IP Library Granted Patent US 11,711,624
Granted Patent B2
US 11,711,624 · App. 17/579,887 · Granted Jul 25, 2023

Image sensor and image sensing system including the same

Inventors: Kyoung Hwan Moon (Suwon-si, KR); Ji Hoon Kim (Suwon-si, KR); Young Jun Lee (Seoul, KR)
Assignee: Samsung Electronics Co., Ltd.
H04N25/46H01L27/1463H01L27/1464H01L27/14621H01L27/14627H01L27/14636H01L27/14645H04N25/11H04N25/75
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Quick Facts
Patent No.
US 11,711,624
App. No.
17/579,887
Granted
Jul 25, 2023
Kind
B2
Abstract

An image sensor includes a pixel defining pattern in a mesh form. A first division pattern divides a pixel area into two halves. A second division pattern divides the pixel area into two halves. A first diagonal division pattern divides the pixel area into two halves. A second diagonal division pattern divides the pixel area into two halves. First through eighth photodiodes are arranged in the pixel area.

Claims (72)

1. An image sensor, comprising:

a substrate:

a pixel defining pattern disposed within the substrate and formed in a mesh form, wherein the pixel defining pattern defines each of a plurality of pixel areas along the mesh form;

a first division pattern extending along a first direction for dividing at least one pixel area among the plurality of pixel areas into two half portions;

a second division pattern extending along a second direction for dividing the at least one pixel area into two half portions, wherein the second direction intersects the first direction;

a first diagonal division pattern extending along a first diagonal direction for dividing the at least one pixel area into two half portions, wherein the first diagonal direction intersects the first direction and the second direction;

a second diagonal division pattern extending along a second diagonal direction for dividing the at least one pixel area into two half portions, wherein the second diagonal direction intersects the first direction and the second direction, and the first diagonal direction;

first and second photodiodes disposed in the at least one pixel area and between the first division pattern and the first diagonal division pattern, wherein the first and second photodiodes are separated from each other via the first division pattern and the first diagonal division pattern;

third and fourth photodiodes disposed in the at least one pixel area, and between the second division pattern and the first diagonal division pattern, wherein the third and fourth photodiodes are separated from each other via the second division pattern and the first diagonal division pattern;

fifth and sixth photodiodes disposed in the at least one pixel area, and between the first division pattern and the second diagonal division pattern, wherein the fifth and sixth photodiodes are separated from each other via the first division pattern and the second diagonal division pattern; and

seventh and eighth photodiodes disposed in the at least one pixel area, and between the second division pattern and the second diagonal division pattern, wherein the seventh and eighth photodiodes are separated from each other via the second division pattern and the second diagonal division pattern.

2. The image sensor as claimed in claim 1 , wherein:

the first photodiode and the third photodiode are separated from each other via the first diagonal division pattern and are disposed adjacent to each other,

the second photodiode and the fourth photodiode are separated from each other via the first diagonal division pattern and are disposed adjacent to each other, and

in a first operation mode, a first binning operation is performed based on a first sensed signal generated from the first photodiode and a fourth sensed signal generated from the fourth photodiode, and a second binning operation is performed based on a second sensed signal generated from the second photodiode and a third sensed signal generated from the third photodiode.

3. The image sensor as claimed in claim 2 , wherein in the first operation mode, the first binning operation is performed on the first sensed signal and the fourth sensed signal and at a first time to output a first image signal, and the second binning operation is performed on the second sensed signal and the third sensed signal and at a second time to output a second image signal, wherein the second time is different from the first time.

4. The image sensor as claimed in claim 3 , wherein the image sensor further comprises a floating diffusion area for accumulating therein charges from the first to eighth sensed signals respectively generated from the first to eighth photodiodes.

5. The image sensor as claimed in claim 2 , wherein the image sensor further comprises a readout circuit for receiving first to fourth pixel signals respectively based on the first to fourth sensed signals, and

wherein in the first operation mode, the readout circuit performs a first analog binning operation on the first pixel signal and the fourth pixel signal at a first time to output a first image signal, and performs a second analog binning operation on the second pixel signal and the third pixel signal at the first time to output a second image signal.

