Processing method and processing device for electronic/electrical device component scrap

1. A method for processing electronic and electrical device component scrap comprising:

a smelting raw material sorting step of sorting a processing raw material containing valuable metals processable in a smelting step from the electronic and electrical device component scrap; and

a preprocessing step of removing lump copper wire scrap contained in the electronic and electrical device component scrap using a parallel link robot before the smelting raw material sorting step,

wherein the smelting raw material sorting step comprises:

a first wind force sorting step for removing powdery materials and film-shaped component scraps in the electronic and electrical device component scrap; and

a second wind force sorting step for sorting the electrical device component scrap in which the powdery materials and the film-shaped component scraps are removed to concentrate light-weight materials containing substrates, synthetic resins, and parts on a light-weight material side and separate heavy-weight materials comprising metals on a heavy-weight material side,

and wherein the first wind force sorting step is performed as an initial step of the smelting raw metal sorting step and the lump copper wire scrap is removed in the preprocessing step before the smelting raw metal sorting step.

2. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the parallel link robot comprises one or more robot hands at an end portion of the parallel link robot, wherein each of the one or more robot hands comprises: holding portions having a pair of gripping portions for gripping the lump copper wire scrap at their ends; and a drive portion for driving the holding portions to adjust a distance between the gripping portions.

3. The method for processing electronic and electrical device component scrap according to claim 2 , wherein each of distal end portions of the gripping portions comprises a covering member.

4. The method for processing electronic and electrical device component scrap according to claim 1 ,

wherein the preprocessing step further comprises: an image recognition step of recognizing at least color and size of the lump copper wire scrap present in the electronic and electrical device component scrap before a step of removing the lump copper wire scrap,

wherein the lump copper wire scrap is removed by the parallel link robot, based on position information of the lump copper wire scrap obtained in the image recognition step.

5. The method for processing electronic and electrical device component scrap of claim 4 , further comprising:

conveying the electronic and electrical device component scrap on a conveying surface before performing the image recognition step.

6. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the parallel link robot discharges the lump copper wire scrap in a direction that is transverse to a conveying direction where the electronic and electrical device component scrap is conveyed.

7. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the smelting raw material sorting step further comprises at least one of a sieving step, a magnetic force sorting step, an eddy current sorting step, and an optical sorting step of optically sorting metal materials from non-metal materials.

8. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the smelting raw material sorting step further comprises:

a metal sorting step of sorting the light-weight materials comprising the substrates, the synthetic resins, and the parts to concentrate substrates containing valuable metals by using a metal sorter after the second wind force sorting step.

9. A device for processing electronic and electrical device component scrap, comprising:

a first wind force sorter configured to receive the electronic and electrical device component scrap and perform wind power sorting to remove powdery materials and film-shaped component scraps in the electronic and electrical device component scrap;

a second wind force sorter configured to receive the electrical device component scrap in which the powdery materials and the film-shaped component scraps are removed and configured to concentrate light-weight materials containing substrates, synthetic resins, and parts on a light-weight material side, and separate heavy-weight materials comprising metals on a heavy-weight material side;

a conveying device having a conveying surface which conveys the electronic and electrical device component scrap which is before introducing the first wind sorter;

an image recognition device which performs image-recognition processing of lump copper wire scrap contained in the electronic and electrical device component scrap conveyed on the conveying surface; and

a picking device which discharges the lump copper wire scrap on the conveying surface using a parallel link robot based on image recognition results obtained by the image recognition device.