Systems and methods for sealing a bond cavity between structural components

1. A method of sealing a bond cavity, the method comprising:

placing, by one or more robotic devices using an injection nozzle, an adhesive around a perimeter of a first structure to be joined to a second structure, wherein the first structure is a stringer of a wing of an aircraft and the second structure is a wing skin;

positioning, by the one or more robotic devices, the first structure relative to the second structure such that the adhesive is disposed between the first structure and the second structure;

merging, by the one or more robotic devices, the first structure and the second structure until the first structure and the second structure are separated by a desired gap for bonding;

heating the perimeter to at least partially cure the adhesive to form a leak-proof bond cavity perimeter between the first structure and the second structure;

performing a set of tests to check for leaks from the leak-proof bond cavity perimeter between the first structure and the second structure, wherein performing the set of tests to check for leaks involves at least a first test comprising injecting a gas into the leak-proof bond cavity to detect for leaks and a second test to check for leaks that differs from the first test;

based on the set of tests indicating that the leak-proof bond cavity perimeter does not leak, evacuating a cavity formed between the first structure, the second structure, and the leak-proof bond cavity perimeter;

puncturing a small hole proximate the cavity using a hypodermic needle;

forcing a de-aerated adhesive into the cavity via the hypodermic needle, wherein the de-aerated adhesive is an adhesive paste with bubbles evacuated; and

curing the adhesive forced into the cavity.

2. The method of claim 1 , wherein placing the adhesive around the perimeter of the first structure to be joined to the second structure comprises placing, around the perimeter of the first structure to be joined to the second structure, a bead of the adhesive having a shape selected from the group consisting of: a triangle, a semi-circle, a trapezoid, and a rectangle.

3. The method of claim 1 , wherein placing the adhesive around the perimeter of the first structure to be joined to the second structure comprises placing the adhesive around the perimeter of the first structure to be joined to the second structure through an injection nozzle that is controlled in an at least partially autonomous manner.

4. The method of claim 1 , wherein the adhesive comprises a plurality of micro-beads having a thickness that defines the desired gap for bonding, and

wherein merging the first structure and the second structure until the first structure and the second structure are separated by the desired gap for bonding comprises merging the first structure and the second structure until the first structure and the second structure are separated by the thickness of the plurality of micro-beads that defines the desired gap for bonding.

5. The method of claim 1 , wherein positioning the first structure relative to the second structure such that the adhesive is disposed between the first structure and the second structure comprises aligning the first structure relative to the second structure with one or more fasteners, and

wherein merging the first structure and the second structure until the first structure and the second structure are separated by the desired gap for bonding comprises merging the first structure and the second structure by tightening a clamping tool securing the first structure and the second structure.

6. The method of claim 1 , wherein positioning the first structure relative to the second structure such that the adhesive is disposed between the first structure and the second structure comprises aligning the first structure relative to the second structure with one or more fasteners, and

wherein merging the first structure and the second structure until the first structure and the second structure are separated by the desired gap for bonding comprises merging the first structure and the second structure by tightening one or more gasketed nuts to secure the one or more fasteners.

7. The method of claim 1 , wherein heating the perimeter to at least partially cure the adhesive to form the leak-proof bond cavity perimeter between the first structure and the second structure comprises heating the perimeter using a heating process selected from the group consisting of: conductively heating the adhesive with a resistance heat blanket, radiantly heating the adhesive with a heat lamp, convectively heating the adhesive with forced air, and inductively heating the adhesive with metallic elements embedded in at least the first structure.

8. The method of claim 1 , wherein heating the perimeter to at least partially cure the adhesive to form the leak-proof bond cavity perimeter between the first structure and the second structure comprises heating the perimeter at a given temperature to partially cure the adhesive to form the leak-proof bond cavity perimeter between the first structure and the second structure.

9. The method of claim 1 , wherein heating the perimeter to at least partially cure the adhesive to form the leak-proof bond cavity perimeter between the first structure and the second structure comprises heating the perimeter at a cure temperature of the adhesive to fully cure the adhesive to form the leak-proof bond cavity perimeter between the first structure and the second structure.

10. The method of claim 1 , wherein evacuating the cavity formed between the first structure, the second structure, and the leak-proof bond cavity perimeter comprises evacuating the cavity formed between the first structure, the second structure, and the leak-proof bond cavity perimeter through a first hole formed in the first structure, and

wherein forcing the adhesive into the cavity comprises while evacuating the cavity through the first hole, forcing the adhesive into the cavity through a second hole formed in the first structure.

11. The method of claim 1 , wherein evacuating the cavity formed between the first structure, the second structure, and the leak-proof bond cavity perimeter comprises evacuating the cavity formed between the first structure, the second structure, and the leak-proof bond cavity perimeter through a single hole formed in the first structure, and

wherein forcing the adhesive into the cavity comprises forcing the adhesive into the cavity through the single hole.

12. The method of claim 1 , further comprising:

fastening the first structure to the second structure after curing the adhesive.

13. The method of claim 1 , wherein heating the perimeter comprises:

applying heat via a heat lamp to the perimeter to at least partially cure the adhesive to form the leak-proof bond cavity.

14. The method of claim 1 , wherein the one or more robotic devices includes a plurality of robotic devices arranged on an assembly line.

15. The method of claim 1 , wherein placing the adhesive around the perimeter of the first structure comprises:

triggering a robotic device to autonomously adjust a position of the injection nozzle to place the adhesive around the perimeter of the first structure, wherein the robotic device uses a robotic arm to change position of the injection nozzle.

16. The method of claim 1 , wherein evacuating the cavity formed between the first structure, the second structure, and the leak-proof bond cavity perimeter comprises:

evacuating the cavity using a vacuum source.

17. The method of claim 1 , wherein performing the set of tests to check for leaks comprises:

injecting helium into the leak-proof bond cavity to detect for leaks.

18. The method of claim 1 , further comprising:

drilling one or more additional holes into the first structure, the second structure, and the cured adhesive; and

applying one or more additional fasteners to the one or more additional holes to fasten the first structure and the second structure.

19. The method of claim 1 , wherein heating the perimeter to at least partially cure the adhesive to form the leak-proof bond cavity perimeter between the first structure and the second structure comprises:

inductively heating the adhesive with metallic elements embedded in at least the first structure.

20. The method of claim 1 , further comprising:

based on performing the set of tests to check for leaks, detecting a leak in the leak-proof bond cavity perimeter; and

touching up the detected leak using a dab of sealant.