IP Library › Granted Patent US 12,213,381
Granted Patent B2
US 12,213,381 · App. 17/587,012 · Granted Jan 28, 2025

Method for manufacturing vibration element

Inventors: Hiyori Sakata (Minowa, JP); Takuro Kobayashi (Minowa, JP); Ryuta Nishizawa (Nagano, JP); Keiichi Yamaguchi (Ina, JP); Shigeru Shiraishi (Ina, JP)
Assignee: SEIKO EPSON CORPORATION
H10N30/082H03H9/19H03H9/215
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Quick Facts
Patent No.
US 12,213,381
App. No.
17/587,012
Granted
Jan 28, 2025
Kind
B2
Abstract

A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm includes: a preparing step of preparing a crystal substrate; a protective film forming step of forming a protective film on the crystal substrate except for groove regions that are regions in which the grooves are formed; and a dry etching step of dry etching the crystal substrate through the protective film to form the grooves. The grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction.

Claims (11)

1. A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm, the method comprising:

a preparing step of preparing a crystal substrate on which a plurality of the vibration elements can be formed;

a protective film forming step of forming a protective film on the crystal substrate except for groove regions, inter-arm regions, and gap regions, the groove regions being regions in which the grooves are formed, the inter-arm regions being regions between a first region in which the first vibration arm is formed and a second region in which the second vibration arm is formed, and the gap regions being regions in which gaps between adjacent vibration elements of the plurality of vibration elements are formed; and

a dry etching step of dry etching the crystal substrate through the protective film, the dry etching step simultaneously forming the grooves and outer shapes of the vibration elements including the first vibration arm and the second vibration arm, wherein

the grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction, and

a distance between adjacent vibration elements among the plurality of vibration elements is larger than a width between the first vibration arm and the second vibration arm of the vibration element.

2. The method for manufacturing a vibration element according to claim 1 , wherein

the dry etching step includes a first dry etching step of simultaneously forming the grooves and the outer shapes of vibration elements on one main surface of the crystal substrate, and a second dry etching step of simultaneously forming the grooves and the outer shapes of vibration elements on another main surface of the crystal substrate.

3. The method for manufacturing a vibration element according to claim 2 , wherein

in the first dry etching step and the second dry etching step,

CHF 3 is used as an etching gas.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2022
From: SAKATA, HIYORI; KOBAYASHI, TAKURO; NISHIZAWA, RYUTA; YAMAGUCHI, KEIICHI; SHIRAISHI, SHIGERU
To: SEIKO EPSON CORPORATION
Reel/Frame 058805/0635 →
Priority Claims (2)
JP 2021-012856 · Jan 29, 2021 · national
JP 2021-137805 · Aug 26, 2021 · national
Continuity (1)
Related Publication 20220246835A1 · Aug 4, 2022
References Cited (4)
US 4384232A · Debely · 1983 [cited by examiner]
US 6791243B2 · Kawashima · 2004 [cited by examiner]
US 8156621B2 · Iwai · 2012 [cited by examiner]
JP 2007013382A · 2007 [cited by applicant]
Cited By (3)
US 12,489,412 US 12,580,543 US 12,581,860