Three-way flow controller paths for single-phase and two-phase cooling in datacenter cooling systems

1. A datacenter cooling system comprising:

a first three-way flow controller associated with a single-phase fluid and a second three-way flow controller associated with a two-phase fluid, the first three-way flow controller to enable a first flow path of the single-phase fluid from a coolant distribution unit (CDU) to a cold plate or to enable a second flow path of the single-phase fluid to a heat exchanger to cool the two-phase fluid, wherein the two-phase fluid is used in the cold plate, the second three-way flow controller to enable a third flow path of the two-phase fluid to the cold plate or to enable a fourth flow path of the two-phase fluid to the heat exchanger, wherein each of the first three-way flow controller and the second three-way flow controller comprises a respective electronically-controlled mechanical device.

2. The datacenter cooling system of claim 1 , further comprising:

at least one processor associated with the first three-way flow controller and with the second three-way flow controller, the at least one processor to determine a cooling requirement associated with at least one computing device and to perform one of enabling the first flow path and disabling the second flow path, the third flow path, and the fourth flow path; enabling the second flow path and the fourth flow path and disabling the first flow path and the third flow path, wherein the two-phase fluid from the heat exchanger is provided to the cold plate as part of the fourth flow path; or enabling the third flow path and disabling the first flow path, the second flow path, and the fourth flow path.

3. The datacenter cooling system of claim 1 , wherein the second flow path and the fourth flow path are concurrently enabled to provide one of cooling for the two-phase fluid using the single-phase fluid or cooling of the single-phase fluid using the two-phase fluid.

4. The datacenter cooling system of claim 1 , further comprising:

a dual purpose cold plate adapted to comprise a first feature for cooling using the single-phase fluid and to comprise a second feature for cooling using the two-phase fluid.

5. The datacenter cooling system of claim 1 , further comprising:

at least one processor to determine a cooling requirement associated with at least one computing device or the cold plate, and to enable, using signals to the first three-way flow controller or the second three-way flow controller, one or more of the first flow path, the second flow path, the third flow path, or the fourth flow path.

6. The datacenter cooling system of claim 1 , further comprising:

at least one processor to determine a cooling requirement from a sensor input, wherein a first cooling requirement is to be addressed by the single-phase fluid from the first flow path, a second cooling requirement is to be addressed by the two-phase fluid from the third flow path, and a third cooling requirement is to be addressed by the two-phase fluid from the heat exchanger following exchange of heat enabled by the second flow path and the fourth flow path occurring concurrently.

7. The datacenter cooling system of claim 6 , wherein the first cooling requirement is higher than the second cooling requirement and wherein the third cooling requirement is more than the second cooling requirement and less than the first cooling requirement.

8. The datacenter cooling system of claim 6 , further comprising:

one or more neural networks to receive the sensor input and to infer the cooling requirement as the first cooling requirement, the second cooling requirement, or the third cooling requirement.

9. The datacenter cooling system of claim 1 , further comprising:

the heat exchanger located within a rack of the datacenter cooling system, the heat exchanger to receive the single-phase fluid from a first cooling manifold of the rack and to receive the two-phase fluid from a second cooling manifold of the rack, the heat exchanger to support a direct flow of the two-phase fluid to the cold plate or to support an indirect flow of the two-phase fluid to the cold plate, the indirect flow to occur via an outlet channel in the second cooling manifold that is different from an inlet channel in the second cooling manifold or to occur via a third cooling manifold.

10. The datacenter cooling system of claim 1 , further comprising:

at least one processor to enable concurrent cooling using the first three-way flow controller to enable the first flow path concurrently with the second three-way flow controller to enable the third flow path, the first flow path to comprise a coolant-based cold plate and the third flow path to comprise a refrigerant-based cold plate.

11. A processor comprising one or more circuits and to be associated with a first three-way flow controller and a second three-way flow controller, the one or more circuits to determine a cooling requirement of at least one cold plate or a computing device, and the processor to cause a response to the cooling requirement using one or more of the first three-way flow controller or the second three-way flow controller, wherein the first three-way flow controller is to enable a first flow path of a single-phase fluid from a coolant distribution unit (CDU) to the at least one cold plate or a second flow path for the single-phase fluid to flow to a heat exchanger, and wherein the second three-way flow controller is to enable a third flow path of a two-phase fluid used in the at least one cold plate or a fourth flow path of the two-phase fluid used in the heat exchanger cooled by the single-phase fluid, wherein each of the first three-way flow controller and the second three-way flow controller comprises a respective electronically-controlled mechanical device.

12. The processor of claim 11 , further comprising:

an output to provide signals for the first three-way flow controller and to the second three-way flow controller to enable one or more of the first flow path, the second flow path, the third flow path, and the fourth flow path.

13. The processor of claim 11 , further comprising:

an input to receive sensor inputs from a sensor associated with the at least one cold plate or the computing device, the sensor inputs used to determine the cooling requirement addressed by the single-phase fluid from the first flow path, the two-phase fluid from the third flow path, or by the two-phase fluid from the heat exchanger following exchange of heat enabled by the second flow path and the fourth flow path occurring concurrently.

14. The processor of claim 13 , further comprising:

one or more neural networks to receive the sensor inputs and to infer the cooling requirement.

15. The processor of claim 13 , further comprising:

at least one logic unit to determine the cooling requirement from the sensor inputs, wherein a first cooling requirement is addressed by the single-phase fluid from the first flow path, a second cooling requirement is addressed by the two-phase fluid from the third flow path, and a third cooling requirement is addressed by the two-phase fluid from the heat exchanger following exchange of heat enabled by the second flow path and the fourth flow path occurring concurrently.

16. A method for a datacenter cooling system, the method comprising:

enabling, using a first three-way flow controller associated with a single-phase fluid, a first flow path of the single-phase fluid from a coolant distribution unit (CDU) to a cold plate or a second flow path of the single-phase fluid to a heat exchanger to cool a two-phase fluid used in the cold plate; and

enabling, using a second three-way flow controller associated with the two-phase fluid, a third flow path of the two-phase fluid to the cold plate or a fourth flow path of the two-phase fluid to the heat exchanger, wherein each of the first three-way flow controller and the second three-way flow controller comprises a respective electronically-controlled mechanical device.

17. The method of claim 16 , further comprising:

determining, using at least one processor, a cooling requirement associated with at least one computing device; and

performing one of enabling the first flow path and disabling the second flow path, the third flow path, and the fourth flow path; enabling the second flow path and the fourth flow path and disabling the first flow path and the third flow path, wherein the two-phase fluid from the heat exchanger is provided to the cold plate as part of the fourth flow path; or enabling the third flow path and disabling the first flow path, the second flow path, and the fourth flow path.

18. The method of claim 16 , further comprising:

determining, using at least one processor, a cooling requirement from a sensor input, wherein a first cooling requirement is addressed by the single-phase fluid from the first flow path, a second cooling requirement is addressed by the two-phase fluid from the third flow path, and a third cooling requirement is addressed by the two-phase fluid from the heat exchanger following exchange of heat enabled by the second flow path and the fourth flow path occurring concurrently.

19. The method of claim 18 , further comprising:

one or more neural networks to receive the sensor input and to infer the cooling requirement as the first cooling requirement, the second cooling requirement, or the third cooling requirement.

20. The method of claim 16 , further comprising:

enabling, using at least one processor, concurrent cooling using the first three-way flow controller to enable the first flow path concurrently with the second three-way flow controller to enable the third flow path, the first flow path to comprise a coolant-based cold plate and the third flow path to comprise a refrigerant-based cold plate.