Perovskite ink formulations

1. A perovskite ink comprising:

a first polar solvent, wherein the first polar solvent has a boiling point of 150° C. or more and a melting point of 30° C. or less; and

a perovskite precursor material mixed in the first polar solvent, wherein the concentration of the perovskite precursor material in the perovskite ink is in the range of 0.01 wt. % to 10 wt. %;

wherein the perovskite precursor material is a precursor material, which participates in a chemical reaction to assemble a perovskite light emitting material;

wherein the perovskite ink further comprises a second solvent, which is a non-polar solvent; and

wherein the boiling point of the first polar solvent is lower than the boiling point of the non-polar solvent.

2. The perovskite ink of claim 1 , wherein the first polar solvent has a boiling point of 200° C. or more.

3. The perovskite ink of claim 1 , wherein the boiling point of the second solvent is 200° C. or higher.

4. The perovskite ink of claim 1 , wherein the concentration of the second solvent in the perovskite ink is in the range of 0.01% wt. to 20% wt.

5. The perovskite ink of claim 1 , wherein the first polar solvent has a boiling point in the range of 150° C. to 300° C.

6. The perovskite ink of claim 5 , wherein the first polar solvent has a boiling point in the range of 200° C. to 300° C.

7. The perovskite ink of claim 6 , wherein the first polar solvent has a boiling point in the range of 225° C. to 300° C.

8. The perovskite ink of claim 7 , wherein the first polar solvent has a boiling point in the range of 250° C. to 300° C.

9. The perovskite ink of claim 1 , wherein the first polar solvent is selected from the group consisting of: dimethylformamide (DMF), dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), cyclohexanone, cyclohexanol, 2-aminoethanol (MEA), benzonitrile, ethylene glycol (EG), N-Methyl-2-Pyrrolidone (NMP), Gamma-Butyrolactone (GBL), Gamma-Valerolactone (GVL), formamide, 1,3-Dimethyl-2-Imidazolidinone (DMI), Hexamethylphosphoramide (HMPA), Propylene Carbonate (PC), Ethylene Carbonate (EC), N,N′-Dimethylpropyleneurea (DMPU), dihydrolevoglucosenone (cyrene), diethylene glycol (DG), sulfolane, and glycerol.

10. The perovskite ink of claim 1 , wherein the second solvent is acetophenone, amyl benzoate, anethole, 1,4-bezodioxane, benzyl acetone, benzyl butyl ether, 3-benzyl-4-heptanone, benzyl heptanoate, benzyl hexanoate, benzyl octanoate, benzyl valerate, bicyclohexyl, butoxy benzene, butyl benzoate, 1-butylnaphthalene, 1-butyl-[1,2,3,4-tetrahydro-naphthalene], butyl phenyl ether, cyclohexyl benzene, decylbenzene, dibenzyl ether, dicyclohexylmethane, 2,6-diethylnapthalene, 1,2-dimethoxybenzene, 1,3-dimethoxybenzene, 2,5-dimethoxytoluene, 1,2-dimethylnaphthalene, 1,2-dimethyl-3-propylbenzene, ethyl benzoate, ethyl cinnamate, 1-ethylnaphthalene, 4-ethylphenetole, 1-ethyl-3-propylbenzene, hexyl benzene, isopentyl benzoate, isopropyl cinnamate, methyl benzoate, nonylbenzene, o-isobutyl toluene, octylbenzene, octylbenzoate, p-anisaldehyde dimethyl acetal, pentaethylbenzene, 1,1,3,3,5-pentamethylindane, pentyl benzene, 3-phenoxytoluene, 4-(1-propenyl)-1,2-dimethoxybenzene, propiophenone, 1-propylnaphthalene, 1-sec-butylnaphthalene, 2,2,5,7-tetraethyltetraline, or 1,2,3,5-tetraethylbenzene.

