RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH 2 —, —S—, —SO 2 —, —NR A —, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and R A represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R 2 and R 3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.
1 . A radiation-sensitive resin composition comprising:
a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which comprises a structural unit represented by formula (1); and
a radiation-sensitive acid generating agent,
wherein, in the formula (1), R 1 represents a hydrogen atom, a methyl group, or a trifluoromethyl group; L represents a single bond, —COO—, —O—, or —CONH—; Ar 1 represents a group obtained by removing (m+2) hydrogen atoms from an aromatic ring having 6 to 30 ring atoms; X represents a single bond, —O—, -G-O—, —CH 2 —, —S—, —SO 2 —, —NR A —, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and R A represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms; Ar 2 represents a group obtained by removing (n+1) hydrogen atoms from an aromatic ring having 6 to 30 ring atoms; R 2 and R 3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms; m is an integer of 0 to 10, wherein in a case in which m is no less than 2, a plurality of R 2 s are identical or different from each other; and n is an integer of 0 to 10, wherein in a case in which n is no less than 2, a plurality of R 3 s are identical or different from each other.
2 . The radiation-sensitive resin composition according to claim 1 , wherein a sum of m and n is no less than 1.
3 . The radiation-sensitive resin composition according to claim 1 , wherein each aromatic ring that gives Ar 1 or Ar 2 is an aromatic hydrocarbon ring.
4 . The radiation-sensitive resin composition according to claim 1 , wherein R 2 , R 3 or both represents a fluorine atom or an iodine atom.
5 . The radiation-sensitive resin composition according to claim 1 , wherein
R 2 , R 3 , or both represents a hydroxy group or an organic group having 1 to 20 carbon atoms, and
the organic group is a group comprising an acid-labile group, a group comprising a lactone ring structure or a cyclic carbonate structure, a fluorinated alcohol group, a ketone group, or an alkoxy group.
6 . A method of forming a resist pattern, the method comprising:
applying the radiation-sensitive resin composition according to claim 1 directly or indirectly on a substrate;
exposing a resist film formed by the applying; and
developing the resist film exposed.
7 . The method according to claim 6 , wherein a sum of m and n is no less than 1.
8 . The method according to claim 6 , wherein each aromatic ring that gives Ar 1 or Ar 2 is an aromatic hydrocarbon ring.
9 . The method according to claim 6 , wherein R 2 , R 3 or both represents a fluorine atom or an iodine atom.
10 . The method according to claim 6 , wherein
R 2 , R 3 , or both represents a hydroxy group or an organic group having 1 to 20 carbon atoms, and
the organic group is a group comprising an acid-labile group, a group comprising a lactone ring structure or a cyclic carbonate structure, a fluorinated alcohol group, a ketone group, or an alkoxy group.