Ceramic electronic device and manufacturing method of the same
A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of three or more of internal electrode layers are alternately stacked. The three or more of internal electrode layers include Ni and Sn. An internal electrode layer having a larger Sn concentration is closer to an outermost edge in a stacking direction than an internal electrode layer having a smaller Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of internal electrode layers.
1. A ceramic electronic device comprising:
a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of three or more of internal electrode layers are alternately stacked,
wherein the three or more of internal electrode layers include Ni and Sn,
wherein an internal electrode layer having a larger Sn concentration is closer to an outermost edge in a stacking direction than an internal electrode layer having a smaller Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of internal electrode layers,
wherein a Sn concentration of internal electrode layers from a center internal electrode layer to an outermost internal electrode layer in the stacking direction gradually gets larger or gets larger in steps from the center internal electrode layer to the outermost internal electrode layer in the stacking direction.
2. The ceramic electronic device as claimed in claim 1 , wherein a Sn concentration of an outermost one of the plurality of internal electrode layers is the highest, in a part of the plurality of internal electrode layers from a center one of the plurality of internal electrode layers to an outermost one of the plurality of internal electrode layers.
3. The ceramic electronic device as claimed in claim 1 , wherein a Sn concentration of internal electrode layers from an outermost edge to a center side in the stacking direction is higher than a Sn concentration of remaining internal electrode layers on the center side of the stacking direction.
4. The ceramic electronic device as claimed in claim 1 , wherein each thickness of the three or more of internal electrode layers is 1 μm or less.
5. The ceramic electronic device as claimed in claim 1 , wherein the Sn concentration of the three or more of internal electrode layers is 10 at % or less.
6. The ceramic electronic device as claimed in claim 1 , wherein the Sn concentration of the three or more of internal electrode layers is 0.1 at % or more.
7. The ceramic electronic device as claimed in claim 1 , wherein a ratio of a maximum Sn concentration with respect to a minimum Sn concentration is more than 1 and 100 or less, in the three or more of internal electrode layers.
8. The ceramic electronic device as claimed in claim 1 , wherein a Sn concentration near each interface between the plurality of internal electrode layers and the plurality of dielectric layers in the plurality of internal electrode layers is higher than that of a center portion of the plurality of internal electrode layers in a thickness direction.