IP Library › Assignment 070894/0405
Patent Assignment
Reel/Frame 070894/0405

Merger

Recorded: 2025-04-21 Pages: 13
Assignor
JSR CORPORATION
Executed: 2024-10-28
Assignee
JICC-02 CO., LTD.
1-9-2 HIGASHI-SHINBASHI, MINATO-KU, TOKYO, 105-8640, JAPAN
Covered Properties (29)
Film-Forming Composition, Silicon-Containing Film, and Resist Pattern-Forming Method
Application: 16/942,938 →
Publication: US US20200354575A1
Radiation-Sensitive Resin Composition and Resist Pattern-Forming Method
Application: 17/458,783 →
Publication: US US20220260908A9
Composition, Resist Underlayer Film, Method of Forming Resist Underlayer Film, Method of Producing Patterned Substrate, and Compound
Application: 17/482,557 →
Publication: US US20220011672A1
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, and Compound
Application: 17/541,422 →
Publication: US US20220091508A1
Radiation-Sensitive Resin Composition and Method of Forming Resist Pattern
Application: 17/543,789 →
Publication: US US20230229082A2
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, and Polymer
Application: 17/673,952 →
Publication: US US20220269172A1
Composition, Method of Producing Substrate, and Polymer
Application: 17/541,317 →
Publication: US US20220089809A1
Film-Forming Composition, Resist Underlayer Film, Method of Forming Film, Method of Forming Resist Pattern, Method of Forming Organic-Underlayer-Film Reverse Pattern, Method of Producing Film-Forming Composition, and Method of Forming Metal-Containing Film Pattern
Application: 17/528,373 →
Publication: US US20220075267A1
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, Polymer, and Compound
Application: 17/713,278 →
Publication: US US20220229367A1
Composition, Silicon-Containing Film, Method of Forming Silicon-Containing Film, and Method of Treating Semiconductor Substrate
Application: 17/584,456 →
Publication: US US20220146940A1
Composition, Film, Method of Forming Film, Method of Forming Pattern, Method of Forming Organic-Underlayer-Film Reverse Pattern, and Method of Producing Composition
Application: 17/696,982 →
Publication: US US20220204535A1
Composition, Resist Underlayer Film, Method of Forming Film, Method of Producing Patterned Substrate, and Compound
Application: 17/689,193 →
Publication: US US20220197144A1
Pattern-Forming Method and Composition
Application: 17/583,270 →
Publication: US US20220145113A1
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, Polymer, and Compound
Application: 17/829,531 →
Publication: US US20220299873A1
Radiation-Sensitive Resin Composition and Method of Forming Resist Pattern
Application: 17/829,432 →
Publication: US US20220413385A1
Composition, Method of Producing Substrate, and Polymer
Application: 17/735,151 →
Publication: US US20220259741A1
Radiation-Sensitive Resin Composition and Method of Forming Resist Pattern
Application: 17/867,739 →
Publication: US US20230236506A2
Silicon-Containing Composition and Method of Producing Semiconductor Substrate
Application: 17/887,670 →
Publication: US US20230250238A9
Composition, Method of Forming Resist Underlayer Film, and Method of Forming Resist Pattern
Application: 17/942,332 →
Publication: US US20230041656A1
Resist Underlayer Film-Forming Composition, Resist Underlayer Film, and Method of Producing Semiconductor Substrate
Application: 17/950,251 →
Publication: US US20230053159A1
Composition for Resist Underlayer Film Formation, and Method of Producing Semiconductor Substrate
Application: 17/961,611 →
Publication: US US20230069221A1
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, and Compound
Application: 18/100,031 →
Publication: US US20230236501A1
Radiation-Sensitive Resin Composition and Method of Forming Resist Pattern
Application: 18/235,924 →
Publication: US US20240094634A1
