High-frequency module
A high-frequency module includes a connection line that interconnects a first SAW resonator and a second SAW resonator, and is connected to a second shunt connection terminal through a third SAW resonator. A connection line interconnecting a fourth SAW resonator and a second series connection terminal is connected to the second shunt connection terminal through a fifth SAW resonator. The second shunt connection terminal is connected to a ground through an inductor. A matching circuit is connected between a first series connection terminal and a first external connection terminal. The matching circuit is inductively or capacitively coupled to the inductor.
1. A high-frequency module comprising:
a first external connection terminal;
a second external connection terminal;
a filter unit connected between the first external connection terminal and the second external connection terminal;
a filter substrate including IDT electrodes that define the filter unit and are located on a first principal surface of the filter substrate;
a cover layer located opposite to the first principal surface of the filter substrate with a spacing defined therebetween;
a connection electrode projecting from the first principal surface and penetrating through the cover layer;
a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
a multilayer substrate including the matching circuit mounted thereto or located therein; and
an inductor connected between a ground and the filter unit; wherein
the filter unit includes:
a first series connection terminal connected to the first external connection terminal;
a second series connection terminal connected to the second external connection terminal;
a shunt connection terminal connected to the ground through the inductor;
a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
a first shunt-connected filter element including one end connected to a first connection line of the plurality of connection lines, and an opposite end connected to the shunt connection terminal; and
a second shunt-connected filter element including one end connected to a second connection line of the plurality of connection lines, and an opposite end connected to the shunt connection terminal to which the first shunt-connected filter element is connected; wherein
the first principal surface faces a mount surface of the multilayer substrate;
the filter substrate is connected to the multilayer substrate through the connection electrode;
the inductor and the matching circuit are inductively or capacitively coupled to each other;
the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate;
the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate; and
the surface mount circuit element and the inductor are arranged close to each other.
2. The high-frequency module according to claim 1 , wherein the inductor and the matching circuit inductively or capacitively coupled to each other are inductively or capacitively coupled such that impedance outside of a passband of the filter unit is changed.
3. The high-frequency module according to claim 2 , wherein the inductor and the matching circuit inductively or capacitively coupled to each other are inductively or capacitively coupled such that a frequency of an attenuation pole outside of the passband of the filter unit is changed.
4. The high-frequency module according to claim 1 , wherein the matching circuit is a series-connected matching circuit that is connected in series between the first external connection terminal and the first series connection terminal.
5. The high-frequency module according to claim 1 , wherein the matching circuit is a series-connected matching circuit that is connected in series between the second external connection terminal and the second series connection terminal.
6. The high-frequency module according to claim 1 , wherein the matching circuit is a shunt-connected matching circuit that is connected between the connection line interconnecting the first external connection terminal and the first series connection terminal and the ground.
7. The high-frequency module according to claim 1 , wherein the matching circuit is a shunt-connected matching circuit that is connected between the connection line interconnecting the second external connection terminal and the second series connection terminal and the ground.
8. The high-frequency module according to claim 1 , wherein
the filter unit includes a third terminal and a second filter unit; and
the second filter unit is connected between a connection line interconnecting the first series connection terminal and the filter element, which is connected to the first series connection terminal, and the third terminal.
9. The high-frequency module according to claim 1 , wherein the matching circuit includes:
a rectangular or substantially rectangular parallelepiped casing; and
a spiral conductor located inside of the casing and having a rectangular or substantially rectangular outer peripheral shape when looking at the high-frequency module in a plan view; wherein
the matching circuit is arranged such that a long side of the casing is close to the inductor.
10. The high-frequency module according to claim 1 , wherein the high-frequency module is a duplexer.
11. A high-frequency module comprising:
a first external connection terminal;
a second external connection terminal;
a filter unit connected between the first external connection terminal and the second external connection terminal;
a filter substrate including IDT electrodes that define the filter unit and are located on a first principal surface of the filter substrate;
a cover layer located opposite to the first principal surface of the filter substrate with a spacing defined therebetween;
a connection electrode projecting from the first principal surface and penetrating through the cover layer;
a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
a multilayer substrate including the matching circuit mounted thereto or located therein; and
an inductor connected between a ground and the filter unit; wherein
the filter unit includes:
a first series connection terminal connected to the first external connection terminal;
a second series connection terminal connected to the second external connection terminal;
a shunt connection terminal connected to the ground through the inductor;
a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
a first shunt-connected filter element including one end connected to a first connection line of the plurality of connection lines, and an opposite end connected to the shunt connection terminal; and
a second shunt-connected filter element including one end connected to a second connection line of the plurality of connection lines, and an opposite end connected to the shunt connection terminal to which the first shunt-connected filter element is connected; wherein
the inductor and the matching circuit are inductively or capacitively coupled to each other;
the first principal surface faces a mount surface of the multilayer substrate;
the filter substrate is connected to the multilayer substrate through the connection electrode;
the matching circuit includes a surface mount circuit element that is mounted to a mount surface of the multilayer substrate;
the inductor is located inside of the cover layer; and
the surface mount circuit element and the inductor are arranged close to each other.
12. A high-frequency module comprising:
a first external connection terminal;
a second external connection terminal;
a filter unit connected between the first external connection terminal and the second external connection terminal;
a filter substrate including IDT electrodes that define the filter unit and are located on a first principal surface of the filter substrate;
a cover layer located opposite to the first principal surface of the filter substrate with a spacing defined therebetween;
a connection electrode projecting from the first principal surface and penetrating through the cover layer;
a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
a multilayer substrate including the matching circuit located therein; and
an inductor connected between a ground and the filter unit; wherein
the filter unit includes:
a first series connection terminal connected to the first external connection terminal;
a second series connection terminal connected to the second external connection terminal;
a shunt connection terminal connected to the ground through the inductor;
a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
a first shunt-connected filter element including one end connected to a first connection line of the plurality of connection lines, and an opposite end connected to the shunt connection terminal; and
a second shunt-connected filter element including one end connected to a second connection line of the plurality of connection lines, and an opposite end connected to the shunt connection terminal to which the first shunt-connected filter element is connected; wherein
the first principal surface faces a mount surface of the multilayer substrate;
the filter substrate is connected to the multilayer substrate through the connection electrode;
the inductor and the matching circuit are inductively or capacitively coupled to each other;
the matching circuit is a matching inductor connected in parallel to an antenna;
the matching inductor and the inductor are located inside of the multilayer substrate in a state close to each other;
the matching inductor and the inductor are line electrodes located in different layers of the multilayer substrate;
the line electrode defining the matching inductor includes a portion overlapping the line electrode defining the inductor when looking at the multilayer substrate in a lamination direction thereof; and
transfer directions of high-frequency signals propagating through the line electrode defining the matching inductor and through the line electrode defining the inductor are opposite to each other in the overlapping portion.