Offset interposers for large-bottom packages and large-die package-on-package structures
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
1. A package, comprising:
an interconnect structure;
an interposer coupled to the interconnect structure, the interposer having a through hole therein, the interposer having a first plurality of conductive pads above a second plurality of conductive pads, and a plurality of conductive vias coupling the first plurality of conductive pads to the second plurality of conductive pads;
an electronic device in the through hole of the interposer, the electronic device coupled to the interconnect structure, and the electronic device having a lateral width;
a substrate over the interposer and over the electronic device; and
a die coupled to the substrate by a plurality of contacts, the die vertically over the electronic device, the die having a lateral width greater than and covering an entirety of the lateral width of electronic device, and the die vertically overlapping with the interposer, wherein the plurality of contacts is vertically between the die and the substrate, and wherein one or more of the plurality of contacts vertically overlaps with the electronic component.
2. The package of claim 1 , wherein the interposer is coupled to the interconnect structure by a plurality of solder balls.
3. The package of claim 1 , wherein the substrate is coupled to the interposer by a plurality of solder balls.
4. The package of claim 1 , wherein the interposer is coupled to the interconnect structure by a first plurality of solder balls, and wherein the substrate is coupled to the interposer by a second plurality of solder balls.
5. The package of claim 1 , wherein the interconnect structure has a lateral width, and wherein the substrate has a lateral width the same as the lateral width of the interconnect structure.
6. The package of claim 5 , wherein the interposer has a lateral width the same as the lateral width of the interconnect structure.
7. The package of claim 1 , wherein the interposer has a lateral width, and wherein the substrate has a lateral width the same as the lateral width of the interposer.
8. The package of claim 1 , wherein the substrate has a lateral width, and wherein the interposer has a lateral width the same as the lateral width of the substrate.
9. The package of claim 1 , wherein the lateral width of the die is less than a lateral width of the substrate.