IP Library › Granted Patent US 11,996,130
Granted Patent B2
US 11,996,130 · App. 17/627,839 · Granted May 28, 2024

Nonvolatile memory cell, nonvolatile memory cell array, and information writing method of nonvolatile memory cell array

Inventors: Takashi Yokoyama (Kanagawa, JP); Mikio Oka (Kanagawa, JP); Yasuo Kanda (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
G11C11/1675G11C11/1655G11C11/1657G11C11/1673
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Quick Facts
Patent No.
US 11,996,130
App. No.
17/627,839
Granted
May 28, 2024
Kind
B2
Abstract

A nonvolatile memory cell includes a resistance-change nonvolatile memory element 50 and a selection transistor TR. One end of the nonvolatile memory element 50 is connected to one source/drain region 15 A of the selection transistor TR and is connected to a write line WR. The other source/drain region 15 B of the selection transistor TR is connected to a select line SL. The other end of the nonvolatile memory element 50 is connected to a bit line BL.

Claims (48)

1. A nonvolatile memory cell comprising:

a resistance-change nonvolatile memory element and a selection transistor, wherein

one end of the nonvolatile memory element is connected to one source/drain region of the selection transistor and is connected to a write line,

other source/drain region of the selection transistor is connected to a select line,

another end of the nonvolatile memory element is connected to a bit line,

the selection transistor and the write line are provided on a first surface side of a base portion made of a semiconductor material, and

the nonvolatile memory element is provided on a second surface side opposing the first surface of the base portion.

2. The nonvolatile memory cell according to claim 1 , wherein the nonvolatile memory element is formed of a spin transfer torque-based magnetic random access memory of a perpendicular magnetization type.

3. The nonvolatile memory cell according to claim 2 , wherein

the nonvolatile memory element includes at least a storage layer and a magnetization fixed layer, and

the magnetization fixed layer is connected to the one source/drain region of the selection transistor.

4. The nonvolatile memory cell according to claim 1 , wherein the selection transistor is formed of a field effect transistor.

5. The nonvolatile memory cell according to claim 1 , wherein the selection transistor includes a Fin-FET.

6. A nonvolatile memory cell array comprising:

a plurality of nonvolatile memory cells according to claim 1 , each one of the plurality of nonvolatile memory cells arranged in a two-dimensional matrix in a first direction and a second direction different from the first direction, wherein

the write line is common to the plurality of nonvolatile memory cells arranged along the first direction,

the select line is common to the plurality of nonvolatile memory cells arranged along the first direction, and

the bit line is common to the plurality of nonvolatile memory cells arranged along the first direction.

7. The nonvolatile memory cell array according to claim 6 , wherein a gate electrode of the selection transistor is connected to a word line extending in the second direction.

8. A nonvolatile memory cell comprising:

a resistance-change nonvolatile memory element and a selection transistor, wherein

one end of the nonvolatile memory element is connected to one source/drain region of the selection transistor and is connected to a write line,

other source/drain region of the selection transistor is connected to a select line,

another end of the nonvolatile memory element is connected to a bit line,

the selection transistor and the nonvolatile memory element are provided on a first surface side of a base portion made of a semiconductor material, and

the write line is provided on a second surface side opposing the first surface of the base portion.

9. A nonvolatile memory cell comprising:

a resistance-change nonvolatile memory element and a selection transistor, wherein

one end of the nonvolatile memory element is connected to one source/drain region of the selection transistor and is connected to a write line,

other source/drain region of the selection transistor is connected to a select line,

another end of the nonvolatile memory element is connected to a bit line,

the one source/drain region of the selection transistor has a rectification property,

when the selection transistor is not conductive, a current flows between the write line and the nonvolatile memory element via the one source/drain region of the selection transistor, and

when the selection transistor is conductive, a current flows between the select line and the nonvolatile memory element via the one source/drain region and the other source/drain region of the selection transistor, and a current does not flow to the write line.

10. The nonvolatile memory cell according to claim 9 , wherein the one source/drain region of the selection transistor has a p/n junction.

11. The nonvolatile memory cell according to claim 10 , wherein the one source/drain region of the selection transistor has a layered structure of a first layer made of silicon containing an impurity of a first conductivity type and a second layer made of silicon containing an impurity of a second conductivity type different from the first conductivity type.

12. The nonvolatile memory cell according to claim 10 , wherein the one source/drain region of the selection transistor has a layered structure of a first layer made of silicon containing an impurity of a first conductivity type and a second layer made of germanium or silicon-germanium containing an impurity of a second conductivity type different from the first conductivity type.

13. The nonvolatile memory cell according to claim 9 , wherein the one source/drain region of the selection transistor has a Schottky junction.

14. The nonvolatile memory cell according to claim 13 , wherein the one source/drain region of the selection transistor has a layered structure of a first layer made of silicon containing an impurity and a second layer made of metal.

15. The nonvolatile memory cell according to claim 13 , wherein the one source/drain region of the selection transistor has a layered structure of a first layer made of silicon containing an impurity and a second layer made of germanium or silicon-germanium containing an impurity.

16. An information writing method of a nonvolatile memory cell array including a plurality of nonvolatile memory cells arranged in a two-dimensional matrix in a first direction and a second direction different from the first direction,

each of the plurality of nonvolatile memory cells arranged along the first direction including:

a resistance-change nonvolatile memory element and a selection transistor,

one end of the nonvolatile memory element being connected to one source/drain region of the selection transistor and connected to a write line common to the plurality of nonvolatile memory cells arranged along the first direction,

other source/drain region of the selection transistor being connected to a select line common to the plurality of nonvolatile memory cells arranged along the first direction, and

another end of the nonvolatile memory element being connected to a bit line common to the plurality of nonvolatile memory cells arranged along the first direction, the information writing method of the nonvolatile memory cell array comprising:

bringing the selection transistor into a non-conductive state and causing a current to flow between the write line and the nonvolatile memory element to store information “1” in each of the nonvolatile memory cells in each of the plurality of nonvolatile memory cells arranged along the first direction; and

bringing the write line into a floating state, bringing a desired selection transistor into a conductive state, and causing a current to flow between the select line and the nonvolatile memory element via other source/drain region and one source/drain region of the desired selection transistor to store information “0” in the nonvolatile memory cell.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2022
From: YOKOYAMA, TAKASHI; OKA, MIKIO; KANDA, YASUO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 060517/0180 →
Priority Claims (1)
JP 2019-135920 · Jul 24, 2019 · national
Continuity (1)
Related Publication 20220262420A1 · Aug 18, 2022