RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMER, AND COMPOUND
A radiation-sensitive resin composition includes: a polymer including a first structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; R 2 , R 3 , and R 4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R 5 represents a monovalent organic group having 1 to 20 carbon atoms; and L represents a single bond or a divalent organic group having 1 to 20 carbon atoms.
1 : A radiation-sensitive resin composition comprising:
a polymer comprising a first structural unit represented by formula (1); and
a radiation-sensitive acid generator,
wherein, in the formula (1),
R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group;
R 2 , R 3 , and R 4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms;
R 5 represents a monovalent organic group having 1 to 20 carbon atoms; and
L represents a single bond or a divalent organic group having 1 to 20 carbon atoms.
2 : The radiation-sensitive resin composition according to claim 1 , wherein R 2 represents the monovalent organic group having 1 to 20 carbon atoms.
3 : The radiation-sensitive resin composition according to claim 1 , wherein the organic group which is represented by R 2 is a monovalent hydrocarbon group having 1 to 20 carbon atoms, or a group obtained by substituting a part or all of hydrogen atoms contained in the monovalent hydrocarbon group with a monovalent heteroatom-containing group.
4 . The radiation-sensitive resin composition according to claim 1 , wherein R 3 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms.
5 : The radiation-sensitive resin composition according to claim 1 , wherein R 4 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms.
6 : The radiation-sensitive resin composition according to claim 1 , wherein R 5 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms.
7 : The radiation-sensitive resin composition according to claim 1 , wherein the polymer further comprises a second structural unit comprising a phenolic hydroxy group.
8 : The radiation-sensitive resin composition according to claim 1 , wherein the polymer further comprises a third structural unit which is a structural unit other than the first structural unit and comprises an acid-labile group.
9 : A method of forming a resist pattern, the method comprising:
forming a resist film directly or indirectly on a substrate by applying the radiation-sensitive resin composition according to claim 1 ;
exposing the resist film; and
developing the resist film exposed.
10 : A polymer comprising a first structural unit represented by formula (1):
wherein, in the formula (1),
R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group;
R 2 , R 3 , and R 4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms;
R 5 represents a monovalent organic group having 1 to 20 carbon atoms; and
L represents a single bond or a divalent organic group having 1 to 20 carbon atoms.
11 : A compound represented by formula (1′):
wherein, in the formula (1′),
R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group;
R 2 , R 3 , and R 4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms;
R 5 represents a monovalent organic group having 1 to 20 carbon atoms; and
L represents a single bond or a divalent organic group having 1 to 20 carbon atoms.