IP Library › Granted Patent US 12,527,083
Granted Patent B2
US 12,527,083 · App. 17/626,198 · Granted Jan 13, 2026

Display device including connection wire and method for manufacturing the same

Inventors: Chan Jae Park (Suwon-si, KR); Sang Duk Lee (Yongin-Si, KR); Hyun A Lee (Seoul, KR); Dae Hwan Jang (Seoul, KR)
Assignee: SAMSUNG DISPLAY CO., LTD.
H10D86/441H01L24/05H01L24/13H01L24/16H01L24/81H01L25/18H01L25/50H10K59/131H01L24/06H01L24/14H01L24/73H01L2224/02125H01L2224/02145H01L2224/05018H01L2224/05073H01L2224/05553H01L2224/05558H01L2224/05568H01L2224/05573H01L2224/0615H01L2224/13006H01L2224/13013H01L2224/13082H01L2224/1415H01L2224/16148H01L2224/73204H01L2224/81007H01L2224/81205H10K59/1201
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Quick Facts
Patent No.
US 12,527,083
App. No.
17/626,198
Granted
Jan 13, 2026
Kind
B2
Abstract

A display panel comprising a display substrate having a display area and a pad area disposed around the display area. A connection wire is disposed on the pad area of the display substrate. A signal wire is disposed on the connection wire. A supporter is disposed between the display substrate and the connection wire. The connection wire directly contacts the supporter.

Claims (84)

1 . A display panel comprising:

a display substrate having a display area and a pad area disposed around the display area;

a connection wire disposed on the pad area of the display substrate;

a signal wire disposed on the connection wire;

an insulating layer disposed between the display substrate and the signal wire; and

a supporter disposed between the display substrate and the connection wire,

wherein the connection wire directly contacts the supporter,

wherein lowermost surfaces of the connection wire and the supporter are disposed directly on a same layer as each other,

wherein a planar size of the signal wire is greater than a planar size of the connection wire and a side surface of the signal wire extends further outward than a side surface of the connection wire in a plan view, and

wherein the insulating layer directly contacts a first portion of an inclined side surface of the connection wire and exposes an upper surface of the connection wire and a second portion of the inclined side surface of the connection wire.

2 . The display panel of claim 1 , wherein:

the planar size of the connection wire is greater than a planar size of the supporter; and

the connection wire covers the supporter.

3 . The display panel of claim 2 , wherein:

the signal wire directly contacts the connection wire.

4 . The display panel of claim 1 , wherein the signal wire directly contacts an upper surface of the insulating layer.

5 . The display panel of claim 1 , wherein a cross-sectional shape of the supporter includes a trapezoidal shape, a triangular shape, a pentagonal shape, a semicircular shape, a semi-elliptical shape, and/or a quadrangular shape.

6 . The display panel of claim 1 , wherein the supporter includes a plurality of patterns extending along a long-side direction of the signal wire and spaced apart from each other along a short-side direction of the signal wire.

7 . The display panel of claim 1 , wherein the supporter includes a plurality of patterns extending along a short-side direction of the signal wire and spaced apart from each other along a long-side direction of the signal wire.

8 . The display panel of claim 1 , wherein the supporter has a lattice shape extending along a long-side direction and a short-side direction of the signal wire in a plan view.

9 . The display panel of claim 1 , wherein the supporter has a shape of a plurality of islands disposed to be spaced apart along a long-side direction and a short-side direction of the signal wire in a plan view.

10 . The display panel of claim 1 , wherein:

the connection wire includes a plurality of connection wires; and

the display panel further comprises a non-conductive film or a non-conductive paste disposed between the plurality of connection wires.

11 . A display panel comprising:

a display substrate having a display area and a pad area disposed around the display area;

a first connection wire disposed on the pad area of the display substrate; and

a signal wire disposed on the first connection wire,

wherein the first connection wire includes a first portion, a second portion disposed on a first side of the first portion, and a third portion disposed on a second side of the first portion that is opposite to the first side, the second and third portions each include an inclined surface,

wherein a surface height of the first portion is greater than a surface height of the second portion and a surface height of the third portion, and

wherein the signal wire directly contacts the first to third portions of the first connection wire and exposes lower surfaces of each of the inclined surfaces of the second and third portions of the first connection wire.

