Multi-mic earphone design and assembly
At least one exemplary embodiment is directed to a method of earphone manufacturing with an ear canal microphone, ambient sound microphone and a speaker, where the earphone has parts that have been 3D printed.
1. A method of earphone fabrication comprising:
selecting a standardized electronic package;
selecting a CAD earphone housing design from a set of multiple designs that are not customized to a specific user's ear geometry, wherein the multiple designs, available for selection, are only designs that are designed to accept the selected standardized electronic package, wherein the standard electronic package includes an electronic package housing, a processor, and a speaker, a first microphone configured to sample an ambient environment around the earphone, and a second microphone configured so that when the standard electronic package is inserted into the earphone housing the second microphone is configured to sample an acoustic channel in the earphone housing that sample's a user's ear canal when the earphone is inserted into the user's ear;
converting the selected CAD earphone housing design into a 3D printer format file;
sending the 3D printer format file to a 3D printer to have earphone parts 3D printed;
assembling the earphone parts to form an earphone housing, wherein the earphone housing has a first, second and third part, wherein the first, second and third parts are configured to fit together encompassing the standardized electronic package, wherein the first part is flexible with a Shore A less than 65 and contains a stent, wherein the second part has a Shore A greater than 65 and contains openings for user interfaces, and wherein the third part connects the first part with the second part; and
inserting the standard electronic package into the earphone housing to form the earphone, wherein the earphone housing includes a stent configured to accept and eartip.
2. The method according to claim 1 , wherein the earphone parts include a housing.
3. The method according to claim 1 , wherein the electronic package includes:
memory, wherein the first and second microphones are positioned on opposite sides of the standard electronic package.
4. The method according to claim 1 , wherein the first microphone and second microphone are attached to a common printed circuit board (PCB).
5. The method according to claim 4 , wherein the speaker is attached to the PCB.
6. The method according to claim 5 , wherein a battery is connected to the PCB.
7. The method according to claim 6 , further comprising:
testing the earphone connection to a phone.
8. The method according to claim 7 , further comprising:
choosing an eartip for the earphone.