Reactive organosilicon thixotropic agent, organosilicon encapsulation adhesive and LED element
Disclosed is a reactive organosilicon thixotropic agent, an organosilicon encapsulation adhesive containing the reactive organosilicon thixotropic agent, and an LED element encapsulated by using the organosilicon encapsulation adhesive. In the present disclosure, the reactive organosilicon thixotropic agent is prepared by a hydrosilylation reaction of cyclic hydrogen-containing polysiloxane or branched hydrogen-containing polysiloxane that contains phenyl with unsaturated polyether under the condition that the ratio of the total quantity of SiH bonds in the cyclic hydrogen-containing polysiloxane or the branched hydrogen-containing polysiloxane to the total quantity of olefinic bonds in the unsaturated polyether is greater than 1, can provides the organosilicon encapsulation adhesive with stable thixotropic property, high transparency, and excellent mechanical property and adhesion property at the same time, and thus an LED element having great encapsulation property is manufactured.
1. A reactive organosilicon thixotropic agent, characterized in being prepared by a hydrosilylation reaction of cyclic hydrogen-containing polysiloxane as represented by formula (1) or branched hydrogen-containing polysiloxane as represented by formula (2) with unsaturated polyether as represented by formula (3) under the condition that the ratio of the total quantity of SiH bonds in the cyclic hydrogen-containing polysiloxane or the branched hydrogen-containing polysiloxane to the total quantity of olefinic bonds in the unsaturated polyether is greater than 1, wherein
(R 1a R 1b SiO 2/2 ) n1 (R 1c HSiO 2/2 ) n2 formula (1)
in formula (1), R 1a , R 1b and R 1c are each independently one of a hydrogen atom, methyl and phenyl, and at least one of R 1a , R 1b and R 1c is phenyl; and n1 is an integer from 0 to 10, and n2 is an integer from 2 to 10;
(R 2a R 2b R 2c SiO 1/2 ) n3 (R 2d R 2e HSiO 1/2 ) n4 (R 2f R 2g SiO 2/2 ) n5 (R 2h SiO 3/2 ) n6 (SiO 4/2 ) n7 formula (2)
in formula (2), R 2a , R 2b , R 2c , R 2d , R 2e , R 2f , R 2g and R 2h are each independently one of a hydrogen atom, methyl and phenyl, and at least one of R 2a , R 2b , R 2c , R 2d , R 2e , R 2f , R 2g and R 2h is phenyl; and n3 is an integer from 0 to 10, n4 is an integer from 2 to 10, n5 is an integer from 0 to 10, n6 is an integer from 0 to 10, n7 is an integer from 0 to 10, and n6+n7≥1; and
AO(BO) m H formula (3)
in formula (3), A is one of ethenyl, propenyl, allyl, acrylyl and methacryloyl, B is independently one of alkylenes from C1 to C10, and m is an integer from 1 to 50.
2. The reactive organosilicon thixotropic agent according to claim 1 , characterized in that the cyclic hydrogen-containing polysiloxane has a structure as represented by the following formula (1-1):
(R 1c HSiO 2/2 ) n2 formula (1-1)
wherein in formula (1-1), R 1c is each independently a hydrogen atom, methyl and phenyl, and at least one R 1c is phenyl; and n2 is an integer from 3 to 10.
3. The reactive organosilicon thixotropic agent according to claim 1 , characterized in that the branched hydrogen-containing polysiloxane has a structure as represented by the following formula (2-1):
(R 2d R 2e HSiO 1/2 ) n4 (R 2h SiO 3/2 ) n6 formula (2-1)
wherein in formula (2-1), R 2d , R 2e and R 2h are each independently one of a hydrogen atom, methyl and phenyl, and at least one of R 2d , R 2e and R 2h is phenyl; and n4 is an integer from 2 to 10, and n6 is an integer from 1 to 10.
4. The reactive organosilicon thixotropic agent according to claim 1 , characterized in that, in formula (3), A is allyl, and B is one of alkylenes from C1 to C4.
5. An organosilicon encapsulation adhesive, characterized by containing:
(A) organic polysiloxane, each molecule of which has at least two SiVi bonds and contains phenyl;
(B) hydrogen-containing polysiloxane, each molecule of which has at least two SiH bonds and contains phenyl;
(C) a hydrosilylation reaction catalyst;
(D) a filler; and
(E) the reactive organosilicon thixotropic agent according to claim 1 .
6. The organosilicon encapsulation adhesive according to claim 5 , characterized in that the filler (D) is one or more of silicon dioxide, magnesium oxide, aluminium oxide, zinc oxide and titanium oxide.
7. The organosilicon encapsulation adhesive according to claim 5 , characterized in that the particle size of the filler (D) is 1 nm to 500 nm.
8. The organosilicon encapsulation adhesive according to claim 5 , characterized in that the BET specific surface area of the filler (D) is 100 m 2 /g to 800 m 2 /g.
9. The organosilicon encapsulation adhesive according to claim 5 , characterized by containing:
50 to 90 percent by mass of the organic polysiloxane (A);
1 to 40 percent by mass of the hydrogen-containing polysiloxane (B);
0.1 ppm to 500 ppm of the hydrosilylation reaction catalyst (C);
0.5 to 20 percent by mass of the filler (D);
0.05 to 10 percent by mass of the reactive organosilicon thixotropic agent (E);
0 to 10 percent by mass of a tackifier (F); and
0 to 5 percent by mass of a hydrosilylation reaction inhibitor (G).
10. An LED element, characterized by being prepared by encapsulation using the organosilicon encapsulation adhesive of claim 5 .