Granted Patent B2

US 12,431,381 · App. 17/612,093 · Granted Sep 30, 2025

Inventors: Jeroen Van Den Brand (Goirle, NL); Gari Arutinov (Helmond, NL)

Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

H01L21/6835C09J5/06C09J7/35H01L25/0753H10H20/857C09J2301/16C09J2301/304C09J2301/416C09J2301/502H01L2221/68354H01L2221/68368H01L2221/68381H10H20/0364

Abstract

Claims (40)

1. A method of transferring components, the method comprising:

providing a first substrate with the components;

providing a second substrate with an adhesive layer comprising a hot melt adhesive material;

contacting, while the adhesive layer is in a melted state, the components on the first substrate with the adhesive layer on the second substrate;

letting the adhesive layer solidify, after the contacting, to form an adhesive connection between the components and the second substrate;

moving apart, after letting the adhesive layer solidify, the first substrate and the second substrate to affect a transfer of the components from the first substrate to the second substrate by using the adhesive connection of the adhesive layer; and

transferring, after the moving apart, at least a first subset of the components from the second substrate to a third substrate by radiating light onto at least a first set of adhesive regions of the adhesive layer holding the at least first subset of components,

wherein the light causes the adhesive material at the first set of adhesive regions to melt and thereby causes a release of the at least first subset of components for transfer to the third substrate,

wherein the light causes at least the first set of adhesive regions to melt and form one or more respective jets of melted adhesive material, and

wherein the at least first subset of components is transferred over a distance to the third substrate with the jets of melted adhesive material propelling the first subset of components from the second substrate towards the third substrate.

2. The method according to claim 1 , wherein during the transferring from the second substrate to the third substrate, the third substrate is disposed below the second substrate, and

wherein, during the transferring, the first subset of components falls in a non-contact manner over a distance from the second substrate to the third substrate.

3. The method according to claim 1 , wherein, during the transferring by radiating light, a distance between the components on the second substrate and a destination surface on the third substrate is less than twice a cross-section diameter of the components.

4. The method according to claim 1 , wherein the adhesive layer is configured to absorb at least thirty percent of the light received on an opposing surface of the second substrate, before the light reaches the components during the transferring.

5. The method according to claim 1 , wherein:

the first subset of components is arranged according to a first component layout on the second substrate;

the third substrate comprises corresponding recesses disposed at least at relative positions corresponding to the first component layout;

the second substrate and the third substrate are aligned to have the first subset of components suspended over the corresponding recesses without contacting the third substrate; and

the light is projected onto at least the first component layout on the second substrate to transfer the first subset of components across and into the corresponding recesses of the third substrate.

6. The method according to claim 1 , wherein:

the components on the second substrate are divided in different subsets including a second subset of components arranged according to a second component layout;

the third substrate comprises corresponding protrusions formed by non-recessed areas of the third substrate disposed at least at relative positions corresponding to the second component layout;

during aligning the second substrate and the third substrate, the second subset of components is in contact with the corresponding protrusions of the third substrate; and

after the transferring, the second subset of components remains attached to the second substrate.

7. The method according to claim 1 , wherein an electrically conductive material is applied to the components while the components are disposed on the third substrate.

8. The method according to claim 7 , wherein the components are transferred from the third substrate to a fourth substrate,

wherein the electrically conductive material is melted by a same light pulse as used for transferring the components for electrically connecting the components by the conductive material to the fourth substrate.

9. The method according to claim 1 , wherein the third substrate comprises a hot melt adhesive layer to hold the components after transfer.

10. The method according to claim 1 , wherein one or more of the substrates comprise alignment marks for relative alignment.

11. The method according to claim 9 , wherein the components are held by regions of the adhesive layer in respective recesses of the third substrate,

wherein electric circuit parts connected to the components are held by regions of the adhesive layer on respective protrusions of the third substrate, and

wherein the first subset of components connected to the electric circuit parts are transferred to a fourth substrate.

12. The method according to claim 11 , wherein the third substrate comprises a mask pattern that is used for exposing a photo-curable material on the fourth substrate.

13. The method according to claim 1 , wherein a second subset of components is selected for transfer during a second component transfer,

wherein the second component transfer is separate from a first component transfer of the first subset of components,

wherein the second component transfer comprises aligning the second substrate with a remaining second subset of components over the third substrate or another third substrate comprising recesses disposed at least at relative positions corresponding to the second component layout, and

wherein, during the second component transfer, light is projected onto at least the second component layout on the second substrate to transfer the second subset of components into the corresponding recesses.

14. The method according to claim 1 , wherein during a first component transfer, a first component is transferred from one donor substrate in a first recess on the third substrate,

wherein during subsequent a second component transfer, a different, second component is transferred from another donor substrate into a second recess, and

wherein the different first component and second component are transferred together from the third substrate to a fourth substrate.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (23)