MmWAVE antenna-filter module
An antenna-filter array module and method of manufacturing an antenna-filter array module are provided. One method of manufacturing includes bonding a low temperature co-fired ceramic, LTCC, tile having a plurality of antennas and corresponding filters to a first side of the module PCB via a first set of solder balls, a coefficient of thermal expansion, CTE, of the module PCB being within a predetermined amount of a CTE of the radio PCB. The method further includes cutting the LTCC tile into a plurality of reliability units after the bonding, each reliability unit having a size that is less than a predetermined largest reliable size.
1. A method of manufacturing an antenna-filter array module that includes at least two antenna elements on a low temperature co-fired ceramic, LTCC, tile couplable to a radio printed circuit board, PCB, in an antenna array, the method comprising:
soldering an LTCC tile having the at least two antenna elements to a first side of a module PCB, the soldering including soldering at first soldering sites lying between the LTCC tile and the module PCB, the module PCB having a size at least as great as a size of the LTCC tile;
cutting the LTCC tile into reliability issue free, RIF, units, each RIF unit having a size not greater than a predetermined largest reliable size; and
forming a plurality of second soldering sites configured to couple with the radio PCB on a second side of the module PCB opposite the first side of the module PCB.
2. The method of claim 1 , further comprising coupling the module PCB to the radio PCB, the coupling including soldering at the plurality of second soldering sites.
3. The method of claim 1 , wherein a difference between a coefficient of thermal expansion, CTE, of the module PCB and a CTE of the radio PCB is less than a predetermined amount.
4. The method of claim 1 , wherein the module PCB and the radio PCB are of the same material and have the same CTE.
5. The method of claim 1 , wherein a size of the module PCB is greater than an area of the LTCC tile.
6. The method of claim 1 , wherein the size of an RIF unit is a size of one antenna element.
7. The method of claim 1 , wherein the size of an RIF unit is a size of two rows of two antenna elements per row.
8. The method of claim 1 , wherein the size of an LTCC tile is N rows of M antenna elements per row, where N and M are integers.
9. The method of claim 1 , wherein a module PCB has a size of at least two RIF units.
10. The method of claim 1 , wherein the solder structures are solder balls or bumps.
11. A method of manufacturing an antenna-filter array module configured to be coupled to a radio printed circuit board, PCB, the antenna-filter array module having a module PCB having a first side on which a first set of solder balls are positioned and a having a second side on which a second set of solder balls are positioned, the method comprising:
bonding a low temperature co-fired ceramic, LTCC, tile having a plurality of antennas and corresponding filters to a first side of the module PCB via a first set of solder balls, a coefficient of thermal expansion, CTE, of the module PCB being within a predetermined amount of a CTE of the radio PCB; and
cutting the LTCC tile into a plurality of reliability units after the bonding, each reliability unit having a size that is less than a predetermined largest reliable size.
12. The method of claim 11 , wherein a size of the module PCB is a size of an LTCC tile.
13. The method of claim 11 , wherein the module PCB and the radio PCB are of the same material and have the same CTE.