RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMER
Provided are: a radiation-sensitive resin composition, a method of forming a resist pattern, and a polymer which enable forming a resist pattern with favorable sensitivity to exposure light and superiority in terms of CDU performance and resolution. The radiation-sensitive resin composition contains: a polymer having: a first structural unit represented by formula (1), and a second structural unit derived from a (meth)acrylic acid ester including an acid-labile group; and a radiation-sensitive acid generator.
1 . A radiation-sensitive resin composition comprising:
a polymer comprising:
a first structural unit represented by formula (1); and
a second structural unit derived from a (meth)acrylic acid ester comprising an acid-labile group; and
a radiation-sensitive acid generator,
wherein, in the formula (1), R 1 represents a hydrogen atom, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; R 2 and R 3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; m is an integer of 0 to 9; and n is an integer of 0 to 9, wherein a sum of m and n is no greater than 9, in a case in which m is no less than 2, a plurality of R 2 s are identical or different from each other, and in a case in which n is no less than 2, a plurality of R 3 s are identical or different from each other.
2 . The radiation-sensitive resin composition according to claim 1 , wherein R 1 in the formula (1) represents a hydrogen atom.
3 . The radiation-sensitive resin composition according to claim 1 , wherein a proportion of the first structural unit with respect to total structural units constituting the polymer is no less than 1 mol % and no greater than 20 mol %.
4 . A method of forming a resist pattern, the method comprising:
applying a radiation-sensitive resin composition directly or indirectly on a substrate;
exposing a resist film formed by the applying; and
developing the resist film exposed, wherein
the radiation-sensitive resin composition comprises:
a polymer comprising:
a first structural unit represented by formula (1); and
a second structural unit derived from a (meth)acrylic acid ester
comprising an acid-labile group; and
a radiation-sensitive acid generator,
wherein, in the formula (1), R 1 represents a hydrogen atom, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; R 2 and R 3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; m is an integer of 0 to 9; and n is an integer of 0 to 9, wherein a sum of m and n is no greater than 9, in a case in which m is no less than 2, a plurality of R 2 s are identical or different from each other, and in a case in which n is no less than 2, a plurality of R 3 s are identical or different from each other.
5 . A polymer comprising:
a first structural unit represented by formula (1); and
a second structural unit derived from a (meth)acrylic acid ester comprising an acid-labile group,
wherein, in the formula (1), R 1 represents a hydrogen atom, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; R 2 and R 3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; m is an integer of 0 to 9; and n is an integer of 0 to 9, wherein a sum of m and n is no greater than 9, in a case in which m is no less than 2, a plurality of R 2 s are identical or different from each other, and in a case in which n is no less than 2, a plurality of R 3 s are identical or different from each other.