Local interconnects having different material compositions
A semiconductor device and formation thereof. The semiconductor device including: a first bottom interconnect formed within a first dielectric layer and located within a logic area of the semiconductor device; a second bottom interconnect formed within the first dielectric layer and located within a memory area of the semiconductor device; and a memory device formed on top of the second bottom interconnect located within the memory area of the semiconductor device, wherein: a first metal material used to form the first bottom interconnect located in the logic area is different than a second metal material used to form the second bottom interconnect located in the memory area.
1 . A method of forming a semiconductor device, comprising:
forming a first bottom interconnect and a second bottom interconnect in a first dielectric layer, wherein:
the first bottom interconnect and the second bottom interconnect formed in the first dielectric layer are located in a logic area and a memory area, respectively, of the semiconductor device; and
the first bottom interconnect located in the logic area is formed from a first metal material that is different than a second metal material used to form the second bottom interconnect located in the memory area;
forming a metal plug on top of the second bottom interconnect located within the memory area of the semiconductor device; and
forming a memory device pillar on top of the metal plug.
2 . The method of claim 1 , wherein the first metal material used to fill the first opening in the first dielectric layer located in the logic area and the second metal material used to fill the second opening in the first dielectric layer located in the memory area are non-ferromagnetic.
3 . The method of claim 1 , wherein the first metal material used to fill the first opening in the first dielectric layer located in the logic area is ferromagnetic and the second metal material used to fill the second opening in the second dielectric layer located in the memory area is non-ferromagnetic.
4 . The method of claim 1 , wherein forming the first bottom interconnect and the second bottom interconnect in the first dielectric layer further includes:
simultaneously forming a first opening in the first dielectric layer located in the logic area and a second opening in the dielectric layer corresponding to the first bottom interconnect and second bottom interconnect, respectively; and
simultaneously filling the first opening and the second opening with the first metal material.
5 . The method of claim 4 , further comprising:
selectively removing the first metal material filling the second opening in the first dielectric layer located in the memory area; and
refilling the second opening in the first dielectric layer located in the memory area with a second metal material.
6 . The method of claim 1 , wherein forming the memory device pillar above the second bottom interconnect located in the memory area further includes:
depositing an insulator on top of the first dielectric layer and on top of the first and second bottom interconnects located within the logic and memory areas, respectively, of the semiconductor device;
forming the metal plug within the insulator; and
forming a spacer surrounding a sidewall of the memory device pillar.
7 . The method of claim 6 , wherein forming the spacer surrounding the sidewall of the memory device pillar includes:
simultaneously depositing a spacer material layer onto exposed surfaces of the logic and memory areas, respectively, of the semiconductor device; and
performing a partial etch back of the spacer insulator material deposited onto the exposed surfaces of the memory area to form the spacer surrounding the sidewall of the memory device pillar.
8 . The method of claim 6 , further comprising:
depositing a second dielectric layer on top of any exposed surfaces in the logic and memory areas, respectively, of the semiconductor device; and
simultaneously forming a first top interconnect in the second dielectric layer located in the logic area and a second top interconnect in the second dielectric layer located in the memory area, wherein:
the first top interconnect is formed on top of the first bottom interconnect located in the logic area; and
the second top interconnect is formed on top of the memory device pillar located in the memory area.
9 . A semiconductor device, comprising:
a first bottom interconnect formed within a first dielectric layer and located within a logic area of the semiconductor device;
a second bottom interconnect formed within the first dielectric layer and located within a memory area of the semiconductor device;
a metal plug formed on top of the second bottom interconnect located within the memory area of the semiconductor device; and
a memory device pillar formed on top of the metal plug, wherein:
a first metal material used to form the first bottom interconnect located in the logic area is different than a second metal material used to form the second bottom interconnect located in the memory area.
10 . The semiconductor device of claim 9 , wherein the first metal material used to form the first bottom interconnect located in the logic area and the second metal material used to form the second bottom interconnect located in the memory area are non-ferromagnetic.
11 . The semiconductor device of claim 9 , wherein the first metal material used to form the first bottom interconnect located in the logic area is ferromagnetic and the second metal material used to form the second bottom interconnect located in the memory area is non-ferromagnetic.
12 . The semiconductor device of claim 9 , wherein the first bottom interconnect and the second bottom interconnect are local interconnects.
13 . The semiconductor device of claim 9 , wherein a top surface of the first bottom interconnect formed in the first dielectric layer and located in the logic area is substantially coplanar with a top surface of the second bottom interconnect formed in the first dielectric layer and located in the memory area.
14 . The semiconductor device of claim 9 , further comprising a metal liner separating the first and second bottom interconnects from the first dielectric layer, respectively.
15 . The semiconductor device of claim 9 , further comprising:
an insulator layer formed on top of the first dielectric layer and on top of the first and second bottom interconnects located within the logic and memory areas, respectively, of the semiconductor device; and
a spacer surrounding a sidewall of the memory device pillar,
wherein the metal plug is formed within the insulator layer.
16 . The semiconductor device of claim 15 , wherein a layer of spacer material used to form the spacer surrounding the sidewall of the memory device pillar remains on top of exposed surfaces of the logic and memory areas, except for a top surface of the memory device pillar.
17 . The semiconductor device of claim 15 , wherein a layer of spacer material used to form the spacer surrounding the sidewall of the memory device pillar remains at a field area of the logic area and the memory area, respectively.
18 . The semiconductor device of claim 15 , further comprising:
a second dielectric layer formed on top of exposed surfaces of the logic and memory areas, respectively, of the semiconductor device;
a first top interconnect formed within the second dielectric layer and the insulator layer, and on top of the first bottom interconnect located in the logic area; and
a second top interconnect formed within the second dielectric layer, and on top of the memory device pillar and at least a portion of the spacer surrounding the sidewall of the memory device pillar.
19 . The semiconductor device of claim 18 , wherein a bottom surface of the first top interconnect formed within the second dielectric layer and located within the logic area is substantially coplanar with a bottom surface of the second top interconnect formed within the second dielectric layer and located within the memory area.
20 . The semiconductor device of claim 18 , wherein the first top interconnect formed within the second dielectric layer and located within the logic area is formed from a same metal material as the second top interconnect formed within the second dielectric layer and located within the memory area.