IP Library Granted Patent US 12,237,825
Granted Patent B2
US 12,237,825 · App. 17/628,201 · Granted Feb 25, 2025

Filter device comprising two connected filter circuits

Inventors: Georgiy Sevskiy (Munich, DE); Stefan Freisleben (Neubiberg, DE); Patric Heide (Vaterstetten, DE); Oleksandr Ruban (Munich, DE); Igor Ielegechev (Munich, DE)
Assignee: RF360 Singapore Pte. Ltd.
H03H9/0576H03H9/0561H03H9/725H03H9/74H03H2001/0085
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,237,825
App. No.
17/628,201
Granted
Feb 25, 2025
Kind
B2
Abstract

A filter device having a reduced sensitivity to production tolerances comprises a multilayer panel with integrated wiring, a piezoelectric substrate mounted to the panel. A first filter circuit (FC 1 ) and a signal path (SP) comprising a second filter circuit are realized on the substrate and connected to a common antenna terminal (AT) as well as to a common node (CN) located on top of the piezoelectric substrate. A first matching circuit (MC 1 ) and further matching circuits (MC 2 ) are realized by the wiring in the multilayer panel.

Claims (25)

1. A filter device comprising:

a multilayer panel with wiring;

a piezoelectric substrate mounted to the multilayer panel;

a first filter circuit;

a signal path comprising a second filter circuit, wherein the first filter circuit and the second filter circuit are both filter circuits being realized on a top surface of the piezoelectric substrate and connected to a common antenna terminal on the piezoelectric substrate;

a first matching circuit having a first end connected to the common antenna terminal on the piezoelectric substrate and a second end connected to the signal path with the second filter circuit, the first matching circuit including the wiring in the multilayer panel; and

a common node to which the first filter circuit, the signal path and the common antenna terminal are connected to, the common node being a pad located on the top surface of the piezoelectric substrate.

2. The filter device of claim 1 ,

wherein the first matching circuit realized by the wiring in the multilayer panel is circuited in a series line between the signal path and the common node;

wherein a first series line section arranged on the piezoelectric substrate connects the common node and a first pad;

wherein a second series line section arranged on the piezoelectric substrate connects a second pad and the signal path comprising the second filter circuit;

wherein a first interconnection connects the first pad to a first end of the first matching circuit; and

wherein a second interconnection connects the second pad to a second end of the first matching circuit.

3. The filter device of claim 1 , wherein a second matching circuit is circuited between the common antenna terminal and the common node.

4. The filter device of claim 1 , wherein at least one of the first and second filter circuits comprises SAW resonators.

5. The filter device of claim 1 , the filter device being one of a Duplexer, a multiplexer or an extractor.

6. The filter device of claim 1 , wherein the first filter circuit is a band pass filter for global positioning system (GPS) frequencies and/or global navigation satellite system (GNSS) signals.

7. The filter device of claim 6 , wherein the signal path has a voltage standing wave ratio of less than 2 between 617 MHz and 4.2 GHz with except around the GPS/GNSS frequencies.

8. The filter device of claim 1 , wherein the multilayer panel comprises one of a laminate, a high temperature co-fired ceramic (HTCC) and a low temperature co-fired ceramic (LTCC).

9. The filter device of claim 1 ,

wherein a second matching circuit is circuited between the common antenna terminal and the common node,

wherein the second matching circuit comprises a series coil to match an antenna to the first filter circuit and to the signal path.

10. The filter device of claim 1 ,

wherein every interconnect between any pad on the piezoelectric substrate and a respective contact area on a surface of the multilayer panel comprises a bump, and

wherein an interconnect between the common antenna terminal and a respective pad on the piezoelectric substrate is located near a corner of the piezoelectric substrate.

Assignments (3)
CHANGE OF OWNER'S ADDRESS Recorded Nov 22, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 069761/0931 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2023
From: RF360 EUROPE GMBH
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 063272/0475 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2022
From: SEVSKIY, GEORGIY; FREISLEBEN, STEFAN; HEIDE, PATRIC; RUBAN, OLEKSANDR; IELEGECHEV, IGOR
To: RF360 EUROPE GMBH
Reel/Frame 059431/0403 →
Priority Claims (1)
DE 10 2019 120 312.0 · Jul 26, 2019 · national
Continuity (1)
Related Publication 20220255529A1 · Aug 11, 2022
References Cited (16)
US 8081047B2 · Royak et al. · 2011 [cited by applicant]
US 9178491B2 · Takemura · 2015 [cited by applicant]
US 20130222077A1 · Ota · 2013 [cited by applicant]
US 20150130680A1 · Link et al. · 2015 [cited by applicant]
US 20150236390A1 · Analui · 2015 [cited by examiner]
US 20150236840A1 · Link et al. · 2015 [cited by applicant]
US 20160156329A1 · Takeuchi · 2016 [cited by examiner]
US 20170077896A1 · Sugaya et al. · 2017 [cited by applicant]
CN 1368831A · 2002 [cited by applicant]
CN 1499714A · 2004 [cited by applicant]
CN 102611410A · 2012 [cited by applicant]
JP 2005020140A · 2005 [cited by applicant]
WO 2008132212 · 2008 [cited by applicant]
International Search Report and Written Opinion—PCT/EP2020/069405—ISA/EPO—Oct. 2, 2020. [cited by applicant]
Kim D., et al., “A Compact WiMAX Diplexer Module with LTCC and FBAR Technologies”, In: European Microwave Conference (EuMC), 2009, pp. 567-570, DOI: 10.23919/EUMC.2009.5296174. [cited by applicant]
Yuanwang H., “Research on the Technology of High Density Assembled Digital T/R Modules”, Chinese Excellent Master's Thesis Full Text Database (Information Technology Collection), Mar. 15, 2016, 81 Pages. [cited by applicant]