Chamber body feedthrough for in chamber resistive heating element
A method and apparatus for providing uniform heating of substrates disposed within a processing chamber is provided. The apparatus includes one or more heating coils disposed in the processing chamber. The one or more heating coils are electrically coupled to a power source using heater rods. The heater rods are coupled to a socket on a distal end opposite the connection to the heating coils. The socket includes a feedthrough and a cooling plate configured to remove contaminants, such as methane, from the area surrounding the heater rod.
1. A heating system for substrate processing comprising:
a first heater comprising a continuous heating coil;
a first heater rod coupled to a first connection point of the first heater;
a second heater rod coupled to a second connection point of the first heater, wherein each of the first heater rod and the second heater rod are configured to be screwed onto the first heater and comprise a passage disposed therethrough;
a socket coupled to one of the first heater rod or the second heater rod at a distal end opposite the first heater, the socket comprising:
a feedthrough coupled to the first heater rod or the second heater rod and comprising a feedthrough inert gas passage fluidly coupled to the passage disposed through the first heater rod or the second heater rod; and
a cooling plate disposed around at least a portion of the feedthrough.
2. The heating system of claim 1 , wherein the socket is a first socket coupled to the first heater rod and a second socket is coupled to the second heater rod.
3. The heating system of claim 2 , wherein the second socket comprises:
a second feedthrough coupled to the second heater rod and comprising a second feedthrough inert gas passage fluidly coupled to a passage disposed through the second heater rod; and
a second cooling plate disposed around at least a portion of the second feedthrough.
4. The heating system of claim 1 , wherein the cooling plate further comprises:
a cooling plate inert gas passage formed between a first surface adjacent the feedthrough and a second surface;
a connection channel disposed in the first surface of the cooling plate and fluidly connecting the cooling plate inert gas passage and the feedthrough inert gas passage; and
a cooling channel disposed through the cooling plate.
5. The heating system of claim 1 , wherein the first heater rod further comprises:
a first threaded section on a first distal end configured to engage the first heater;
a second threaded section on a second distal end; and
a fastening section disposed between a central shaft of the first heater rod and the first threaded section.
6. The heating system of claim 1 , wherein the socket further comprises:
a power line coupled to the feedthrough; and
a purge gas source fluidly coupled to the feedthrough inert gas passage.
7. The heating system of claim 1 , wherein the feedthrough is a nickel feedthrough.
8. The heating system of claim 1 , wherein each of the first heater rod and the second heater rod are a carbon based material.
9. A socket assembly for coupling to a heater rod in a substrate processing chamber comprising:
a feedthrough comprising:
a cavity containing a female threaded section and configured to receive a heater rod; and
a feedthrough inert gas passage fluidly coupled to the cavity; and
a cooling plate disposed around at least a portion of the feedthrough and comprising:
a cooling plate inert gas passage;
a connection channel disposed in a surface of the cooling plate and fluidly connecting the cooling plate inert gas passage and the feedthrough inert gas passage; and
a cooling channel disposed through the cooling plate.
10. The socket assembly of claim 9 , wherein the feedthrough comprises a metal or a metal alloy.
11. The socket assembly of claim 10 , wherein the feedthrough comprises a nickel material.
12. The socket assembly of claim 9 , further comprising:
a power line coupled to the feedthrough; and
a purge gas source fluidly coupled to the feedthrough inert gas passage.
13. The socket assembly of claim 12 , wherein the power line is coupled to the feedthrough by a cap disposed around a protrusion on the feedthrough.
14. The socket assembly of claim 9 , further comprising a feedthrough insulator disposed adjacent a surface of the feedthrough.
15. The socket assembly of claim 14 , wherein the feedthrough insulator comprises a quartz, a glass, or a ceramic material.
16. The socket assembly of claim 14 , wherein the feedthrough insulator comprises a heater rod sealing ring disposed on an inside surface of the feedthrough insulator.
17. The socket assembly of claim 9 , wherein a first sealing ring and a second sealing ring are disposed on opposite sides of the connection channel and form a seal between the feedthrough and the cooling plate.
18. A heating system for substrate processing comprising:
a first heater comprising a continuous heating coil;
a first heater rod coupled to a first connection point of the first heater;
a second heater rod coupled to a second connection point of the first heater, wherein each of the first heater rod and the second heater rod comprise a passage disposed therethrough;
a socket coupled to one of the first heater rod or the second heater rod, the socket comprising:
a feedthrough coupled to the first heater rod or the second heater rod and comprising a feedthrough inert gas passage fluidly coupled to the passage disposed through the first heater rod or the second heater rod; and
a cooling plate disposed around at least a portion of the feedthrough, the cooling plate comprising a cooling plate inert gas passage fluidly coupled to the feedthrough inert gas passage and a cooling channel disposed through the cooling plate.
19. The heating system of claim 18 , wherein the first heater and at least a portion of the first heater rod and the second heater rod include a coating disposed thereon.
20. The heating system of claim 19 , wherein the coating comprises a silicon carbide (SiC) coating or a Pyrolytic Boron Nitride (pBN) coating.