Wiring board and method for manufacturing wiring board
A wiring board ( 10 ) includes a substrate ( 11 ) that is transparent, a wiring pattern region ( 20 ) disposed on the substrate ( 11 ) and having first-direction wiring lines ( 21 ), and a feeding unit ( 40 ) electrically connected to the first-direction wiring lines ( 21 ) of the wiring pattern region ( 20 ). Each first-direction wiring line ( 21 ) has a first region ( 26 ) positioned near the feeding unit ( 40 ) and a second region ( 27 ) that is a region other than the first region ( 26 ). A line width (W 3 ) of the first-direction wiring line ( 21 ) in the first region ( 26 ) is larger than a line width (W 1 ) of the first-direction wiring line ( 21 ) in the second region ( 27 ).
1 . A wiring board, comprising:
a substrate that is transparent;
a mesh-like wiring pattern region disposed on the substrate and having wiring lines; and
a feeding unit electrically connected to the wiring lines of the wiring pattern region and having a surface located on a same plane with a surface of the mesh-like wiring pattern region,
wherein the feeding unit has through holes or non-through holes,
wherein a pitch of the through holes or the non-through holes is 100 μm or more and 500 μm or less, and
wherein the pitch is a length of a metal portion between the through holes adjacent to each other, or a length of a metal portion between the non-through holes adjacent to each other.
2 . The wiring board according to claim 1 , wherein the through holes or the non-through holes are arranged in rows and columns at a surface of the feeding unit.
3 . The wiring board according to claim 1 , wherein the through holes or the non-through holes are disposed at equal intervals at least in one direction.
4 . The wiring board according to claim 1 , wherein a width of each through hole or each non-through hole is 50 μm or more and 500 μm or less.
5 . The wiring board according to claim 1 , wherein a protective layer is formed on the substrate so as to cover the wiring pattern region and the feeding unit.
6 . The wiring board according to claim 5 , wherein
the protective layer has protrusions that protrude toward the substrate, and the protrusions of the protective layer enter the through holes or the non-through holes of the feeding unit.
7 . The wiring board according to claim 1 , wherein a line width of each wiring line is in a range of 0.1 μm to 5.0 μm.
8 . The wiring board according to claim 1 , wherein the wiring pattern region functions as an antenna.
9 . The wiring board according to claim 1 , wherein an area of each through hole or each non-through hole or a pitch of the through holes or the non-through holes in a region of the feeding unit near the wiring pattern region is different from an area of each through hole or each non-through hole or a pitch of the through holes or the non-through holes in a region of the feeding unit away from the wiring pattern region.
10 . A method for manufacturing a wiring board, the method comprising:
a step of preparing a substrate that is transparent; and
a step of forming a mesh-like wiring pattern region having wiring lines and forming a feeding unit electrically connected to the wiring lines on the substrate, the wiring pattern region and the feeding unit being formed on the substrate and having a surface located on a same plane with a surface of the mesh-like wiring pattern region,
wherein the feeding unit has through holes or non-through holes,
wherein a pitch of the through holes or the non-through holes is 100 μm or more and 500 μm or less, and
wherein the pitch is a length of a metal portion between the through holes adjacent to each other, or a length of a metal portion between the non-through holes adjacent to each other.