Chuck with non-flat shaped surface
An embodiment of an apparatus may include a chuck body, and a surface formed on the chuck body to hold a wafer, where the surface has a non-flat shape. Other embodiments are disclosed and claimed.
1 . An apparatus, comprising:
a chuck body; and
a surface formed on the chuck body, wherein the surface has a fixed non-flat shape and is configured to hold a wafer;
wherein the surface further includes a plurality of distinct portions distributed on the surface, and wherein each of the plurality of distinct portions has a respective fixed local variation with respect to a reference plane, and the respective fixed local variation corresponds to an anticipated stress of a wafer to be caused by a process of the apparatus at the respective distinct portion.
2 . The apparatus of claim 1 , wherein the fixed non-flat shape comprises a concave shape.
3 . The apparatus of claim 1 , wherein the fixed non-flat shape comprises a convex shape.
4 . The apparatus of claim 1 , wherein the fixed non-flat shape comprises a saddle shape.
5 . The apparatus of claim 1 , wherein the fixed non-flat shape of the surface is configured to compensate for an anticipated change in a shape of the wafer to be held thereon after one or more process steps.
6 . The apparatus of claim 5 , wherein the non-flat shape comprises a complex, irregular shape.
7 . The apparatus of claim 1 , further comprising:
a wafer fabrication apparatus to perform one or more process steps on the wafer, wherein the chuck body is coupled to the wafer fabrication apparatus to hold the wafer for the one or more process steps.
8 . The apparatus of claim 1 , wherein the plurality of distinct portions include at least 10 portions, and respective fixed local variations of the plurality of distinct portions of the surface of the chuck body are configured to compensate for an incoming wafer shape and the anticipated stress on different portions of the wafer.
9 . The apparatus of claim 1 , wherein the surface has a plurality of vacuum holes configured to hold the wafer closely in contact with the fixed non-flat shape of the surface during wafer processing and make the wafer be substantially flat when the wafer is released after wafer processing.
10 . A method, comprising:
holding a wafer on a chuck; and
performing one or more process steps on the wafer while the wafer is held on the chuck, wherein a surface of the chuck that holds the wafer has a fixed non-flat shape;
wherein the surface of the chuck further includes a plurality of distinct portions distributed on the surface, and wherein each of the plurality of distinct portions has a respective fixed local variation with respect to a reference plane, and the respective fixed local variation corresponds to an anticipated stress of the wafer to be caused by the one or more process steps at the respective distinct portion.
11 . The method of claim 10 , wherein the fixed non-flat shape comprises a concave shape.
12 . The method of claim 10 , wherein the fixed non-flat shape comprises a convex shape.
13 . The method of claim 10 , wherein the fixed non-flat shape comprises a saddle shape.
14 . The method of claim 10 , wherein the fixed non-flat shape of the surface is configured to compensate for an anticipated change in shape of the wafer held thereto after the one or more process steps.
15 . The method of claim 14 , wherein the non-flat shape comprises a complex, irregular shape.
16 . A method, comprising:
forming a chuck body;
characterizing a wafer by a plurality of measured data points related to a shape of the wafer, wherein the plurality of measured data points distributed on the shape of the wafer;
determining respective fixed local variations to flatness of the characterized wafer based on the plurality of measured data points; and
forming a surface with a fixed non-flat shape on the chuck body to compensate for the determined fixed local variations of the characterized wafer;
wherein the surface further includes a plurality of distinct portions distributed on the surface, and wherein each of the plurality of distinct portions corresponds to a respective fixed local variation corresponding to an anticipated stress of the wafer to be caused by a process of an apparatus at the respective distinct portion.
17 . The method of claim 16 , further comprising:
forming one of a concave shape, a convex, and a saddle shape on the chuck body for the surface to hold the wafer.
18 . The method of claim 14 , further comprising:
determining an anticipated change in the shape of the wafer to be held thereon after one or more process steps; and
forming the surface with the fixed non-flat shape to compensate for the determined anticipated change in the shape.
19 . The method of claim 18 , wherein the anticipated change in shape corresponds to a resulting complex, irregular shape of the wafer.