Surface protection film
The present disclosure provides a surface protective film which is used in a process of fabricating an encapsulation layer for an organic light-emitting diode, and makes it possible to prevent bubbles from being generated in the protective film or the surface smoothness of the protective film from being degraded, due to solvent volatilization from the protective film. Specifically, the present disclosure provides a surface protective film including an adhesive layer provided on one surface of a substrate layer, wherein the adhesive layer includes a cured product of an adhesive composition including: a urethane-based resin having a photoreactive group at the end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at the end thereof; a photoinitiator; and a photoreactive siloxane additive, the adhesive composition being solvent-free.
1. A surface protective film comprising an adhesive layer provided on one surface of a substrate layer,
wherein the adhesive layer comprises a cured product of an adhesive composition containing: a urethane-based resin having a photoreactive group at an end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at an end thereof; a photoinitiator; and a photoreactive siloxane additive, the adhesive composition being solvent-free,
wherein the monofunctional (meth)acrylate monomer is contained in an amount of 50 parts by weight to 200 parts by weight based on 100 parts by weight of the urethane-based resin.
2. The surface protective film of claim 1 , wherein the adhesive layer has a peel strength of 0.5 gf/in to 4 gf/in, as measured on a glass substrate at a peel angle of 180° and a peel rate of 1.8 m/min, and an adhesive strength retention rate of the adhesive layer is 75% or more.
3. The surface protective film of claim 1 , wherein the photoreactive siloxane additive is of a solvent-free type and contains an acrylate reactive group.
4. The surface protective film of claim 1 , wherein the photoreactive siloxane additive is present in an amount of 0.01 parts by weight to 1 part by weight based on 100 parts by weight of the urethane-based resin.
5. The surface protective film of claim 1 , wherein the urethane-based resin is obtained by reacting a polyol and an isocyanate-based curing agent.
6. The surface protective film of claim 5 , wherein the polyol is selected from the group consisting of: ethylene glycol, diethylene glycol, polypropylene glycol, and combinations thereof.
7. The surface protective film of claim 5 , wherein the isocyanate-based curing agent is selected from the group consisting of: a polyfunctional aliphatic isocyanate compound, a polyfunctional alicyclic isocyanate compound, a polyfunctional aromatic isocyanate compound, and combinations thereof.
8. The surface protective film of claim 1 , wherein the crosslinking agent having two or more photoreactive groups at the end thereof is selected from the group consisting of: a polyfunctional (meth)acrylate monomer, a polyfunctional urethane (meth)acrylate oligomer, and a mixture thereof.
9. The surface protective film of claim 1 , wherein the crosslinking agent having two or more photoreactive groups at the end thereof is present in an amount of 5 parts by weight to 50 parts by weight, based on 100 parts by weight of the urethane-based resin.
10. The surface protective film of claim 1 , wherein the photoinitiator is present in an amount of 0.1 parts by weight to 5 parts by weight, based on 100 parts by weight of the total sum of the urethane-based resin, the crosslinking agent and the photoreactive siloxane additive.
11. The surface protective film of claim 1 , wherein the adhesive layer has a thickness of 10 μm to 100 μm.
12. The surface protective film of claim 1 , wherein the adhesive layer further comprises an antistatic agent.
13. The surface protective film of claim 1 , wherein
the substrate layer comprises: a substrate film; a first antistatic layer and a second antistatic layer provided on both surfaces of the substrate film, respectively, and
the adhesive layer is provided on a surface of the second antistatic layer, which is opposite to a surface thereof on which the substrate film is provided.