Electronic control of a compressor, compressor and cooling equipment
The present invention refers to an electronic control ( 1 ) of a compressor ( 2 ), the electronic control ( 1 ) disposed in an encasement 5 ( 3 ), wherein the electronic control ( 1 ) comprises: a main board ( 4 ) associated to at least an auxiliary board ( 5,6,7 ), wherein one of the auxiliary boards ( 5,6,7 ) is a heat-generating board ( 7 ), wherein the heat-generating board ( 7 ) is disposed at a first distance (D 1 ) in relation to a first wall of the encasement (P 1 ), wherein the other auxiliary boards 0 ( 5.6 ) are disposed at least at a second distance (D 2 , D 3 ) in relation to the first wall of the encasement (P 1 ), wherein the first distance (D 1 ) is less than the second distance (D 2 ). A compressor ( 2 ) and a cooling equipment are also described.
1. An electronic control device ( 1 ) of a compressor ( 2 ), the electronic control device ( 1 ) disposed in an encasement ( 3 ), wherein the electronic control device ( 1 ) comprises:
a main board ( 4 ) associated to a plurality of auxiliary boards ( 5 , 6 , 7 ), wherein the electronic control device ( 1 ) is characterized in that:
one of the auxiliary boards ( 5 , 6 , 7 ) is a heat-generating board ( 7 ) that generates the most heat among the auxiliary boards ( 5 , 6 , 7 ), the heat-generating board ( 7 ) of one of the auxiliary boards ( 5 , 6 , 7 ) comprising a conducting adhesive ( 9 ),
a heat dissipator ( 10 ),
wherein the heat-generating board ( 7 ) is disposed at a first distance (D 1 ) in relation to a first wall of the encasement ( 3 ),
wherein the first wall of the encasement ( 3 ) comprises the heat dissipator ( 10 ),
wherein the other auxiliary boards ( 5 , 6 ) are disposed at least at a second distance (D 2 , D 3 ) in relation to the first wall of the encasement ( 3 ),
wherein the first distance (D 1 ) is less than the second distance (D 2 ),
wherein each auxiliary board ( 5 , 6 , 7 ) and the main board ( 4 ) comprises an operation face ( 4 a , 5 a , 6 a , 7 a ) and a track face ( 4 b , 5 b , 6 b , 7 b ), wherein the operation face ( 7 a ) of the heat-generating board ( 7 ) faces the first wall of the encasement ( 3 ) and the operation face ( 5 a , 6 a ) of the other auxiliary boards ( 5 , 6 ) faces a second wall of the encasement ( 3 ), wherein the first wall (P 1 ) is opposite the second wall (P 2 ),
wherein the auxiliary boards ( 5 , 6 , 7 ) are formed by:
a first auxiliary board ( 5 ) configured as a power board, a second auxiliary board ( 6 ) configured as a control board, and a third auxiliary board ( 7 ) configured as an inverter board, wherein the third auxiliary board ( 7 ) is the heat-generating board ( 7 );
wherein the third auxiliary board ( 7 ) comprises the conducting adhesive ( 9 ) on the operation face ( 7 a ), the conducting adhesive ( 9 ) configured to dissipate heat, through the first wall of the encasement ( 3 ), from the third auxiliary board ( 7 ) to the heat dissipator ( 10 );
wherein a busbar capacitor ( 80 ) is disposed on the operation face ( 4 a ) of the main board ( 4 );
wherein the first auxiliary board ( 5 ) and the second auxiliary board ( 6 ) are disposed between the busbar capacitor ( 80 ) and the third auxiliary board ( 7 );
wherein a capacitor ( 80 ′) is disposed on the operation face ( 5 a ) of the first auxiliary board ( 5 );
wherein a microprocessor ( 80 ″) is disposed on the operation face ( 6 a ) of the second auxiliary board ( 6 ).
2. The electronic control device ( 1 ) according to claim 1 , characterized in that an association between the auxiliary boards ( 5 , 6 , 7 ) and the main board ( 4 ) occurs by way of a soldering process.
3. The electronic control device ( 1 ) according to claim 1 , characterized in that the operation face ( 4 a , 5 a , 6 a , 7 a ) is the face of the auxiliary boards ( 5 , 6 , 7 ) and of the main board ( 4 ) which comprises a majority of electronic components ( 8 ) of the auxiliary boards ( 5 , 6 , 7 ) and the main board ( 4 ).
4. The electronic control device ( 1 ) according to claim 1 , characterized in that each auxiliary board ( 5 , 6 , 7 ) is disposed concurrently in relation to the main board ( 4 ).
5. The electronic control device ( 1 ) according to claim 4 , characterized in that at least one of the auxiliary boards ( 5 , 6 , 7 ) is disposed perpendicularly in relation to the main board ( 4 ).
6. The electronic control device ( 1 ) according to claim 5 , characterized in that the operation face ( 4 a ) of the main board ( 4 ) faces a third wall (P 3 ) of the encasement, the third wall (P 3 ) being adjacent to the first (P 1 ) and second wall (P 2 ) of the encasement.
7. The electronic control device ( 1 ) according to claim 6 , characterized in that the operation face ( 4 a ) of the main board ( 4 ) further faces the compressor ( 2 ).
8. The electronic control device ( 1 ) according to claim 7 , characterized in that the operation face of the second auxiliary board ( 6 a ) faces the track face of the first auxiliary board ( 5 b ) and the track face of the second auxiliary board ( 6 b ) faces the track face of the third auxiliary board ( 7 b ).
9. The electronic control device ( 1 ) according to claim 2 , characterized in that the soldering process is a wave soldering process.
10. The electronic control device ( 1 ) according to claim 1 , wherein the electronic control device ( 1 ) is disposed in the compressor ( 2 ), the compressor being provided for cooling equipment.
11. The electronic control device ( 1 ) according to claim 1 , wherein the electronic control device ( 1 ) is disposed in cooling equipment.