Radiation-sensitive resin composition, method of forming resist pattern, and compound
A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; a radiation-sensitive acid generator; and a compound represented by the following formula (1). In the following formula (1), R 1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and X n+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3. It is preferable that R 1 in the following formula (1) represents an organic group, and that the organic group has a ring structure. It is preferable that R 1 in the following formula (1) represents an organic group, and that the organic group is an acid-labile group. X n+ in the following formula (1) preferably represents a sulfonium cation, an iodonium cation, or a combination thereof.
1. A radiation-sensitive resin composition comprising:
a polymer which comprises a structural unit comprising an acid-labile group;
a radiation-sensitive acid generator; and
a compound represented by formula (1):
wherein, in the formula (1), R 1 represents a monovalent organic group having 1 to 30 carbon atoms; and X n+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3.
2. The radiation-sensitive resin composition according to claim 1 , wherein R 1 in the formula (1) represents an organic group, and the organic group comprises a ring structure.
3. The radiation-sensitive resin composition according to claim 1 , wherein R 1 in the formula (1) represents an organic group, and the organic group is an acid-labile group.
4. The radiation-sensitive resin composition according to claim 1 , wherein X n+ in the formula (1) represents a sulfonium cation, an iodonium cation, or a combination thereof.
5. The radiation-sensitive resin composition according to claim 1 , wherein n in the formula (1) is 1.
6. A method of forming a resist pattern, the method comprising:
applying a radiation-sensitive resin composition directly or indirectly on a substrate;
exposing a resist film formed by the applying; and
developing the resist film exposed, wherein
the radiation-sensitive resin composition comprises:
a polymer which comprises a structural unit comprising an acid-labile group;
a radiation-sensitive acid generator; and
a compound represented by formula (1):
wherein, in the formula (1), R 1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and X n+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3.
7. A compound represented by formula (1):
wherein, in the formula (1), R 1 represents a monovalent organic group having 1 to 30 carbon atoms; and X n+ represents a cation having a valency of n, wherein n is an integer of 1 to 3.
8. The compound according to claim 7 , wherein the cation represented by X n+ in the formula (1) is an onium cation.
9. The compound according to claim 8 , wherein the onium cation represented by X n+ is radiation sensitive.
10. The radiation-sensitive resin composition according to claim 1 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the acid generating agent in the radiation-sensitive resin composition is from 0.1 parts by mass to 50 parts by mass with respect to 100 parts by mass of the polymer.
11. The radiation-sensitive resin composition according to claim 1 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the acid generating agent in the radiation-sensitive resin composition is from 10 parts by mass to 40 parts by mass with respect to 100 parts by mass of the polymer.
12. The radiation-sensitive resin composition according to claim 1 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the compound in the radiation-sensitive resin composition is from 1 to 50 mol % with respect to 100 mol % of the acid generating agent.
13. The radiation-sensitive resin composition according to claim 1 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the compound in the radiation-sensitive resin composition is from 10 to 30 mol % with respect to 100 mol % of the acid generating agent.
14. The method according to claim 6 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the acid generating agent in the radiation-sensitive resin composition is from 0.1 parts by mass to 50 parts by mass with respect to 100 parts by mass of the polymer.
15. The method according to claim 6 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the acid generating agent in the radiation-sensitive resin composition is from 10 parts by mass to 40 parts by mass with respect to 100 parts by mass of the polymer.
16. The method according to claim 6 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the compound in the radiation-sensitive resin composition is from 1 to 50 mol % with respect to 100 mol % of the acid generating agent.
17. The method according to claim 6 , wherein the radiation-sensitive acid generator is an acid generating agent, and a content of the compound in the radiation-sensitive resin composition is from 10 to 30 mol % with respect to 100 mol % of the acid generating agent.
18. The method according to claim 6 , wherein X n+ in the formula (1) represents a sulfonium cation, an iodonium cation, or a combination thereof.
19. The compound according to claim 9 , wherein X n+ in the formula (1) represents a sulfonium cation, an iodonium cation, or a combination thereof.