Photo resist as opaque aperture mask on multispectral filter arrays
An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.
1. A method comprising:
forming an optical substrate by:
forming a first filter element comprising a first stack of filter layers arranged on a first filter element substrate;
forming a second filter element comprising a second stack of filter layers arranged on a second filter element substrate; and
bonding a sidewall of the first filter element to a sidewall of the second filter element;
depositing a first photoresist layer directly on a first surface of the optical substrate;
exposing portions of the first photoresist layer to light; and
developing the first photoresist layer to form a first aperture mask on the first surface of the optical substrate,
wherein no optical coating is placed between the first surface of the optical substrate and the first photoresist layer.
2. The method of claim 1 , wherein the first aperture mask is opaque.
3. The method of claim 1 , further comprising:
depositing a second photoresist layer directly on a second surface of the optical substrate that is opposite to the first surface of the optical substrate;
exposing portions of the second photoresist layer to light; and
developing the second photoresist layer to form a second aperture mask on the second surface of the optical substrate.
4. The method of claim 1 , wherein an adhesive is used to bond the sidewall of the first filter element to the sidewall of the second filter element.
5. The method of claim 4 , wherein the first aperture mask is arranged directly over the adhesive.
6. The method of claim 1 , wherein a dark mirror coating is not arranged between the first surface of the optical substrate and the first photoresist layer.
7. The method of claim 1 , wherein the first photoresist layer is photo-definable.
8. The method of claim 1 , wherein the first aperture mask defines a light entrance aperture on the first surface of the optical substrate.
9. A method comprising:
depositing a first photoresist layer directly on a first surface of an optical substrate, the optical substrate comprising a multi-spectral optical filter array that comprises a plurality of optical filter elements bonded together to form the multi-spectral optical filter array, wherein each optical filter element includes a filter layer stack;
exposing portions of the first photoresist layer to light; and
developing the first photoresist layer to form a first aperture mask on the first surface of the optical substrate,
wherein no optical coating is placed between the first surface of the optical substrate and the first photoresist layer.
10. The method of claim 9 , wherein the plurality of optical filter elements are bonded together using an adhesive, and wherein the first aperture mask is arranged directly on the adhesive.
11. The method of claim 9 , wherein a dark mirror coating is not present between the first surface of the optical substrate and the first photoresist layer.
12. The method of claim 9 , wherein the first aperture mask is opaque.
13. The method of claim 9 , further comprising:
depositing a second photoresist layer directly on a second surface of the optical substrate that is opposite to the first surface of the optical substrate;
exposing portions of the second photoresist layer to light; and
developing the second photoresist layer to form a second aperture mask on the second surface of the optical substrate.
14. The method of claim 13 , wherein the second aperture mask is opaque.
15. A method comprising:
depositing a first photoresist layer directly on a light entrance surface of an optical substrate, the optical substrate comprising a multi-spectral optical filter array that comprises a plurality of optical filter elements bonded together to form the multi-spectral optical filter array, wherein each optical filter element includes a filter layer stack;
exposing portions of the first photoresist layer to light; and
developing the first photoresist layer to form a first aperture mask on the light entrance surface of the optical substrate,
depositing a second photoresist layer directly on a light exit surface of the optical substrate that is opposite to the light entrance surface of the optical substrate;
exposing portions of the second photoresist layer to light; and
developing the second photoresist layer to form a second aperture mask on the light exit surface of the optical substrate,
wherein no optical coating such as a dark mirror coating is placed between the light entrance surface of the optical substrate and the first photoresist layer, and wherein no optical coating such as a dark mirror coating is placed between the light exit surface of the optical substrate and the second photoresist layer.
16. The method of claim 15 , wherein the plurality of optical filter elements are bonded together using an adhesive.
17. The method of claim 16 , wherein the first aperture mask is arranged directly on the adhesive, and wherein the second aperture mask is arranged directly on the adhesive.
18. The method of claim 15 , wherein the first and second aperture mask are arranged directly on boundaries between each optical filter element.
19. The method of claim 15 , wherein the first aperture mask and the second aperture mask are opaque.
20. The method of claim 15 , wherein each optical filter element comprises at least one slanted sidewall.