6. The image sensor as claimed in claim 5 , further comprising:

a first floating diffusion area for accumulating therein charges of the first sensed signal generated from the first photodiode;

a second floating diffusion area for accumulating therein charges of the second sensed signal generated from the second photodiode;

a third floating diffusion area for accumulating therein charges of the third sensed signal generated from the third photodiode; and

a fourth floating diffusion area for accumulating therein charges of the fourth sensed signal generated from the fourth photodiode,

wherein the first to fourth floating diffusion areas are separated from each other via the first and second division patterns and the first and second diagonal division patterns.

7. The image sensor as claimed in claim 2 , wherein in a second operation mode different from the first operation mode, a first binning operation is performed based on the first sensed signal generated from the first photodiode and the third sensed signal generated from the third photodiode, and a second binning operation is performed based on the second sensed signal generated from the second photodiode and the fourth sensed signal generated from the fourth photodiode.

8. The image sensor as claimed in claim 2 , wherein in a third operation mode different from the first operation mode, a binning operation is performed based on the first sensed signal generated from the first photodiode, the second sensed signal generated from the second photodiode, the third sensed signal generated from the third photodiode, and the fourth sensed signal generated from the fourth photodiode.

9. The image sensor as claimed in claim 1 , further comprising a lens disposed to cover the first to eighth photodiode in a plan view of the image sensor.

10. The image sensor as claimed in claim 1 , wherein:

the image sensor further comprises a color filter grid formed in the same mesh form as the mesh form of the pixel defining pattern, at least a portion of the color filter grid overlapping the pixel defining pattern in a plan view of the image sensor,

the color filter grid defines an area in which a color filter is disposed, and

the color filter includes a green color filter.

11. An image sensor, comprising:

a substrate:

a pixel defining pattern disposed within the substrate and formed in a mesh form, wherein the pixel defining pattern defines each of a plurality of pixel areas along the mesh form;

a first division pattern extending along a first direction for dividing at least one pixel area among the plurality of pixel areas into two half portions;

a second division pattern extending along a second direction for dividing the at least one pixel area into two half portions, wherein the second direction intersects the first direction;

a first diagonal division pattern extending along a first diagonal direction for dividing the at least one pixel area into two half portions, wherein the first diagonal direction intersects the first direction and the second direction;

first and second photodiodes disposed in the at least one pixel area and between the first division pattern and the first diagonal division pattern, wherein the first and second photodiodes are separated from each other via the first division pattern and the first diagonal division pattern; and

third and fourth photodiodes disposed in the at least one pixel area, and between the second division pattern and the first diagonal division pattern, wherein the third and fourth photodiodes are separated from each other via the second division pattern and the first diagonal division pattern, wherein:

the first photodiode and the third photodiode are separated from each other via the first diagonal division pattern and are disposed adjacent to each other,

the second photodiode and the fourth photodiode are separated from each other via the first diagonal division pattern and are disposed adjacent to each other, and

in a first operation mode, a first binning operation is performed based on a first sensed signal generated from the first photodiode and a fourth sensed signal generated from the fourth photodiode, and a second binning operation is performed based on a second sensed signal generated from the second photodiode and a third sensed signal generated from the third photodiode.

12. The image sensor as claimed in claim 11 , further comprising:

a second diagonal division pattern extending along a second diagonal direction for dividing the at least one pixel area into two half portions, wherein the second diagonal direction intersects the first direction and the second direction, and the first diagonal direction;

fifth and sixth photodiodes disposed in the at least one pixel area, and between the first division pattern and the second diagonal division pattern, wherein the fifth and sixth photodiodes are separated from each other via the first division pattern and the second diagonal division pattern; and

seventh and eighth photodiodes disposed in the at least one pixel area, and between the second division pattern and the second diagonal division pattern, wherein the seventh and eighth photodiodes are separated from each other via the second division pattern and the second diagonal division pattern.

13. The image sensor as claimed in claim 12 , further comprising a lens disposed to cover the first to eighth photodiode in a plan view of the image sensor.

14. The image sensor as claimed in claim 11 , wherein in the first operation mode, the first binning operation is performed on the first sensed signal and the fourth sensed signal and at a first time to output a first image signal, and the second binning operation is performed on the second sensed signal and the third sensed signal and at a second time to output a second image signal, wherein the second time is different from the first time.

