IP Library Granted Patent US 11,582,870
Granted Patent B2
US 11,582,870 · App. 17/543,032 · Granted Feb 14, 2023

Boards having solderless interconnects

Inventors: Stijn Wielandt (Berkeley, CA); Baptiste Dafflon (Berkeley, CA)
Assignee: The Regents of the University of California
H05K1/181H05K1/119H05K2201/10151
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Quick Facts
Patent No.
US 11,582,870
App. No.
17/543,032
Granted
Feb 14, 2023
Kind
B2
Abstract

This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15°. Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

Claims (28)

1. A device comprising:

a first board, the first board including at least two pins defined at an end of the first board, the first pin and the second pin being positioned along a first line and parallel to the first line; and

a second board, the second board including at least two slots defined at an end of the second board, the first slot and the second slot being positioned along a second line and being angled from the second line by ±10° to 15°, the first slot having a positive or negative angle from the second line, the second slot having the other of the positive angle or the negative angle from the second line, each of the pins in the first board engaged with each of the slots in the second board and forming an electrical connection between the first pin and the first slot and the second pin and the second slot.

2. The device of claim 1 , wherein the first board has a first sensor disposed thereon.

3. The device of claim 2 , wherein the first sensor comprises a temperature sensor, a tilt sensor, a capacitive sensor, or an optical sensor.

4. The device of claim 1 , wherein the first board and the second board both comprise printed circuit boards (PCBs).

5. The device of claim 1 , wherein the first slot and the second slot are positioned along a second line and are angled from the second line by ±12°.

6. The device of claim 1 , wherein each of the pins has a metal disposed thereon.

7. The device of claim 1 , wherein each of the slots has a metal disposed on an interior surface of the slot.

8. The device of claim 1 , wherein each of the pins includes two barbs proximate an end of the pin.

9. The device of claim 1 , wherein the first board and the second board are each 5 centimeters to 50 centimeters long.

10. The device of claim 1 , wherein the first board and the second board are each 0.8 millimeters thick.

11. The device of claim 1 , wherein the first board has a first sensor disposed thereon, the device further comprising:

a memory device connected to the second board;

a microprocessor connected to the second board;

a power source connected to the second board; and

a communication connector connected to the second board.

12. The device of claim 11 , wherein the communication connector comprises a wireless communication technology.

13. The device of claim 1 , wherein the first board and the second board are disposed in a tube.

14. The device of claim 13 , wherein the tube has an inner diameter of 5 millimeters to 25 millimeters and an outer diameter of 7 millimeters to 30 millimeters.

15. The device of claim 13 , wherein a length of the tube is 0.5 meters to 2 meters.

16. The device of claim 13 , wherein the tube comprises a metal or a plastic.

17. The device of claim 13 , wherein the tube is translucent or transparent.

18. The device of claim 13 , wherein the tube is opaque.

19. A device comprising:

a first board, the first board including at least two pins defined at an end of the first board, the first pin and the second pin being positioned along a first line and parallel to the first line; and

a second board, the second board including at least two slots defined at an end of the second board, the first slot and the second slot being positioned along a second line and being angled from the second line by ±10° to 15°, the first slot having a positive or negative angle from the second line, the second slot having the same positive angle or the same negative angle from the second line, each of the pins in the first board engaged with each of the slots in the second board and forming an electrical connection between the first pin and the first slot and the second pin and the second slot.

20. The device of claim 1 , wherein the first board and the second board both comprise printed circuit boards (PCBs).

Assignments (2)
CONFIRMATORY LICENSE Recorded May 18, 2022
From: UNIVERSITY OF CALIF-LAWRENC BERKELEY LAB
To: UNITED STATES DEPARTMENT OF ENERGY
Reel/Frame 059948/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2021
From: WIELANDT, STIJN; DAFFLON, BAPTISTE
To: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Reel/Frame 058429/0241 →
Continuity (2)
Provisional Application 63123912 · Dec 10, 2020
Related Publication 20220192024A1 · Jun 16, 2022