IP Library Granted Patent US 12,009,587
Granted Patent B2
US 12,009,587 · App. 17/585,821 · Granted Jun 11, 2024

Antenna module

Inventors: Hee Su Kim (Gyeonggi-do, KR); Gwan Woo Son (Gyeonggi-do, KR); Won Ro Lee (Gyeonggi-do, KR)
Assignee: KESPION CO., LTD.
H01Q1/38H01Q1/364H01Q1/526
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Quick Facts
Patent No.
US 12,009,587
App. No.
17/585,821
Granted
Jun 11, 2024
Kind
B2
Abstract

An antenna module according to an embodiment of the present disclosure enables the size of a wireless communication terminal to be reduced by the implementation, as a first antenna formed by an MID method and a second antenna formed on an FPCB, of the antenna module used in the wireless communication terminal. The antenna module is capable of performing a plurality of communication functions through a single antenna module by enabling the first antenna to function as a near-field communication (NFC) antenna and the second antenna to function as a magnetic secure transmission (MST) antenna.

Claims (21)

1. An antenna module comprising:

a first antenna formed on one surface of an injection-molded product;

a contact circuit formed on the other surface of the injection-molded product and electrically connected to the first antenna; and

a shielding layer formed on the other surface of the injection-molded product at a position corresponding to the first antenna and configured to at least partially overlap the first antenna formed on one surface of the injection-molded product to shield electromagnetic waves,

wherein the injection-molded product has a thickness greater than a sum of a thickness of the first antenna and a thickness of the shielding layer, so that the shielding layer is spaced apart from the first antenna by the thickness of the injection-molded product.

2. The antenna module of claim 1 , wherein the injection-molded product includes an antenna carrier or a case of a wireless communication terminal.

3. The antenna module of claim 2 , wherein the injection-molded product includes an antenna carrier mounted on a main board of a wireless communication terminal and having an opening area in which electronic components are installed,

the first antenna is formed on one surface of the antenna carrier in adjacent to the opening area of the antenna carrier, and

the contact terminal is configured to come into contact with a terminal of the main board.

4. The antenna module of claim 1 , further comprising a second antenna spaced apart from the first antenna and formed on one surface of a flexible printed circuit board (FPCB).

5. The antenna module of claim 4 , wherein the first antenna includes an antenna for Near Field Communication (NFC), and the second antenna includes an antenna for Magnetic Secure Transmission (MST).

6. The antenna module of claim 5 , wherein the shielding layer is formed on the other surface of the injection-molded product at a position corresponding to a position of the first antenna.

7. The antenna module of claim 4 , wherein a nano sheet layer is formed on the other surface of the second antenna.

8. The antenna module of claim 7 , wherein a protective film layer is formed on one surface of the second antenna.

9. The antenna module of claim 1 , wherein the shielding layer includes ferrite.

10. The antenna module of claim 1 , wherein the shielding layer is configured to correspond to an outer peripheral shape of the first antenna.

11. The antenna module of claim 1 , wherein the first antenna includes a first plating layer including Cu and a second plating layer including Ni.

12. The antenna module of claim 11 , wherein the first plating layer has a thickness of 10-15 μm, and the second plating layer has a thickness of 1-5 μm.

13. The antenna module of claim 1 , wherein a contact circuit is formed on the other surface of the injection-molded product of the first antenna, and

the first antenna and the contact circuit are electrically connected to each other.

14. The antenna module of claim 1 , wherein the first antenna and the contact circuit are connected to each other through a via hole.

Assignments (2)
CHANGE OF NAME Recorded May 19, 2022
From: EMW CO., LTD.
To: KESPION CO., LTD.
Reel/Frame 060121/0649 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2022
From: KIM, HEE SU; SON, GWAN WOO; LEE, WON RO
To: EMW CO., LTD.
Reel/Frame 058791/0142 →
Priority Claims (1)
KR 10-2020-0024872 · Feb 28, 2020 · national
Continuity (2)
Continuation In Part PCTKR2021002173 · Feb 22, 2021
Related Publication 20220173505A1 · Jun 2, 2022