Temperature-reporting oscillator
In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.
1. An integrated circuit assembly comprising:
a first die having a microelectromechanical system (MEMS) resonator and a temperature sensor, the first die to output a first signal representing a sensed frequency of the MEMS resonator and a second signal representing sensed temperature, wherein the sensed frequency of the MEMS resonator is characterized by a temperature dependent variation;
a second die in electrical communication with the first die, the second die having
circuitry operable to drive operation of the MEMS resonator, to receive the first signal and generate dependent thereon a clock signal having a frequency that is a function of the sensed frequency of the MEMS resonator, and to generate digital temperature information as a function of the second signal, and
storage for correction data to compensate for the temperature dependent variation;
a first pin to externally output the clock signal; and
one or more second pins that are to output the digital information representing temperature and timing correction information for the clock signal based on the correction data.
2. The integrated circuit assembly of claim 1 wherein:
the MEMS resonator is a first MEMS resonator;
the temperature sensor comprises a second MEMS resonator; and
the second signal is dependent on a temperature-dependent difference in operation between the first MEMS resonator and the second MEMS resonator.
3. The integrated circuit assembly of claim 1 wherein the one or more second pins comprise a common pin that is to output each of the digital information representing the temperature and the timing correction information, on a multiplexed basis.
4. The integrated circuit assembly of claim 3 wherein the second die comprises a receiver, and wherein the integrated circuit assembly is to output at least one of the digital information representing the temperature and the timing correction information on a basis that is demand driven and that is triggered in response to a request received by the receiver, via the one or more second pins.
5. The integrated circuit assembly of claim 1 wherein the second die comprises a receiver, the receiver being operably coupled to each of the storage and to a pin of the one or more second pins, and wherein the integrated circuit assembly is to receive programming of calibration data on a post-packaging basis.
6. The integrated circuit assembly of claim 1 wherein the timing correction information comprises polynomial coefficients corresponding to the temperature dependent variation.
7. The integrated circuit assembly of claim 1 wherein the circuitry is further operable to identify a specific temperature, dependent on the second signal, and wherein the timing correction information output via the one or more second pins comprises an offset for the clock signal at the specific temperature.
8. The integrated circuit assembly of claim 7 wherein the correction data comprises polynomial coefficients and wherein the circuitry is to calculate the offset dependent on the specific temperature and the polynomial coefficients.
9. The integrated circuit assembly of claim 1 wherein the integrated circuit assembly comprises a multifunction interface that is in electrical communication with the one or more second pins, the multifunction interface to output at least one of the timing correction information and the digital temperature information via a common pin of the one or more second pins, the multifunction interface comprising a receiver that is to receive an externally-supplied run-time control signal via the common pin.
10. The integrated circuit assembly of claim 1 wherein the circuitry is operable to receive programming, via the one or more second pins, an externally-selected interval for output of the digital temperature information, and wherein the circuitry is operable to cause the output of the digital temperature information, via the one or more second pins, according to the externally-selected interval.
11. The integrated circuit assembly of claim 1 , embodied as a four pin form factor package, the wherein the one or more second pins consist of a single, common pin.
12. The integrated circuit assembly of claim 1 wherein the one or more second pins comprise a pin that is to output, at run-time, the digital temperature information as a packet-based repeating digital signal.
13. An integrated circuit assembly comprising:
a first die having a microelectromechanical system (MEMS) resonator and a temperature sensor, the first die to output a first signal representing a sensed frequency of the MEMS resonator and a second signal representing sensed temperature, wherein the sensed frequency of the MEMS resonator is characterized by a temperature dependent variation;
a second die in electrical communication with the first die, the second die having
circuitry operable to drive operation of the MEMS resonator, to receive the first signal and generate dependent thereon a clock signal having a frequency that is a function of the sensed frequency of the MEMS resonator, and to generate digital temperature information as a function of the second signal, and
storage for correction data to compensate for the temperature dependent variation;
a first pin to externally output the clock signal; and
one or more second pins operable to
receive at least one command on a post-packaging basis to control operation of the integrated circuit assembly,
output the digital information representing temperature, in the form of a packet-based repeating digital signal, and
output timing correction information for the clock signal based on the correction data.
14. The integrated circuit assembly of claim 13 wherein:
the MEMS resonator is a first MEMS resonator;
the temperature sensor comprises a second MEMS resonator; and
the second signal is dependent on a temperature-dependent difference in operation between the first MEMS resonator and the second MEMS resonator.
15. The integrated circuit assembly of claim 13 wherein the one or more second pins comprise a common pin that is to output the timing correction information and that is to receive the at least one command, on a multiplexed basis.
16. The integrated circuit assembly of claim 13 wherein the second die comprises a receiver, and wherein the integrated circuit assembly is to output at least one of the digital information representing the temperature and the timing correction information on a basis that is demand driven and is triggered in response to a request received by the receiver, via the one or more second pins.
17. The integrated circuit assembly of claim 13 wherein the second die comprises a receiver, the receiver being operably coupled to each of the storage and to a pin of the one or more second pins, and wherein the integrated circuit assembly is to receive programming of calibration data on a post-packaging basis.
18. The integrated circuit assembly of claim 13 wherein the at least command comprises a command to program, received via the one or more second pins, an externally-selected interval for output of the digital temperature information, and wherein the circuitry is operable to cause the output of the digital temperature information, via the one or more second pins, according to the externally-selected interval.
19. An integrated circuit package comprising:
an assembly comprising
a first die having a microelectromechanical system (MEMS) resonator and a temperature sensor, the first die to output a first signal representing a sensed frequency of the MEMS resonator and a second signal representing sensed temperature, wherein the sensed frequency of the MEMS resonator is characterized by a temperature dependent variation;
a second die in electrical communication with the first die, the second die having
circuitry operable to drive operation of the MEMS resonator, to receive the first signal and generate dependent thereon a clock signal having a frequency that is a function of the sensed frequency of the M EMS resonator, and to generate digital temperature information as a function of the second signal, and
storage for correction data to compensate for the temperature dependent variation;
four pins to be electrically connected to an external structure, wherein the four pins comprise a first pin to externally output the clock signal, a second pin to output the digital information representing temperature and to output timing correction information for the clock signal based on the correction data, a third pin to receive a first power supply potential and a fourth pin to receive a second power supply potential.
20. The integrated circuit package of claim 19 wherein the integrated circuit package is to receive least one externally-supplied, run-time control signal on a post-packaging basis and wherein the integrated circuit package further comprises circuitry to control operation of the integrated circuit assembly according to the at least one externally-supplied, run-time control signal.