IP Library Granted Patent US 12,247,103
Granted Patent B2
US 12,247,103 · App. 17/577,358 · Granted Mar 11, 2025

Polyimide precursor solution, porous polyimide film, separator for secondary battery, and secondary battery

Inventors: Kosaku Yoshimura (Kanagawa, JP); Yasunobu Kashima (Kanagawa, JP); Takahiro Ishizuka (Kanagawa, JP)
Assignee: FUJIFILM Business Innovation Corp.
C08G73/1032B29C67/202H01M50/403H01M50/414H01M50/491B29K2079/08B29K2105/0002
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Quick Facts
Patent No.
US 12,247,103
App. No.
17/577,358
Granted
Mar 11, 2025
Kind
B2
Abstract

A polyimide precursor solution includes a polyimide precursor having a glass transition temperature Tg of equal to or higher than 300° C. after imidization, an aqueous solvent containing water, an organic amine compound, and resin particles having a volume average particle size of equal to or less than 100 nm.

Claims (38)

1. A polyimide precursor solution comprising:

a polyimide precursor having a glass transition temperature Tg of equal to or higher than 300° C. after imidization;

an aqueous solvent containing water;

an organic amine compound; and

resin particles having a volume average particle size of 40 nm or more and 95 nm or less.

2. The polyimide precursor solution according to claim 1 ,

wherein the polyimide precursor is a polymer of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound.

3. The polyimide precursor solution according to claim 2 ,

wherein the aromatic tetracarboxylic dianhydride contains equal to or more than 80 mol % of biphenyltetracarboxylic dianhydride, and

the aromatic diamine compound contains equal to or more than 80 mol % of p-phenylenediamine.

4. The polyimide precursor solution according to claim 1 ,

wherein a weight average molecular weight of the resin particles is equal to or more than 200,000.

5. The polyimide precursor solution according to claim 2 ,

wherein the weight average molecular weight of the resin particles is equal to or more than 200,000.

6. The polyimide precursor solution according to claim 3 ,

wherein the weight average molecular weight of the resin particles is equal to or more than 200,000.

7. The polyimide precursor solution according to claim 4 ,

wherein the weight average molecular weight of the resin particles is equal to or more than 300,000.

8. The polyimide precursor solution according to claim 5 ,

wherein the weight average molecular weight of the resin particles is equal to or more than 300,000.

9. The polyimide precursor solution according to claim 6 ,

wherein the weight average molecular weight of the resin particles is equal to or more than 300,000.

10. The polyimide precursor solution according to claim 1 ,

wherein each of the resin particles has a carboxy group on a surface of the resin particle.

11. The polyimide precursor solution according to claim 2 , further comprising:

a carboxy group on a surface of the resin particle.

12. The polyimide precursor solution according to claim 3 , further comprising:

a carboxy group on a surface of the resin particle.

13. The polyimide precursor solution according to claim 4 , further comprising:

a carboxy group on a surface of the resin particle.

14. The polyimide precursor solution according to claim 5 , further comprising:

a carboxy group on a surface of the resin particle.

15. The polyimide precursor solution according to claim 6 , further comprising:

a carboxy group on a surface of the resin particle.

16. The polyimide precursor solution according to claim 7 , further comprising:

a carboxy group on a surface of the resin particle.

17. The polyimide precursor solution according to claim 8 , further comprising:

a carboxy group on a surface of the resin particle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2022
From: YOSHIMURA, KOSAKU; KASHIMA, YASUNOBU; ISHIZUKA, TAKAHIRO
To: FUJIFILM BUSINESS INNOVATION CORP.
Reel/Frame 058674/0337 →
Priority Claims (1)
JP 2021-145585 · Sep 7, 2021 · national
Continuity (1)
Related Publication 20230079844A1 · Mar 16, 2023
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