IP Library › Granted Patent US 12,189,370
Granted Patent B2
US 12,189,370 · App. 17/549,702 · Granted Jan 7, 2025

Information handling system display backplane vapor chamber

Inventors: Jace W. Files (Round Rock, TX); John Trevor Morrison (Round Rock, TX); Travis C. North (Cedar Park, TX)
Assignee: Dell Products L.P.
G05B19/41805H01L21/67253G05B2219/45026
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,189,370
App. No.
17/549,702
Granted
Jan 7, 2025
Kind
B2
Abstract

A portable information handling system modular hybrid architecture separates components between rotationally coupled housing portions to minimize cabling, connectors and materials, and to provide improved durability that supports recycling and reuse of the components. A display coupled in one housing portion integrates a vapor chamber in the display backplate that aligns with a main board central processing unit to dissipate thermal energy to the backplate and through the backplate to the housing.

Claims (59)

1. An information handling system comprising:

a housing having first and second housing portions rotationally coupled by a hinge;

a housing cover having a keyboard and sized to couple over the first housing portion;

a display sized to couple over the second housing portion, the display having a backplane;

a main board coupled to the second housing portion under the display, the main board having a central processing unit and memory that cooperate to process information and that interfaces with the display to present the information as visual images at the display;

a secondary board coupled to the first housing portion under the housing cover and interfaced with the main board, the secondary board having an embedded controller to manage operating conditions in the housing; and

a vapor chamber coupled to the display backplane and thermally interfaced with the central processing unit to transfer thermal energy from the central processing unit.

2. The information handling system of claim 1 wherein:

the main board couples to the vapor chamber proximate a side of the second housing portion at the hinge; and

the vapor chamber extends from the side of the second housing portion to proximate an opposing side and past a perimeter of the main board.

3. The information handling system of claim 1 wherein:

the display comprises a liquid crystal display having a backlight and a display panel separated from the main board by the backplane; and

insulation is disposed between the backplane and backlight.

4. The information handling system of claim 3 wherein the insulation comprises an air gap and a graphene sheet, the graphene sheet thermally interfaced with the second housing portion.

5. The information handling system of claim 1 wherein:

the display comprises an organic light emitting diode film separated from the main board by the backplane; and

insulation is disposed between the backplane and the organic light emitting diode film.

6. The information handling system of claim 1 wherein the vapor chamber integrates with the backplane as a contiguous metal structure.

7. The information handling system of claim 1 further comprising:

a timing controller board coupled to the backplate and having a timing controller interfaced with a display panel of the display a timing controller connector interface disposed at one side; and

a timing controller connector exposed at a side of the main board and coupled to the timing controller connector interface to communicate visual information from the main board to the display.

8. The information handling system of claim 1 further comprising:

a thermal sensor disposed to detect the vapor chamber temperature; and

non-transient memory interfaced with the embedded controller and storing instructions that when executed on the embedded processor adjust central processing unit operations based upon the vapor chamber temperature.

9. The information handling system of claim 1 further comprising:

a thermal sensor disposed to detect the vapor chamber temperature;

an air mover coupled in the second housing portion to move air in the second housing portion; and

non-transient memory interfaced with the embedded controller and storing instructions that when executed on the embedded processor adjust air mover operations based upon the vapor chamber temperature.

10. A method for managing a thermal state of an information handling system, the method comprising:

coupling a main board to a housing, the main board having a central processing unit and memory;

coupling a display to the housing over the main board;

dissipating thermal energy from the central processing unit to a vapor chamber coupled to the display;

assembling the display from display panel, a backlight and a backplate;

integrating the vapor chamber as a contiguous part of the backplate;

assembling the housing from first and second housing portions rotationally coupled by a hinge; and

coupling the main board to the backplate and vapor chamber at a side of the second housing proximate the hinge, the vapor chamber extending away from the hinge to an opposing side of the housing and past a perimeter of the main board.

11. The method of claim 10 further comprising:

dissipating the thermal energy from the backplate to the housing; and

insulating between backlight and the backplate.

12. The method of claim 10 further comprising:

coupling a secondary board to the first housing portion, the secondary board including an embedded controller;

sensing a temperature of the vapor chamber; and

managing temperatures associated with the second housing portion with instructions executed on the embedded controller and the sensed temperature.

13. The method of claim 10 further comprising:

coupling a timing controller board having a timing controller to the backplate between the main board and the hinge; and

interfacing the timing controller board and the main board with connectors disposed at opposing sides of the timing controller board and the main board.

14. The method of claim 10 further comprising:

cutting an opening in the backplate; and

fixing the vapor chamber in the opening.

