Micro light emitting diode display and method of forming the same
The present disclosure provides a micro light emitting diode display including a metal substrate, a plurality of micro light emitting diode chips on the metal substrate, a plurality of light absorbing layers on the metal substrate between the micro light emitting diode chips, a light conversion layer above the micro light emitting diode chips, and a cover plate above the light conversion layer, where sidewalls of the micro light emitting diode chips are separated by a gap, and where a contact angle of the light absorbing layers is between 0 degree and 30 degrees.
1. A micro light emitting diode display, comprising:
a metal substrate;
a plurality of micro light emitting diode chips on the metal substrate, wherein sidewalls of the micro light emitting diode chips are separated by a gap;
a plurality of light absorbing layers on the metal substrate between the micro light emitting diode chips, wherein a water drop contact angle of the light absorbing layers is between 0 degree and 30 degrees;
a light conversion layer above the micro light emitting diode chips; and
a cover plate above the light conversion layer.
2. The micro light emitting diode display of claim 1 , wherein the light absorbing layers comprise a carbon black and anions from a thermal acid generator.
3. The micro light emitting diode display of claim 1 , wherein a wavelength absorbed by the light absorbing layers is between 380 nm and 780 nm.
4. The micro light emitting diode display of claim 1 , wherein the light absorbing layers have an absorbance no less than 99% in a wavelength range between 540 nm and 560 nm.
5. The micro light emitting diode display of claim 1 , wherein a thickness of the light absorbing layers is between 1 μm and 2 μm.
6. The micro light emitting diode display of claim 1 , wherein the light absorbing layers directly contact the sidewalls of the micro light emitting diode chips.
7. The micro light emitting diode display of claim 1 , wherein the gap separating the micro light emitting diode chips is between 0.5 μm and 10 μm.
8. The micro light emitting diode display of claim 1 , wherein the light absorbing layers do not cover the micro light emitting diode chips.
9. The micro light emitting diode display of claim 1 , wherein the light conversion layer comprises quantum dot layers and corresponding color filters.
10. The micro light emitting diode display of claim 9 , wherein the quantum dot layers transfer a blue light emitted by the micro light emitting diode chips into a red light or a green light.
11. The micro light emitting diode display of claim 1 , wherein the light absorbing layers comprises acidic substances produced from a thermal acid generator.
12. The micro light emitting diode display of claim 11 , wherein the thermal acid generator is selected from Diphenyl(4-(phenylthio)phenyl)sulfonium perfluorobutane sulfonate, Diphenyl(4-(phenylthio)phenyl)sulfonium 4-adamantanecarboxy-1,1,2,2,-tetrafluorobutane sulfonate, Diphenyl(4-(phenylthio)phenyl)sulfonium 3-hydroxy-4-adamantanecarboxyl-1,1,2,2-tetrafluorobutane sulfonate, Diphenyl(4-(phenylthio)phenyl)sulfonium adamantanyl-methoxycarbonyl-difluoromethane sulfonate, Diphenyl(4-(phenylthio)phenyl)sulfonium 3-hydroxyadamantanyl-methoxycarbonyl-difluoromethane sulfonate, or Diphenyl(4-(phenylthio)phenyl)sulfonium 4-dehydrocholate-1,1,2,2-tetrafluorobutane sulfonate.
13. The micro light emitting diode display of claim 1 , wherein the light absorbing layers are insoluble in non-polar organic solution.
14. The micro light emitting diode display of claim 1 , wherein a width of one of the light absorbing layers along a direction equals to a width of the gap separating the micro light emitting diode chips along the direction.
15. The micro light emitting diode display of claim 1 , wherein a thickness of one of the light absorbing layers along a direction perpendicular to a top surface of the metal substrate is thinner than a thickness of one of the micro light emitting diode chips alone the direction.
16. The micro light emitting diode display of claim 1 , wherein the micro light emitting diode chips emit light toward the metal substrate through the sidewalls.
17. The micro light emitting diode display of claim 1 , wherein a width of one of the micro light emitting diode chips along a direction is smaller than or equal to 30 μm, and a width of the gap separating the micro light emitting diode chips along the direction is smaller than or equal to 10 μm.
18. The micro light emitting diode display of claim 1 , wherein a top surface of the metal substrate is directly covered by the micro light emitting diode chips and the light absorbing layers.
19. The micro light emitting diode display of claim 1 , further comprising a transparent substrate between the micro light emitting diode chips and the light conversion layer and between the light absorbing layers and the light conversion layer.
20. The micro light emitting diode display of claim 1 , wherein the light conversion layer comprises a plurality of sub light conversion layers aligned with the micro light emitting diode chips, respectively, and wherein adjacent two of the sub light conversion layers correspond to lights with different wavelengths.