Method for processing electronic/electrical device component scraps
Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.
1. A method for processing electronic and electrical device component scraps, comprising separating a substrate with lead wires contained in the electronic and electrical device component scraps by performing a wind power sorting at a wind velocity between 15 to 20 m/s by using a wind power sorting device which comprises a guide portion provided therein and being arranged such that an airflow which is brought into contact with the substrate with lead wires in a perpendicular direction to a lower surface of the substrate with lead wires, before sorting the electronic and electrical device component scraps by magnetic sorting.
2. The method for processing electronic and electrical device component scraps according to claim 1 , wherein the substrate with lead wires contained in the electronic and electrical device component scraps is separated so that the substrate with lead wires contained in objects to be processed supplied to the magnetic sorting is 10% by mass or less.
3. The method for processing electronic and electrical device component scraps according to claim 1 , wherein a wind velocity of the wind power sorting is 10 to 20% higher than a wind velocity at which plastics can be separated.
4. The method for processing electronic and electrical device component scraps according to claim 1 , wherein the electronic and electrical device component scraps before being subjected to the magnetic sorting are crushed using a shear type crusher or a hammer type crusher.
5. The method for processing electronic and electrical device component scraps according to claim 1 , further comprising performing eddy current sorting after the magnetic sorting.