Granted Patent B2

US 12,224,735 · App. 17/542,284 · Granted Feb 11, 2025

Inventor: Sean McHugh (Santa Barbara, CA)

Assignee: Murata Manufacturing Co., Ltd.

H03H9/564H03H9/02015H03H9/13H03H9/171H03H9/706

Abstract

Claims (24)

1. A diplexer comprising:

a first chip comprising series resonators of a high band filter;

a second chip comprising shunt resonators of the high band filter and series resonators of a low band filters; and

a third chip comprising shunt resonators of the low band filter, wherein

the series resonators and the shunt resonators of the high band filter are decoupled transversely-excited film bulk acoustic resonators (DXBARs), and

the series resonators and the shunt resonators of the low band filter are transversely-excited film bulk acoustic resonators (XBARs).

2. The diplexer of claim 1 , wherein

the first chip comprises a first piezoelectric plate having a first thickness,

the second chip comprises a second piezoelectric plate having a second thickness greater than the first thickness, and

the third chip comprises a third piezoelectric plate having a third thickness greater than the second thickness.

3. The diplexer of claim 2 , wherein the first, second, and third piezoelectric plates are rotated Y-cut lithium niobate.

4. The diplexer of claim 1 , wherein each XBAR comprises:

a diaphragm formed by a portion of a piezoelectric plate spanning a cavity in a substrate; and

a conductor pattern comprising an interdigital transducer with interleaved fingers on the diaphragm.

5. The diplexer of claim 1 , wherein each DXBAR comprises:

a diaphragm formed by a portion of a piezoelectric plate spanning a cavity in a substrate;

a dielectric layer on the diaphragm; and

a conductor pattern comprising an interdigital transducer with interleaved fingers on the dielectric layer over the diaphragm.

6. The diplexer of claim 1 , wherein the first, second, and third chips are mounted on and electrically connected to an interposer, the interposer comprising:

conductors to connect the first, second and third chips; and

contacts for electrical connections to circuits external to the diplexer.

7. The diplexer of claim 6 , wherein the interposer comprises one of a printed circuit board, a low temperature co-fired ceramic circuit card, and a silicon chip.

8. The diplexer of claim 6 , wherein the conductors connect the series and shunt resonators of the high band filter in a first ladder filter circuit and connect the series and shunt resonators of the low band filter in a second ladder filter circuit.

9. The diplexer of claim 1 , wherein the high band is 5 th Generation New Radio (5G NR) band n79 and the low band is 5G NR band n77.

Assignments (2)

Continuity (2)

References Cited (186)