Multiferroic tunnel junction memory device and related methods
An electronic device may include a first electrode, a first magnetostrictive layer electrically coupled to the first electrode, a first ferroelectric layer above the first magnetostrictive layer, and a ferromagnetic layer above the first ferroelectric layer. The electronic device may further include a second electrode electrically coupled to the ferromagnetic layer, a second ferroelectric layer above the ferromagnetic layer, a second magnetostrictive layer above the second ferroelectric layer, and a third electrode electrically coupled to the second magnetostrictive layer. The first ferroelectric layer may be switchable between different polarization states responsive to a first voltage applied across the first and second electrodes, and the second ferroelectric layer may be switchable between different polarization states responsive to a second voltage applied across the second and third electrodes.
1. An electronic device comprising:
a first electrode;
a first magnetostrictive layer electrically coupled to the first electrode;
a first ferroelectric layer above the first magnetostrictive layer;
a ferromagnetic layer above the first ferroelectric layer;
a second electrode electrically coupled to the ferromagnetic layer;
a second ferroelectric layer above the ferromagnetic layer;
a second magnetostrictive layer above the second ferroelectric layer; and
a third electrode electrically coupled to the second magnetostrictive layer;
the first ferroelectric layer being switchable responsive to a first voltage applied across the first and second electrodes, and the second ferroelectric layer being switchable independently from the first ferroelectric layer responsive to a second voltage applied across the second and third electrodes;
the first and second ferroelectric layers each being switchable between first and second memory states and retaining a prior respective ferroelectric state.
2. The electronic device of claim 1 wherein the first and second magnetostrictive layers have fixed and opposite magnetic polarities.
3. The electronic device of claim 1 wherein the first and second magnetostrictive layers comprise at least one of Co, Fe, NiFe, MnAs, Fe 4 N, MnAl, Co 4 N, LSMO, SrRuO 2 , and CoFeB.
4. The electronic device of claim 1 wherein the ferromagnetic layer comprises at least one of Co, Fe, NiFe, MnAs, Fe 4 N, MnAl, Co 4 N, LSMO, SrRuO 2 , and CoFeB.
5. The electronic device of claim 1 wherein the first and second ferroelectric layers comprise at least one of BaTiO 3 , Ba 0.95 Sr 0.05 TiO 3 , Hf 0.5 Zr 0.5 O 2 , PbTiO 3 , YMnO 3 , BiFeO 3 , Si doped HfO 2 , and SrBi 2 TaO 9 .
6. The electronic device of claim 1 further comprising a substrate beneath the first electrode layer.
7. The electronic device of claim 6 wherein the substrate comprises at least one of SrTiO 3 , Si, SmScO 3 , and TbScO 3 .
8. The electronic device of claim 1 wherein the first and second ferroelectric layers are switchable between the different polarization states with a current draw of less than 10 mA.
9. The electronic device of claim 1 comprising electronic circuitry coupled to the first, second and third electrodes for operation as a memory device.
10. The electronic device of claim 9 wherein the memory device comprises a plurality of memory cells, each operable to store eight memory states.
11. A memory comprising:
a substrate; and
a plurality of memory cells above the substrate, each memory cell operable to store eight memory states and comprising
a first electrode,
a first magnetostrictive layer electrically coupled to the first electrode,
a first ferroelectric layer above the first magnetostrictive layer,
a ferromagnetic layer above the first ferroelectric layer,
a second electrode electrically coupled to the ferromagnetic layer,
a second ferroelectric layer above the ferromagnetic layer,
a second magnetostrictive layer above the second ferroelectric layer, and
a third electrode electrically coupled to the second magnetostrictive layer,
the first ferroelectric layer being switchable responsive to a first voltage applied across the first and second electrodes, and the second ferroelectric layer being switchable independently from the first ferroelectric layer responsive to a second voltage applied across the second and third electrodes, the first and second ferroelectric layers each being switchable between first and second memory states and retaining a prior respective ferroelectric state.
12. The memory of claim 11 wherein the first and second magnetostrictive layers have fixed and opposite magnetic polarities.
13. The memory of claim 11 wherein the first and second magnetostrictive layers comprise at least one of Co, Fe, NiFe, MnAs, Fe 4 N, MnAl, Co 4 N, LSMO, SrRuO 2 , and CoFeB.
14. The memory of claim 11 wherein the ferromagnetic layer comprises at least one of Co, Fe, NiFe, MnAs, Fe 4 N, MnAl, Co 4 N, LSMO, SrRuO 2 , and CoFeB.
15. The memory of claim 11 wherein the first and second ferroelectric layers comprise at least one of BaTiO 3 , Ba 0.95 Sr 0.05 TiO 3 , Hf 0.5 Zr 0.5 O 2 , PbTiO 3 , YMnO 3 , BiFeO 3 , Si doped HfO 2 , and SrBi 2 TaO 9 .
16. The memory of claim 11 wherein the substrate comprises at least one of SrTiO 3 , Si, SmScO 3 , and TbScO 3 .
17. A method for making an electronic device comprising:
forming a first magnetostrictive layer electrically coupled to a first electrode;
forming a first ferroelectric layer above the first magnetostrictive layer;
forming a ferromagnetic layer above the first ferroelectric layer;
forming a second electrode electrically coupled to the ferromagnetic layer;
forming a second ferroelectric layer above the ferromagnetic layer;
forming a second magnetostrictive layer above the second ferroelectric layer; and
forming a third electrode electrically coupled to the second magnetostrictive layer;
the first ferroelectric layer being switchable responsive to a first voltage applied across the first and second electrodes, and the second ferroelectric layer being switchable independently from the first ferroelectric layer responsive to a second voltage applied across the second and third electrodes;
the first and second ferroelectric layers each being switchable between first and second memory states and retaining a prior respective ferroelectric state.
18. The method of claim 17 wherein the first and second magnetostrictive layers have fixed and opposite magnetic polarities.
19. The method of claim 17 wherein the first and second magnetostrictive layers comprise at least one of Co, Fe, NiFe, MnAs, Fe 4 N, MnAl, CON, LSMO, SrRu 02 , and CoFeB.
20. The method of claim 17 wherein the ferromagnetic layer comprises at least one of Co, Fe, NiFe, MnAs, Fe 4 N, MnAl, Co 4 N, LSMO, SrRuO 2 , and CoFeB.
21. The method of claim 18 wherein the first and second ferroelectric layers comprise at least one of BaTiO 3 , Ba 0.95 Sr 0.05 TiO 3 , Hf 0.5 Zr 0.5 O 2 , PbTiO 3 , YMnO 3 , BiFeO 3 , Si doped HfO 2 , and SrBi 2 TaO 9 .
22. The method of claim 17 further forming the first electrode layer on a substrate.
23. The method of claim 22 wherein the substrate comprises at least one of SrTiO 3 , Si, SmScO 3 , and TbScO 3 .