands; and

irradiating divided laser beams emitted from a laser oscillator toward two or more lands the plurality of lands so as to execute the laser welding, wherein

the two or more lands include two or more terminal installation lands, or one or more terminal installation lands and the one or more dummy lands,

each of the dummy lands comprises: a front surface dummy land provided on one surface in a thickness direction of the substrate and on which no terminals are installed; and a rear surface dummy land provided on other surface in the thickness direction of the substrate and on which no terminals are installed, and

the front surface dummy land and the rear surface dummy land are mutually connected by a connection part penetrating the substrate.

2 . The terminal fixing method of claim 1 , wherein an area of the front surface dummy land and an area of the rear surface dummy land are different from each other.

3 . The terminal fixing method of claim 1 , wherein in the laser welding, a solder is arranged on each of the one or more dummy lands, and the laser beams are irradiated toward the one or more dummy lands.

4 . The terminal fixing method of claim 1 , wherein at least a part of a dummy land in the one or more dummy lands is covered with a cover lay provided on the substrate.

5 . The terminal fixing method of claim 1 , wherein the substrate is a flexible printed circuit.

6 . The terminal fixing method of claim 1 , wherein a heat capacity of the one or more dummy lands is greater than a heat capacity of the one or more terminal installation lands.

7 . The terminal fixing method of claim 1 , wherein the irradiating step includes irradiating the divided laser beams emitted from a laser oscillator toward two of the terminal installation lands, and irradiating the divided laser beams toward one of the terminal installation lands and one of the dummy lands.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2021
From: MATSUNAGA, YUTA
To: YAZAKI CORPORATION
Reel/Frame 058361/0328 →
Priority Claims (1)
JP 2020-201601 · Dec 4, 2020 · national
Continuity (1)
Related Publication 20220181832A1 · Jun 9, 2022
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