11. The perovskite ink of claim 1 , wherein the perovskite precursor material is selected from any of the following: CH 3 NH 3 I and PbI 2 configured to assemble CH 3 NH 3 PbI 3 ; CH 3 NH 3 Br and PbBr 2 configured to assemble CH 3 NH 3 PbBr 3 ; CH 3 NH 3 Cl and PbCl 2 configured to assemble CH 3 NH 3 PbCl 3 ; CH(NH 2 ) 2 I and PbI 2 configured to assemble CH(NH 2 ) 2 PbI 3 ; CH(NH 2 ) 2 Br and PbBr 2 configured to assemble CH(NH 2 ) 2 PbBr 3 ; CH(NH 2 ) 2 Cl and PbCl 2 configured to assemble CH(NH 2 ) 2 PbCl 3 ; CsI and PbI 2 configured to assemble CsPbI 3 ; CsBr and PbBr 2 configured to assemble CsPbBr 3 ; CsCl and PbCl 2 configured to assemble CsPbCl 3 ; or any of these materials in which the divalent metal cation lead (Pb + ) is replaced with tin (Sn + ), copper (Cu + ) or europium (Eu + ).

12. The perovskite ink of claim 1 , wherein the perovskite precursor material is configured to assemble a perovskite material selected from any of the following: CH 3 NH 3 PbI 3-x Cl x ; CH 3 NH 3 PbI 3-x Br x ; CH 3 NH 3 PbCl 3-x Br x ; CH(NH 2 ) 2 PbI 3-x Br x ; CH(NH 2 ) 2 PbI 3-x Cl x ; CH(NH 2 ) 2 PbCl 3-x Br x ; CsPbI 3-x Cl x ; CsPbI 3-x Br x and CsPbCl 3-x Br x , where x is in the range of 0-3; or any of these materials in which the divalent metal cation lead (Pb + ) is replaced with tin (Sn + ), copper (Cu + ) or europium (Eu + ).

13. The perovskite ink of claim 1 , wherein the perovskite precursor material is selected from any of the following: C 10 H 7 CH 2 NH 3 I and PbI 2 configured to assemble (C 10 H 7 CH 2 NH 3 ) 2 PbI 4 ; C 10 H 7 CH 2 NH 3 Br and PbBr 2 configured to assemble (C 10 H 7 CH 2 NH 3 ) 2 PbBr 4 ; C 10 H 7 CH 2 NH 3 Cl and PbCl 2 configured to assemble (C 10 H 7 CH 2 NH 3 ) 2 PbCl 4 ; C 6 H 5 C 2 H 4 NH 3 I and PbI 2 configured to assemble (C 6 H 5 C 2 H 4 NH 3 ) 2 PbI 4 ; C 6 H 5 C 2 H 4 NH 3 Br and PbBr 2 configured to assemble (C 6 H 5 C 2 H 4 NH 3 ) 2 PbBr 4 ; C 6 H 5 C 2 H 4 NH 3 Cl and PbCl 2 configured to assemble (C 6 H 5 C 2 H 4 NH 3 ) 2 PbCl 4 ; or any of these materials in which the divalent metal cation lead (Pb + ) is replaced with tin (Sn + ), copper (Cu + ) or europium (Eu + ).

14. The perovskite ink of claim 1 , wherein the perovskite precursor material is configured to assemble a perovskite material with mixed halides selected from any of the following: (C 10 H 7 CH 2 NH 3 ) 2 PbI 4-x Cl x , (C 10 H 7 CH 2 NH 3 ) 2 PbI 4-x Br x , (C 10 H 7 CH 2 NH 3 ) 2 PbCl 4-x Br x , (C 6 H 5 C 2 H 4 NH 3 ) 2 PbI 4-x Cl x , (C 6 H 5 C 2 H 4 NH 3 ) 2 PbI 4-x Br x and (C 6 H 5 C 2 H 4 NH 3 ) 2 PbCl 4-x Br x , where x is in the range of 0-4; or any of these materials in which the divalent metal cation lead (Pb + ) is replaced with tin (Sn + ), copper (Cu + ) or europium (Eu + ).

