High efficiency die dicing and release
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
1. A method of creating a die release or scribe pattern for one or more dies in parallel batch process from a substrate comprising:
exposing at least one portion of a photosensitive glass substrate with the die release or scribe pattern with an activating UV energy source;
heating the photosensitive glass substrate to a heating phase for at least ten minutes above its glass transition temperature;
cooling the photosensitive glass substrate to transform at least part of the exposed photosensitive glass substrate to a crystalline material to form a glass-ceramic crystalline substrate;
coating an exposed region with a UV light blocking layer;
creating a passive component, filter, or other device to completion on a front of the substrate; and
etching away a ceramic phase of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution to release the die from the substrate.
2. The method of claim 1 , wherein the die release or scribe pattern is a rectangular, circular, elliptical, fractal or another-shape that outlines a shape of the passive component, filter, or other device.
3. The method of claim 1 , wherein the die release or scribe pattern is etched through to an adhesive backing.
4. The method of claim 1 , wherein the die release or scribe pattern is greater than a structure that is 5 μm to 250 μm wide.
5. The method of claim 1 , wherein the die release or scribe pattern has a greater number of dies per substrate than an equivalent substrate cut mechanically.
6. The method of claim 1 , wherein an edge of the released die has a surface roughness less than 5 μm.
7. The method of claim 1 , wherein an edge of the released die has a surface roughness less than 1 μm.
8. The method of claim 1 , wherein an edge of the released die has a non-normal angle from a surface of the die.
9. The method of claim 1 , wherein an edge of the released die has a non-normal angle from a surface of the die that is at least 1° and less than 30° from Normal to the surface of the die.
10. The method of claim 1 , wherein a top or bottom corner of the released die has a non-normal curvature from a surface of the die that is at least 1° to less than 30° from a surface of the die.
11. The method of claim 1 , wherein a width of one or more scribe lines is 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or ranges in between.
12. A method of creating a die release or scribe pattern for one or more dies in a parallel batch process from a substrate comprising:
masking a photosensitive glass substrate with the die release or scribe pattern;
exposing at least one portion of the photosensitive glass substrate as the die release or scribe pattern with an activating UV energy source;
heating the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature;
cooling the photosensitive glass substrate to transform at least part of the exposed photosensitive glass substrate to form a glass-ceramic crystalline portion of the photosensitive glass substrate;
coating an exposed region with a UV light blocking layer;
creating a passive component, filter, or other device to completion on a front of the substrate;
placing a weakly adhesive backing to a back side of the substrate;
etching away the glass-ceramic portion of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution that releases the die; and
removing the one or more dies from the weakly adhesive backing.
13. The method of claim 12 , wherein the die release or scribe pattern is a rectangular, circular, elliptical, fractal or another shape that outlines a shape of the passive component, filter, or other device.
14. The method of claim 12 , wherein the die release or scribe pattern is a can etch to the adhesive backing.
15. The method of claim 12 , wherein the die release or scribe pattern can be greater than structure that is 5 μm to 250 μm wide.
16. The method of claim 12 , wherein the die release or scribe pattern enables a greater number of dies per substrate.
17. The method of claim 12 , wherein an edge of the released die has a surface roughness less than 5 μm.
18. The method of claim 12 , wherein an edge of the released die has a surface roughness less than 1 μm.
19. The method of claim 12 , wherein an edge of the released die has a non-normal angle from a surface of the die.
20. The method of claim 12 , wherein an edge of the released die has a non-normal angle from a surface of at least 1° and less than 30° from Normal to the surface of the die.
21. The method of claim 12 , wherein a top or bottom corner of the released die has a non-normal curvature from the surface of at least 1° and less than 30° from the surface of the die.
22. The method of claim 12 , wherein a width of one or more scribe lines is 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or ranges in between.