12 . The display panel of claim 11 , wherein:

the first connection wire includes a fourth portion disposed to overlap a first portion of the signal wire, a fifth portion disposed to overlap a second portion of the signal wire, and a sixth portion disposed to overlap a third portion of the signal wire,

wherein a thickness of the fourth portion is greater than a thickness of each of the fifth portion and the sixth portion.

13 . The display panel of claim 11 , further comprising:

a second connection wire disposed between the first connection wire and the signal wire,

wherein a planar size of the second connection wire is less than a planar size of the first connection wire and a planar size of the signal wire, and

the second connection wire is disposed to overlap a first portion of the signal wire in a thickness direction.

14 . A display device comprising:

a display panel including a display substrate having a display area and a pad area disposed around the display area, a connection wire disposed on the pad area of the display substrate, a signal wire disposed on the connection wire, an insulating layer disposed between the display substrate and the signal wire, and a supporter disposed between the display substrate and the connection wire; and

a driving integrated circuit attached on the pad area of the display substrate and including a bump connected to the signal wire,

wherein the connection wire directly contacts the supporter, and

wherein lowermost surfaces of the connection wire and the supporter are disposed directly on a same layer as each other,

wherein a planar size of the signal wire is greater than a planar size of the connection wire and a side surface of the signal wire extends further outward than a side surface of the connection wire in a plan view, and

wherein the insulating layer directly contacts a first portion of an inclined side surface of the connection wire and exposes an upper surface of the connection wire and a second portion of the inclined side surface of the connection wire.

15 . The display device of claim 14 , wherein:

the planar size of the connection wire is greater than a planar size of the supporter; and

the connection wire covers the supporter.

16 . The display device of claim 14 , wherein:

the signal wire directly contacts the connection wire.

17 . The display device of claim 14 , wherein the signal wire directly contacts an upper surface of the insulating layer.

18 . The display device of claim 16 , wherein

the signal wire includes a first portion disposed to overlap the supporter, a second portion disposed not to overlap the supporter and located on a first side of the first portion, and a third portion disposed not to overlap the supporter and located on a second side of the first portion that is opposite to the first side,

wherein an upper surface of the first portion protrudes further from the display substrate than an upper surface of the second portion and an upper surface of the third portion in a thickness direction.

19 . The display device of claim 18 , wherein:

the driving integrated circuit further includes a driving substrate and a driving wire disposed on the driving substrate; and

the bump is disposed on the driving wire and connected to the driving wire.

20 . The display device of claim 19 , wherein

the bump includes a first portion, a second portion disposed on a first side of the first portion, and a third portion disposed a second side of the first portion that is opposite to the first side,

wherein a surface of the first portion is indented further than a surface of the second portion and a surface of the third portion in the thickness direction.

21 . The display device of claim 20 , wherein:

the first portion of the signal wire is connected to the first portion of the bump;

the second portion of the signal wire is connected to the second portion of the bump; and

the third portion of the signal wire is connected to the third portion of the bump.

22 . The display device of claim 19 , wherein the bump is directly connected to the signal wire.

23 . The display device of claim 22 , wherein the bump is ultrasonically connected to the signal wire.

24 . A display panel comprising:

a display substrate having a display area and a pad area disposed around the display area;

a connection wire disposed on the pad area of the display substrate;

a supporter disposed between the display substrate and the connection wire and directly contacting the connection wire, the supporter protrudes a first portion of the connection wire in a direction further from the display substrate, wherein lowermost surfaces of the connection wire and the supporter are disposed directly on a same layer as each other;

a signal wire disposed on the connection wire, the signal wire including a first portion that overlaps the first portion of the connection wire, the first portion of the connection wire protruding the first portion of the signal wire in the direction further from the display substrate, wherein the first portion of the connection wire includes inclined surfaces having upper surfaces directly contacting the signal wire and lower surfaces exposed by the signal wire; and

a driving integrated circuit attached on the pad area of the display substrate and including a bump directly connected to the signal wire.