15. The perovskite ink of claim 1 , wherein the perovskite precursor material is selected from any of the following: C 6 H 5 C 2 H 4 NH 3 Br, CH(NH 2 ) 2 Br and PbI 2 configured to assemble (C 6 H 5 C 2 H 4 NH 3 ) 2 (CH(NH 2 ) 2 PbBr 3 ) n-1 PbI 4 ; C 6 H 5 C 2 H 4 NH 3 Br, CH(NH 2 ) 2 Br and PbBr 2 configured to assemble (C 6 H 5 C 2 H 4 NH 3 ) 2 (CH(NH 2 ) 2 PbBr 3 ) n-1 PbBr 4 ; C 6 H 5 C 2 H 4 NH 3 Br, CH(NH 2 ) 2 Br and PbCl 2 configured to assemble (C 6 H 5 C 2 H 4 NH 3 ) 2 (CH(NH 2 ) 2 PbBr 3 ) n-1 PbCl 4 ; C 10 H 7 CH 2 NH 3 I, CH 3 NH 3 Br and PbI 2 configured to assemble (C 10 H 7 CH 2 NH 3 ) 2 (CH 3 NH 3 PbI 2 Br) n-1 PbI 4 ; C 10 H 7 CH 2 NH 3 I, CH 3 NH 3 Br and PbBr 2 configured to assemble (C 10 H 7 CH 2 NH 3 ) 2 (CH 3 NH 3 PbI 2 Br) n-1 PbBr 4 ; and C 10 H 7 CH 2 NH 3 I, CH 3 NH 3 Br and PbCl 2 configured to assemble (C 10 H 7 CH 2 NH 3 ) 2 (CH 3 NH 3 PbI 2 Br) n-1 PbCl 4 , where n is in the range of 2-10; or any of these materials in which the divalent metal cation lead (Pb + ) is replaced with tin (Sn + ), copper (Cu + ) or europium (Eu + ).

16. The perovskite ink of claim 1 , wherein the perovskite precursor material is configured to assemble Quasi-2D perovskite materials with mixed halides selected from:

(C 6 H 5 C 2 H 4 NH 3 ) 2 (CH(NH 2 ) 2 PbBr 3 ) n-1 PbI 4-x Cl x ;

(C 6 H 5 C 2 H 4 NH 3 ) 2 (CH(NH 2 ) 2 PbBr 3 ) n-1 PbI 4-x Br x ;

(C 6 H 5 C 2 H 4 NH 3 ) 2 (CH(NH 2 ) 2 PbBr 3 ) n-1 PbCl 4-x Br x ;

(C 10 H 7 CH 2 NH 3 ) 2 (CH 3 NH 3 PbI 2 Br) n-1 PbI 4-x Cl x ;

(C 10 H 7 CH 2 NH 3 ) 2 (CH 3 NH 3 PbI 2 Br) n-1 PbI 4-x Br x ; and

(C 10 H 7 CH 2 NH 3 ) 2 (CH 3 NH 3 PbI 2 Br) n-1 PbCl 4-x Br x , where n is in the range of 2-10, and x is in the range of 0-4; or any of these materials in which the divalent metal cation lead (Pb + ) is replaced with tin (Sn + ), copper (Cu + ) or europium (Eu + ).

17. A method of assembling a perovskite emissive layer, comprising the steps of:

providing a substrate;

providing a perovskite ink; and

depositing the perovskite ink onto the substrate by a method of inkjet printing;

wherein the perovskite ink comprises:

a first polar solvent, wherein the first polar solvent has a boiling point of 150° C. or more and a melting point of 30° C. or less; and

perovskite precursor material mixed in the first polar solvent, wherein the concentration of the perovskite precursor material in the perovskite ink is in the range of 0.01 wt. % to 10 wt. %;

wherein the perovskite precursor material is precursor material, which participates in a chemical reaction to assemble a perovskite light emitting material;

wherein the perovskite ink further comprises a second solvent, which is a non-polar solvent; and

wherein the boiling point of the first polar solvent is lower than the boiling point of the non-polar solvent.

18. The method of claim 17 , wherein the step of depositing the perovskite ink onto a substrate by the method of inkjet printing is followed by a step of vacuum drying the perovskite ink to assemble the perovskite emissive layer.

19. The method of claim 18 , wherein the step of vacuum drying the perovskite ink to assemble a perovskite emissive layer is followed by a step of annealing the perovskite emissive layer.

20. A method of assembling a perovskite light emitting device, wherein at least one perovskite emissive layer of the perovskite light emitting device is assembled by a method comprising the steps of:

providing a substrate;

providing a perovskite ink; and

depositing the perovskite ink onto the substrate by a method of inkjet printing;

wherein the perovskite ink comprises:

a first polar solvent having a boiling point of 150° C. or more and a melting point of 30° C. or less; and

perovskite precursor material mixed in the first polar solvent, wherein the concentration of the perovskite precursor material in the perovskite ink is in the range of 0.01 wt. % to 10 wt. %;

wherein the perovskite precursor material is a precursor material which participates in a chemical reaction to assemble a perovskite light emitting material;

wherein the perovskite ink further comprises a second solvent, which is a non-polar solvent; and

wherein the boiling point of the first polar solvent is lower than the boiling point of the non-polar solvent.