15. A display comprising:

a display panel operable to present visual images;

a backplate of thermally conductive material behind the display panel;

a vapor chamber integrated in the backplate;

a thermal couple region defined in the vapor chamber to thermally interface against a main board having a perimeter and central processing unit in a first housing portion; and

thermally interfacing the vapor chamber with an embedded controller coupled to a secondary board in a second housing portion, the embedded controller managing thermal conditions in the housing.

16. The display of claim 15 further comprising:

wherein the vapor chamber extends beyond the main board perimeter.

17. The display of claim 15 further comprising insulation disposed between the display panel and the backplate.

18. The display of claim 17 wherein the insulation comprises a graphene sheet.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2021
From: NORTH, TRAVIS C.
To: DELL PRODUCTS L.P.
Reel/Frame 058449/0224 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2021
From: FILES, JACE W.; MORRISON, JOHN TREVOR
To: DELL PRODUCTS L.P.
Reel/Frame 058377/0587 →
Continuity (1)
Related Publication 20230185286A1 · Jun 15, 2023
References Cited (113)
US 5579528A · Register · 1996 [cited by applicant]
US 5966284A · Youn et al. · 1999 [cited by applicant]
US 6243261B1 · Janik et al. · 2001 [cited by applicant]
US 6421237B1 · Kim · 2002 [cited by applicant]
US 6952767B1 · Tanaka · 2005 [cited by applicant]
US 6954357B2 · Tseng et al. · 2005 [cited by applicant]
US 7010634B2 · Silvester · 2006 [cited by applicant]
US 7256642B2 · Kimura · 2007 [cited by applicant]
US 7446432B2 · Cha · 2008 [cited by applicant]
US 7957012B2 · Silverbrook et al. · 2011 [cited by applicant]
US 8422212B2 · Liu et al. · 2013 [cited by applicant]
US 8634873B2 · Jones et al. · 2014 [cited by applicant]
US 8837142B2 · McEwan et al. · 2014 [cited by applicant]
US 8917501B2 · Hokugou et al. · 2014 [cited by applicant]
US 9215813B2 · Brosseau et al. · 2015 [cited by applicant]
US 9274565B2 · Tanaka · 2016 [cited by applicant]
US 9335799B2 · Nguyen et al. · 2016 [cited by applicant]
US 9494976B2 · Bates et al. · 2016 [cited by applicant]
US 9507385B2 · Chen et al. · 2016 [cited by applicant]
US 9829932B2 · Degner et al. · 2017 [cited by applicant]
US 9857848B2 · Liang · 2018 [cited by applicant]
US 9946981B2 · Gatson et al. · 2018 [cited by applicant]
US 10006967B2 · Ganesan et al. · 2018 [cited by applicant]
US 10008886B2 · Leabman · 2018 [cited by applicant]
US 10255881B1 · Patel · 2019 [cited by applicant]
US 10401926B1 · North · 2019 [cited by examiner]
US 10726454B2 · Edmondson et al. · 2020 [cited by applicant]
US 10811201B1 · Files et al. · 2020 [cited by applicant]
US 10955878B2 · Wang et al. · 2021 [cited by applicant]
US 11099605B2 · Knoppert · 2021 [cited by applicant]
US 11165265B2 · Kristjansson et al. · 2021 [cited by applicant]
US 11226374B2 · Severson et al. · 2022 [cited by applicant]
US 11243576B2 · Gerardi · 2022 [cited by applicant]
US 11360153B1 · Wang · 2022 [cited by applicant]
US 11579663B1 · Files et al. · 2023 [cited by applicant]
US 11740707B1 · Files et al. · 2023 [cited by applicant]
US 20020048975A1 · Horikoshi et al. · 2002 [cited by applicant]
US 20020085343A1 · Wu et al. · 2002 [cited by applicant]
US 20040012509A1 · Chen · 2004 [cited by applicant]
US 20040190239A1 · Weng et al. · 2004 [cited by applicant]
US 20050174094A1 · Purdy et al. · 2005 [cited by applicant]
US 20060167656A1 · Shimonishi · 2006 [cited by applicant]
US 20070120525A1 · Tsuji · 2007 [cited by applicant]
US 20080174951A1 · Mundt et al. · 2008 [cited by applicant]
US 20080315788A1 · Levey · 2008 [cited by applicant]
