Semiconductor device
A semiconductor device including a semiconductor chip having a first conduction element; a substrate having second and third conduction elements; and external connection elements configured to form an electrical path between the second and third conduction elements via the first conduction element.
1. A system, comprising:
a board;
a semiconductor device coupled to the board, the semiconductor device comprising:
a semiconductor chip having a face comprising a plurality of contact elements, and the semiconductor chip having a backside opposite the face;
a mold mass on the backside of the semiconductor chip and along sides of the semiconductor chip, the mold mass having a top surface co-planar with the face of the semiconductor chip;
a first dielectric layer having a first side opposite a second side, the first side of the first dielectric layer on the face of the chip and on the mold mass;
a plurality of contacts within the first dielectric layer;
a metallization layer on the second side of the first dielectric layer, the metallization layer comprising a plurality of conducting elements, the plurality of conducting elements coupled directly to the plurality of contact elements of the face of the semiconductor chip by the plurality of contacts, wherein a first one and a second one of the plurality of conducting elements of the metallization layer are electrically coupled to one another by one of the plurality of contact elements of the face of the semiconductor chip, and wherein a third one of the of the plurality of conducting elements of the metallization layer is between the first one and the second one of the plurality of conducting elements of the metallization layer;
a second dielectric layer on the metallization layer;
a plurality of vias in the second dielectric layer, the plurality of vias directly coupled to the plurality of conducting elements of the metallization layer, wherein the plurality of vias is both within and outside of the footprint of the chip; and
a plurality of solder balls, wherein individual ones of the plurality of solder balls are electrically coupled to corresponding individual ones of the plurality of vias, and wherein the plurality of solder balls is both within and outside of the footprint of the chip.
2. The system of claim 1 , wherein the plurality of solder balls is on the second dielectric layer, and the plurality of solder balls is directly coupled to the plurality of vias.
3. The system of claim 1 , wherein the first dielectric layer comprises silicone.
4. The system of claim 1 , wherein the second dielectric layer comprises polyimide.
5. A system, comprising:
a board;
a semiconductor device coupled to the board, the semiconductor device comprising:
a semiconductor chip having a face comprising a plurality of contact elements, and the semiconductor chip having a backside opposite the face;
a mold mass on the backside of the semiconductor chip and along sides of the semiconductor chip;
a first dielectric layer having a first side opposite a second side, the first side of the first dielectric layer on and in contact with the face of the chip and on and in contact with the mold mass;
a plurality of contacts within the first dielectric layer;
a metallization layer on the second side of the first dielectric layer, the metallization layer comprising a plurality of conducting elements, the plurality of conducting elements coupled directly to the plurality of contact elements of the face of the semiconductor chip by the plurality of contacts, wherein a first one and a second one of the plurality of conducting elements of the metallization layer are electrically coupled to one another by one of the plurality of contact elements of the face of the semiconductor chip, and wherein a third one of the of the plurality of conducting elements of the metallization layer is between the first one and the second one of the plurality of conducting elements of the metallization layer;
a second dielectric layer on the metallization layer;
a plurality of vias in the second dielectric layer, the plurality of vias directly coupled to the plurality of conducting elements of the metallization layer, wherein the plurality of vias is both within and outside of the footprint of the chip; and
a plurality of solder balls, wherein individual ones of the plurality of solder balls are electrically coupled to corresponding individual ones of the plurality of vias, and wherein the plurality of solder balls is both within and outside of the footprint of the chip.
6. The system of claim 5 , wherein the plurality of solder balls is on the second dielectric layer, and the plurality of solder balls is directly coupled to the plurality of vias.
7. The system of claim 5 , wherein the first dielectric layer comprises silicone.
8. The system of claim 5 , wherein the second dielectric layer comprises polyimide.
9. A system, comprising:
a board;
a semiconductor device coupled to the board, the semiconductor device comprising:
a semiconductor chip having a face comprising a plurality of contact elements, and the semiconductor chip having a backside opposite the face;
a mold mass on the backside of the semiconductor chip and along sides of the semiconductor chip, wherein the mold mass is not on the face of the semiconductor chip;
a first dielectric layer having a first side opposite a second side, the first side of the first dielectric layer on the face of the chip and on the mold mass;
a plurality of contacts within the first dielectric layer;
a metallization layer on the second side of the first dielectric layer, the metallization layer comprising a plurality of conducting elements, the plurality of conducting elements coupled directly to the plurality of contact elements of the face of the semiconductor chip by the plurality of contacts, wherein a first one and a second one of the plurality of conducting elements of the metallization layer are electrically coupled to one another by one of the plurality of contact elements of the face of the semiconductor chip, and wherein a third one of the of the plurality of conducting elements of the metallization layer is between the first one and the second one of the plurality of conducting elements of the metallization layer;
a second dielectric layer on the metallization layer;
a plurality of vias in the second dielectric layer, the plurality of vias directly coupled to the plurality of conducting elements of the metallization layer, wherein the plurality of vias is both within and outside of the footprint of the chip; and
a plurality of solder balls, wherein individual ones of the plurality of solder balls are electrically coupled to corresponding individual ones of the plurality of vias, and wherein the plurality of solder balls is both within and outside of the footprint of the chip.
10. The system of claim 9 , wherein the plurality of solder balls is on the second dielectric layer, and the plurality of solder balls is directly coupled to the plurality of vias.
11. The system of claim 9 , wherein the first dielectric layer comprises silicone.
12. The system of claim 9 , wherein the second dielectric layer comprises polyimide.