15. The image sensor as claimed in claim 11 , wherein the image sensor further comprises a readout circuit for receiving first to fourth pixel signals respectively based on the first to fourth sensed signals, and

wherein in the first operation mode, the readout circuit performs a first analog binning operation on the first pixel signal and the fourth pixel signal at a first time to output a first image signal, and performs a second analog binning operation on the second pixel signal and the third pixel signal at the first time to output a second image signal.

16. The image sensor as claimed in claim 11 , wherein in a second operation mode different from the first operation mode, a first binning operation is performed based on the first sensed signal generated from the first photodiode and the third sensed signal generated from the third photodiode, and a second binning operation is performed based on the second sensed signal generated from the second photodiode and the fourth sensed signal generated from the fourth photodiode.

17. An image sensing system, comprising:

an image sensor for outputting an image signal; and

an image signal processor connected to the image sensor for receiving and processing the image signal,

wherein the image sensor includes:

a substrate;

a pixel defining pattern disposed within the substrate and formed in a mesh form, wherein the pixel defining pattern defines each of a plurality of pixel areas along the mesh form;

a first division pattern extending along a first direction for dividing at least one pixel area among the plurality of pixel areas into two half portions;

a second division pattern extending along a second direction for dividing the at least one pixel area into two half portions, wherein the second direction intersects the first direction;

a first diagonal division pattern extending along a first diagonal direction for dividing the at least one pixel area into two half portions, wherein the first diagonal direction intersects the first direction and the second direction;

a second diagonal division pattern extending along a second diagonal direction for dividing the at least one pixel area into two half portions, wherein the second diagonal direction intersects the first direction and the second direction, and the first diagonal direction;

first and second photodiodes disposed in the at least one pixel area and between the first division pattern and the first diagonal division pattern, wherein the first and second photodiodes are separated from each other via the first division pattern and the first diagonal division pattern;

third and fourth photodiodes disposed in the at least one pixel area, and between the second division pattern and the first diagonal division pattern, wherein the third and fourth photodiodes are separated from each other via the second division pattern and the first diagonal division pattern;

fifth and sixth photodiodes disposed in the at least one pixel area, and between the first division pattern and the second diagonal division pattern, wherein the fifth and sixth photodiodes are separated from each other via the first division pattern and the second diagonal division pattern; and

seventh and eighth photodiodes disposed in the at least one pixel area, and between the second division pattern and the second diagonal division pattern, wherein the seventh and eighth photodiodes are separated from each other via the second division pattern and the second diagonal division pattern.

18. The image sensing system as claimed in claim 17 , wherein the first photodiode and the third photodiode are separated from each other via the first diagonal division pattern and are disposed adjacent to each other,

wherein the second photodiode and the fourth photodiode are separated from each other via the first diagonal division pattern and are disposed adjacent to each other, and

wherein in a first operation mode, a first binning operation is performed based on a first sensed signal generated from the first photodiode and a fourth sensed signal generated from the fourth photodiode, and a second binning operation is performed based on a second sensed signal generated from the second photodiode and a third sensed signal generated from the third photodiode.

19. The image sensing system as claimed in claim 18 , wherein in the first operation mode, the first binning operation is performed on the first sensed signal and the fourth sensed signal and at a first time to output a first image signal, and the second binning operation is performed on the second sensed signal and the third sensed signal and at a second time to output a second image signal, wherein the second time is different from the first time.

20. The image sensing system as claimed in claim 18 , wherein the image sensor further includes a readout circuit for receiving the first to fourth sensed signals and then outputting first to fourth image signals respectively based on the first to fourth sensed signals, and

wherein in the first operation mode, the image signal processor performs a first digital binning operation on the first image signal and the fourth image signal at a first time, and performs a second digital binning operation on the second image signal and the third image signal at the first time.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2022
From: MOON, KYOUNG HWAN; KIM, JI HOON; LEE, YOUNG JUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 058785/0780 →
Priority Claims (1)
KR 10-2021-0064095 · May 18, 2021 · national
Continuity (1)
Related Publication 20220377262A1 · Nov 24, 2022
Cited By (1)
US 12,225,302