Multi-typed integrated passive device (IPD) components and devices and processes implementing the same
A transistor device includes a metal submount; a transistor die arranged on said metal submount; a first integrated passive device (IPD) component that includes a first substrate arranged on said metal submount; and a second integrated passive device (IPD) component that includes a second substrate arranged on the metal submount. Additionally, the first substrate is a different material from the second substrate.
1. A transistor device, comprising,
a metal submount;
a transistor die arranged on said metal submount;
a first integrated passive device (IPD) component comprising a first substrate arranged on said metal submount; and
a second integrated passive device (IPD) component comprising a second substrate arranged on the metal submount,
wherein the first substrate is a different material from the second substrate;
wherein the first integrated passive device (IPD) component comprises a printed circuit board (PCB) substrate; and
wherein the second integrated passive device (IPD) component comprises a silicon carbide (SiC) substrate.
2. The transistor device according to claim 1 wherein the second integrated passive device (IPD) component comprises a cut out portion configured to receive the second integrated passive device (IPD) component.
3. The transistor device according to claim 1 wherein the first integrated passive device (IPD) component comprises a surface mount device mounted to a top surface of the first integrated passive device (IPD) component.
4. The transistor device according to claim 3 wherein the first substrate comprises at least one via configured to make an electrical connection between the surface mount device and the metal submount.
5. The transistor device according to claim 1 wherein the first integrated passive device (IPD) component is arranged between the second integrated passive device (IPD) component and the metal submount.
6. The transistor device according to claim 1 wherein the second integrated passive device (IPD) component is arranged between the first integrated passive device (IPD) component and the metal submount.
7. The transistor device according to claim 1 further comprising a third IPD component comprising a third substrate,
wherein the first substrate is a same material as the third substrate.
8. The transistor device according to claim 7 wherein the third IPD component comprises a surface mount device mounted to a top surface of the third IPD component.
9. The transistor device according to claim 8 wherein the third substrate comprises at least one via configured to make an electrical connection between the surface mount device and the metal submount.
10. The transistor device according to claim 7 wherein the third IPD component comprises a printed circuit board (PCB) integrated passive device (IPD).
11. The transistor device according to claim 7 wherein the third IPD component comprises a printed circuit board (PCB) substrate.
12. The transistor device according to claim 1 wherein the transistor die comprises one or multiple LDMOS transistor die.
13. The transistor device according to claim 1 wherein the transistor die comprises one or multiple GaN based HEMTs.
14. The transistor device according to claim 1 wherein the transistor device comprises a plurality of the transistor die.
15. The transistor device according to claim 14 wherein the plurality of the transistor die are configured in a Doherty configuration.
16. A transistor device, comprising,
a metal submount;
a transistor die arranged on said metal submount;
a first integrated passive device (IPD) component comprising a first substrate arranged on said metal submount; and
a second integrated passive device (IPD) component comprising a second substrate arranged on the metal submount,
wherein the first substrate is a different material from the second substrate;
wherein the first integrated passive device (IPD) component comprises a printed circuit board (PCB) integrated passive device (IPD); and
wherein the second integrated passive device (IPD) component comprises a silicon carbide (SiC) integrated passive device (IPD).
17. A process for implementing a transistor device, comprising,
providing a metal submount;
arranging a transistor die on said metal submount;
arranging a first integrated passive device (IPD) component comprising a first substrate on said metal submount; and
arranging a second integrated passive device (IPD) component comprising a second substrate on the metal submount,
wherein the first substrate is a different material from the second substrate;
wherein the first integrated passive device (IPD) component comprises a printed circuit board (PCB) substrate; and
wherein the second integrated passive device (IPD) component comprises a silicon carbide (SiC) substrate.
18. The process for implementing a transistor device according to claim 17 wherein:
the first integrated passive device (IPD) component comprises a printed circuit board (PCB) integrated passive device (IPD); and
the second integrated passive device (IPD) component comprises a silicon carbide (SiC) integrated passive device (IPD).
19. The process for implementing a transistor device according to claim 17 further comprising forming a cut out portion in the second integrated passive device (IPD) component configured to receive the second integrated passive device (IPD) component.
20. The process for implementing a transistor device according to claim 17 further comprising mounting a surface mount device to a top surface of the first integrated passive device (IPD) component.
21. The process for implementing a transistor device according to claim 20 further comprising forming at least one via in the first substrate configured to make an electrical connection between the surface mount device and the metal submount.
22. The process for implementing a transistor device according to claim 17 further comprising arranging the first integrated passive device (IPD) component between the second integrated passive device (IPD) component and the metal submount.
23. The process for implementing a transistor device according to claim 17 further comprising arranging the second integrated passive device (IPD) component between the first integrated passive device (IPD) component and the metal submount.
24. The process for implementing a transistor device according to claim 17 further comprising providing a third IPD component comprising a third substrate,
wherein the first substrate is a same material as the third substrate.
25. The process for implementing a transistor device according to claim 24 further comprising mounting a surface mount device to a top surface of the third IPD component.
26. The process for implementing a transistor device according to claim 25 further comprising forming at least one via in the third substrate configured to make an electrical connection between the surface mount device and the metal submount.
27. The process for implementing a transistor device according to claim 24 wherein the third IPD component comprises a printed circuit board (PCB) integrated passive device (IPD).
28. The process for implementing a transistor device according to claim 24 wherein the third IPD component comprises a printed circuit board (PCB) substrate.
29. The process for implementing a transistor device according to claim 17 wherein the transistor die comprises one or multiple LDMOS transistor die.
30. The process for implementing a transistor device according to claim 17 wherein the transistor die comprises one or multiple GaN based HEMTs.
31. The process for implementing a transistor device according to claim 17 wherein the transistor device comprises a plurality of the transistor die.
32. The process for implementing a transistor device according to claim 31 wherein the plurality of the transistor die are configured in a Doherty configuration.