IP Library › Granted Patent US 11,706,848
Granted Patent B2
US 11,706,848 · App. 17/576,019 · Granted Jul 18, 2023

Multifunctional assemblies

Inventors: Seth S. Kessler (Newton, MA); Gregory A. Thomas (San Francisco, CA); Christopher T. Dunn (Salem, MA); Michael Borgen (Wilmington, MA); Brian L. Wardle (Lexington, MA)
Assignee: Metis Design Corporation
H05B6/101H01B1/04H01C13/00H01G4/33H05B1/0236H05B3/145H05B3/20H05B3/265H05B3/267H05B2203/011H05B2203/013H05B2203/016H05B2203/017H05B2214/02H05B2214/04
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Quick Facts
Patent No.
US 11,706,848
App. No.
17/576,019
Granted
Jul 18, 2023
Kind
B2
Abstract

A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

Claims (21)

1. A system comprising:

an object formed incorporating a multifunctional assembly having a stacked, layered structure, the multifunctional assembly including:

a first resistive layer,

a first conductive layer electrically coupled to and stacked on the first resistive layer to distribute an electrical current through the first resistive layer, and

a first pair of insulating layers including a first insulating layer stacked on and disposed across the first resistive layer and a second insulating layer stacked on and disposed across the first conductive layer on a side opposing the first resistive layer; and

a control system including a processor and LCR (inductance, capacitance, resistance) circuitry couplable to the first resistive layer via the conductive layer and configured or programmed to directly or indirectly measure or detect a change in a structural configuration, structural integrity or structural health characteristic of the object, wherein the change in the structural configuration, structural integrity or structural health characteristic of the object is indicated by a change in electrical conductivity or resistance across the first resistive layer.

2. The system of claim 1 , wherein the change in the structural integrity or structural health characteristic of the object is indicative of damage to the object.

3. The system of claim 1 , wherein the change in the structural configuration, of the object is related to a shape of the object.

4. The system of claim 1 , wherein the change in the structural integrity or structural health characteristic of the object includes a response to an acoustic wave.

5. The system of claim 1 , wherein the control system is further configured to measure or detect an impact to the object based on propagation of an acoustic wave across the object.

6. The system of claim 1 , wherein the change in the structural configuration, structural integrity or structural health characteristic includes spatial data relating to the change in the structural configuration, structural integrity or structural health characteristic of the object.

7. The system of claim 6 , wherein the spatial data includes one or more of location, size, shape or distribution of the change in the structural configuration, structural integrity or structural health characteristic.

8. The system of claim 1 ,

wherein a shape of the object is configurable, and

wherein the control system provides feedback on the shape of the object.

9. The system of claim 1 , wherein the first resistive layer includes a carbon nanotube (CNT) network.

10. The system of claim 1 , further comprising a first plurality of electrical breakout points to couple the first conductive layer to an environment exterior to the first and second insulating layers.

11. The system of claim 10 , wherein the first plurality of electrical breakout points includes contactless coupling elements, and the contactless coupling elements include inductive charging or receiving elements.

12. The system of claim 10 , wherein the inductive charging or receiving elements include RFID.

13. The system of claim 10 , wherein the first plurality of electrical breakout points extend through the second insulating layer to an environment exterior to the multifunctional assembly.

14. The system of claim 1 , further comprising an aperture extending through the second insulating layer to the conductive layer to provide electrical connectivity thereto.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2022
From: KESSLER, SETH S.; THOMAS, GREGORY A.; DUNN, CHRISTOPHER T.; BORGEN, MICHAEL; WARDLE, BRIAN L.
To: METIS DESIGN CORPORATION
Reel/Frame 060655/0381 →
Continuity (5)
Continuation 14678066 · Apr 3, 2015
Provisional Application 62057728 · Sep 30, 2014
Provisional Application 61978152 · Apr 10, 2014
Provisional Application 61978154 · Apr 10, 2014
Related Publication 20220191978A1 · Jun 16, 2022
Cited By (1)
US 12,351,323