US 20090168336A1 · Yokote et al. · 2009 [cited by applicant]
US 20090299881A1 · Del Rosario · 2009 [cited by applicant]
US 20090321511A1 · Browne · 2009 [cited by applicant]
US 20100149741A1 · Liu · 2010 [cited by applicant]
US 20110086611A1 · Klein · 2011 [cited by applicant]
US 20130088825A1 · Mizoguchi et al. · 2013 [cited by applicant]
US 20130222993A1 · Izuka · 2013 [cited by applicant]
US 20130286561A1 · Hokugou et al. · 2013 [cited by applicant]
US 20130308261A1 · Matsumoto et al. · 2013 [cited by applicant]
US 20140108846A1 · Berke et al. · 2014 [cited by applicant]
US 20140172478A1 · Vadasz · 2014 [cited by applicant]
US 20140204519A1 · Wu · 2014 [cited by applicant]
US 20140204520A1 · Wu et al. · 2014 [cited by applicant]
US 20140355193A1 · Purcocks · 2014 [cited by applicant]
US 20150035370A1 · Wyatt et al. · 2015 [cited by applicant]
US 20150189962A1 · Yeo et al. · 2015 [cited by applicant]
US 20150317951A1 · Genoe · 2015 [cited by applicant]
US 20150346784A1 · Delano · 2015 [cited by examiner]
US 20160011627A1 · Lin · 2016 [cited by applicant]
US 20160149597A1 · Takasu · 2016 [cited by applicant]
US 20160231788A1 · Chen et al. · 2016 [cited by applicant]
US 20170004421A1 · Gatson · 2017 [cited by applicant]
US 20170110268A1 · Tachikawa · 2017 [cited by applicant]
US 20170124110A1 · Hajj · 2017 [cited by applicant]
US 20170242290A1 · Jenkins · 2017 [cited by examiner]
US 20170370135A1 · Wang · 2017 [cited by applicant]
US 20180060133A1 · Fang et al. · 2018 [cited by applicant]
US 20190044436A1 · Hijazi et al. · 2019 [cited by applicant]
US 20190050869A1 · Lau · 2019 [cited by applicant]
US 20190080670A1 · Jung · 2019 [cited by applicant]
US 20190196011A1 · Brodsky et al. · 2019 [cited by applicant]
US 20190196551A1 · Wang et al. · 2019 [cited by applicant]
US 20190204392A1 · Bertness · 2019 [cited by applicant]
US 20190302852A1 · Kitamura et al. · 2019 [cited by applicant]
US 20200133818A1 · Katami · 2020 [cited by applicant]
US 20200333852A1 · Smith et al. · 2020 [cited by applicant]
US 20200348745A1 · Hamlin et al. · 2020 [cited by applicant]
US 20210006079A1 · Weiderstrand · 2021 [cited by applicant]
US 20210110366A1 · Dion et al. · 2021 [cited by applicant]
US 20210133007A1 · Ghosh · 2021 [cited by applicant]
US 20210160355A1 · Min et al. · 2021 [cited by applicant]
US 20210173456A1 · Kulkarni · 2021 [cited by examiner]
US 20210223825A1 · Seiler et al. · 2021 [cited by applicant]
US 20220045372A1 · Junger et al. · 2022 [cited by applicant]
US 20220167187A1 · Jia · 2022 [cited by applicant]
US 20220289067A1 · Adegbohun · 2022 [cited by applicant]
US 20230185277A1 · Morrison et al. · 2023 [cited by applicant]
US 20230185285A1 · Morrison et al. · 2023 [cited by applicant]
US 20230185286A1 · Files et al. · 2023 [cited by applicant]
US 20230185291A1 · Morrison et al. · 2023 [cited by applicant]
US 20230185331A1 · Files et al. · 2023 [cited by applicant]
US 20230185332A1 · Morrison et al. · 2023 [cited by applicant]
US 20230185343A1 · Morrison et al. · 2023 [cited by applicant]
US 20230185348A1 · Morrison et al. · 2023 [cited by applicant]
US 20230185354A1 · Files et al. · 2023 [cited by applicant]
US 20230185690A1 · Morrison et al. · 2023 [cited by applicant]
US 20230186802A1 · Morrison et al. · 2023 [cited by applicant]
US 20240094781A1 · Patel · 2024 [cited by applicant]
CN 206411622 · 2017 [cited by applicant]
CN 107329862 · 2017 [cited by applicant]
CN 207067863 · 2018 [cited by applicant]
CN 113776805 · 2021 [cited by applicant]
CN 114112137 · 2022 [cited by applicant]
DE 102005042538 · 2006 [cited by applicant]
JP 2000194586 · 2000 [cited by applicant]
JP 2003074536 · 2003 [cited by applicant]
JP 2010045750 · 2010 [cited by applicant]
WO WO2019059274 · 2019 [cited by applicant]