25 . The display panel of claim 24 , wherein the bump is ultrasonically connected to the signal wire.

26 . An electronic device, comprising:

a display panel comprising:

a display substrate having a display area and a pad area disposed around the display area;

a connection wire disposed on the pad area of the display substrate;

a signal wire disposed on the connection wire;

an insulating layer disposed between the display substrate and the signal wire; and

a supporter disposed between the display substrate and the connection wire,

wherein the connection wire directly contacts the supporter,

wherein lowermost surfaces of the connection wire and the supporter are disposed directly on a same layer as each other,

wherein a planar size of the signal wire is greater than a planar size of the connection wire and a side surface of the signal wire extends further outward than a side surface of the connection wire in a plan view, and

wherein the insulating layer directly contacts a first portion of an inclined side surface of the connection wire and exposes an upper surface of the connection wire and a second portion of the inclined side surface of the connection wire.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2022
From: PARK, CHAN JAE; LEE, SANG DUK; LEE, HYUN A; JANG, DAE HWAN
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 058616/0482 →
Priority Claims (1)
KR 10-2019-0084765 · Jul 12, 2019 · national
Continuity (1)
Related Publication 20220278088A1 · Sep 1, 2022
References Cited (38)
US 20040099959A1 · Tang · 2004 [cited by applicant]
US 20060146214A1 · Hwang et al. · 2006 [cited by applicant]
US 20070290306A1 · Muramatsu et al. · 2007 [cited by applicant]
US 20120211900A1 · Choi · 2012 [cited by examiner]
US 20160197097A1 · Kim · 2016 [cited by examiner]
US 20170062548A1 · Han · 2017 [cited by examiner]
US 20170250199A1 · Odaka · 2017 [cited by examiner]
US 20180061748A1 · Kim et al. · 2018 [cited by applicant]
US 20180061855A1 · Min et al. · 2018 [cited by applicant]
US 20180068931A1 · Ha et al. · 2018 [cited by applicant]
US 20180076151A1 · Min et al. · 2018 [cited by applicant]
US 20180358413A1 · Lee · 2018 [cited by examiner]
US 20190131379A1 · Won et al. · 2019 [cited by applicant]
US 20210033902A1 · Shiina · 2021 [cited by examiner]
US 20210408207A1 · Shu · 2021 [cited by examiner]
CN 105739198 · 2016 [cited by applicant]
CN 106486605A · 2017 [cited by applicant]
CN 107132708A · 2017 [cited by applicant]
CN 107180848A · 2017 [cited by applicant]
CN 109003997A · 2018 [cited by applicant]
JP 06177214 · 1994 [cited by applicant]
JP 2005070360 · 2005 [cited by applicant]
JP 2008116795 · 2008 [cited by applicant]
JP 2008135486 · 2008 [cited by applicant]
JP 2008277646 · 2008 [cited by applicant]
JP 2008277647A · 2008 [cited by examiner]
JP 2009162888 · 2009 [cited by applicant]
JP 5324121 · 2013 [cited by applicant]
KR 100368776 · 2003 [cited by applicant]
KR 1020160083993A · 2016 [cited by applicant]
KR 1020170038406 · 2017 [cited by applicant]
KR 1020170081052 · 2017 [cited by applicant]
KR 1020170141840 · 2017 [cited by applicant]
KR 1020180000046 · 2018 [cited by applicant]
KR 1020180070774 · 2018 [cited by applicant]
International Search Report issued in corresponding application No. PCT/KR2020/008404 on Oct. 7, 2020. [cited by applicant]
Office Action issued in corresponding Japanese Application No. JP 2022-501069 on Apr. 2, 2024. [cited by applicant]
Extended European Search Report issued in corresponding European Application No. EP 20840013.5 on Aug. 1, 2023. [cited by applicant]