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, Polymer, and Compound
Application: 18/239,399 →
Publication: US US20230400767A1
Radiation-Sensitive Composition and Method of Forming Resist Pattern
Application: 18/618,304 →
Publication: US US20240329523A1
Radiation-Sensitive Resin Composition, Method of Forming Resist Pattern, and Polymer
Application: 18/782,428 →
Publication: US US20240377742A1
Radiation-Sensitive Resin Composition and Method of Forming Resist Pattern
Application: 18/906,361 →
Publication: US US20250116935A1
Radiation-Sensitive Composition, Method of Forming Resist Pattern, and Polymer
Application: 19/176,934 →
Publication: US US20250237950A1
Radiation-Sensitive Resin Composition and Resist Pattern-Forming Method
Application: 17/081,000 →
Publication: US US20210389667A9
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 9, 2021
From: SEKO, TOMOAKI; TAJI, TOMOYA; SATOU, NOZOMI; TANAKA, HIROMITSU
To: JSR CORPORATION
Reel/Frame 056798/0749 →
Assignment of Assignor's Interest Dec 1, 2021
From: NAKAFUJI, SHIN-YA; TANIGUCHI, TOMOAKI; TAKANASHI, KAZUNORI
To: JSR CORPORATION
Reel/Frame 058257/0107 →
Assignment of Assignor's Interest Dec 3, 2021
From: NISHIKORI, KATSUAKI
To: JSR CORPORATION
Reel/Frame 058278/0589 →
Assignment of Assignor's Interest Dec 3, 2021
From: KOMATSU, HIROYUKI; SHIRATANI, MOTOHIRO; SAKAI, TATSUYA
To: JSR CORPORATION
Reel/Frame 058276/0886 →
Assignment of Assignor's Interest Dec 7, 2021
From: NISHIKORI, KATSUAKI
To: JSR CORPORATION
Reel/Frame 058314/0774 →
Assignment of Assignor's Interest Jan 25, 2022
From: OOTSUBO, YUUSUKE; SERIZAWA, RYUICHI; OZAKI, YUKI; SAKAI, KAZUNORI
To: JSR CORPORATION
Reel/Frame 058753/0182 →
Assignment of Assignor's Interest Feb 28, 2022
From: NISHIKORI, KATSUAKI; KIRIYAMA, KAZUYA; TANIGUCHI, TAKUHIRO; MARUYAMA, KEN
To: JSR CORPORATION
Reel/Frame 059116/0115 →
Assignment of Assignor's Interest Apr 19, 2022
From: NEMOTO, RYUICHI; OKAZAKI, SATOSHI; FURUKAWA, TAIICHI
To: JSR CORPORATION
Reel/Frame 059632/0186 →
Assignment of Assignor's Interest May 3, 2022
From: KOMATSU, HIROYUKI; SHIRATANI, MOTOHIRO
To: JSR CORPORATION
Reel/Frame 059788/0609 →
Assignment of Assignor's Interest May 20, 2022
From: KASAI, TATSUYA; MATSUKI, TOMOHIRO; ANNO, YUSUKE; SEKO, TOMOAKI
To: JSR CORPORATION
Reel/Frame 059971/0669 →
Assignment of Assignor's Interest May 20, 2022
From: OOTSUBO, YUUSUKE; SERIZAWA, RYUICHI; SAKAI, KAZUNORI
To: JSR CORPORATION
Reel/Frame 059968/0085 →
Assignment of Assignor's Interest Jun 2, 2022
From: NOSAKA, NAOYA; ABE, TSUBASA; DOBASHI, MASATO; TAKANASHI, KAZUNORI
To: JSR CORPORATION
Reel/Frame 060087/0168 →
Assignment of Assignor's Interest Jun 17, 2022
From: NEMOTO, RYUICHI; TANAKA, RYOTARO; FURUKAWA, TAIICHI; NISHIKORI, KATSUAKI
To: JSR CORPORATION
Reel/Frame 060238/0510 →
Assignment of Assignor's Interest Jun 17, 2022
From: KIRIYAMA, KAZUYA; TANIGUCHI, TAKUHIRO; NISHIKORI, KATSUAKI; KINOSHITA, NATSUKO
To: JSR CORPORATION
Reel/Frame 060238/0262 →
Assignment of Assignor's Interest Jul 19, 2022
From: NISHIKORI, KATSUAKI; KIRIYAMA, KAZUYA; TANIGUCHI, TAKUHIRO; MARUYAMA, KEN
To: JSR CORPORATION
Reel/Frame 060543/0217 →
Assignment of Assignor's Interest Nov 22, 2022
From: TAKAGI, YUGAKU; ABE, TSUBASA; KATAGIRI, TAKASHI; DEI, SATOSHI
To: JSR CORPORATION
Reel/Frame 061853/0949 →
Assignment of Assignor's Interest Nov 22, 2022
From: SERIZAWA, RYUICHI; HIRASAWA, KENGO
To: JSR CORPORATION
Reel/Frame 061853/0607 →
Assignment of Assignor's Interest Oct 19, 2023
From: KANEKO, TETSUROU; NAKASHIMA, HIROMITSU; MATSUMURA, YUUSHI; SUZUKI, JUNYA
To: JSR CORPORATION
Reel/Frame 065277/0984 →
Change of Name Apr 21, 2025
From: JICC-02 CO., LTD.
To: JSR CORPORATION
Reel/Frame 070894/0498 →
Merger Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
Change of Name Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →