Semiconductor fuse with multi-bond wire
An electronic device has a fuse circuit including a semiconductor die and first and second bond wires, the semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit, the first bond wire having a first end coupled to the bond pad and a second end coupled to a conductive terminal, and the second bond wire having a first end coupled to the second end of the first bond wire and a second end coupled to the conductive terminal.
1. An electronic device, comprising:
a package structure;
a conductive terminal extending outside the package structure;
a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse;
a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to the conductive terminal via a ball bond; and
a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal via a stitch bond.
2. An electronic device, comprising:
a package structure;
a conductive terminal extending outside the package structure;
a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse;
a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to the conductive terminal;
a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal; and
a third bond wire enclosed by the package structure and having first and second ends, the first end of the third bond wire coupled to the first end of the second bond wire, and the second end of the third bond wire coupled to the conductive terminal.
3. The electronic device of claim 2 , wherein:
the first end of the second bond wire is bonded to the first end of the first bond wire; and
the first end of the third bond wire is bonded to the first end of the second bond wire.
4. The electronic device of claim 3 , wherein the semiconductor die comprises a protected circuit coupled to a second portion of the fuse.
5. The electronic device of claim 2 , wherein the semiconductor die comprises a protected circuit coupled to a second portion of the fuse.
6. The electronic device of claim 2 , wherein:
the first end of the first bond wire is coupled to the bond pad by a first bond;
the first end of the second bond wire is bonded to the first end of the first bond wire by a second bond;
the first end of the third bond wire is bonded to the first end of the second bond wire by a third bond; and
one the first, second, and third bonds is a ball bond.
7. The electronic device of claim 6 , wherein another one the first, second, and third bonds is a stitch bond.
8. The electronic device of claim 6 , wherein the first bond is formed on a stud bump.
9. The electronic device of claim 2 , wherein the semiconductor die comprises a protected circuit coupled to a second portion of the fuse.
10. The electronic device of claim 2 , wherein:
the first end of the first bond wire is coupled to the bond pad by a first bond;
the first end of the second bond wire is bonded to the first end of the first bond wire by a second bond; and
one the first and second bonds is a ball bond.
11. The electronic device of claim 10 , wherein the other one the first and second bonds is a stitch bond.
12. The electronic device of claim 10 , wherein the first bond is formed on a stud bump.
13. A fuse circuit, comprising:
a semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit;
a first bond wire having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a conductive terminal via a ball bond; and
a second bond wire having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal via a stitch bond.
14. A fuse circuit, comprising:
a semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit;
a first bond wire having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a conductive terminal; and
a second bond wire having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal; and
a third bond wire having first and second ends, the first end of the third bond wire coupled to the first end of the second bond wire, and the second end of the third bond wire coupled to the conductive terminal.
15. The fuse circuit of claim 14 , wherein:
the first end of the first bond wire is coupled to the bond pad by a first bond;
the first end of the second bond wire is bonded to the first end of the first bond wire by a second bond; and
one the first and second bonds is a ball bond.
16. The fuse circuit of claim 14 , wherein the first end of the first bond wire coupled to the bond pad by a stud bump.
17. A method for fabricating an electronic device, the method comprising:
attaching a semiconductor die to a die attach pad;
performing a wire bonding process that includes:
coupling a first end of a first bond wire to the bond pad, and coupling a second end of the first bond wire to a conductive terminal, and
coupling a first end of a second bond wire to the first end of the first bond wire, and coupling a second end of the second bond wire to the conductive terminal; and
performing a molding process that encloses the semiconductor die, the first and second bond wires, and a portion of the conductive terminal in a package structure.
18. The method of claim 17 , wherein:
the wire bonding process further includes coupling a first end of a third bond wire to the first end of the second bond wire, and coupling a second end of the third bond wire to the conductive terminal; and
the molding process encloses the third bond wire in the package structure.
19. The method of claim 17 , wherein the wire bonding process includes:
forming a stud bump on the bond pad; and
coupling the first end of the first bond wire to the stud bump.
20. The method of claim 17 , wherein coupling the first end of the second bond wire to the first end of the first bond wire includes ball bonding or stitch bonding the first end of the second bond wire to the first end of the first bond wire.
21. An electronic device, comprising:
a package structure;
a conductive terminal extending outside the package structure;
a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse;
a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a stud bump on the conductive terminal; and
a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to another stud bump on the conductive terminal.