Substrate handling device for a wafer
The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: —an end effector, —a straightening ring, and —a suction cup. The suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the end effector. A first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply. The suction cup projects from the straightening ring in a normal pressure state. The suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate.
1. A substrate handling device for a wafer, comprising:
an end effector,
a straightening ring, and
a suction cup,
wherein the suction cup is arranged within the straightening ring,
wherein a first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply,
wherein the suction cup projects from the straightening ring in a normal pressure state, and
wherein the second part of the suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is directly contacted and held by the second part of the suction cup, so that the straightening ring also directly contacts the substrate,
characterised in that the straightening ring is releasably attached to the end effector, and also the suction cup is releasably attached to the end effector, and the straitening ring is exchangeable with another straightening ring, wherein the another straightening ring has a different height than the straightening ring.
2. The substrate handling device according to claim 1 , wherein the straightening ring surrounds the suction cup and restricts a radial deformation of the suction cup.
3. The substrate handling device according to claim 1 , wherein the suction cup holds the substrate in the reduced pressure state in an essentially horizontal or an essentially vertical position relative to the ground.
4. The substrate handling device according to claim 1 , wherein, when the straightening ring contacts the substrate and the substrate is non-planar, the straightening ring at least partially straightens the non-planar substrate.
5. The substrate handling device according to claim 1 , wherein the suction cup projects with a distance d from the straightening ring in the normal pressure state, and wherein a distance d to size s of the substrate ratio is in the range between 30:1 and 800:1.
6. The substrate handling device according to claim 1 , wherein an outer circumference of the straightening ring is larger than an outer circumference of the suction cup.
7. The substrate handling device according to claim 1 , wherein a substrate-contacting surface of the suction cup projects from the straightening ring in the normal pressure state.
8. The substrate handling device according to claim 1 , wherein the straightening ring is made of a material, which is more rigid than a cup material of the suction cup.
9. The substrate handling device according to claim 1 , further comprising a plurality of suction cups.
10. The substrate handling device according to claim 1 , further comprising a plurality of straightening rings, of which at least three straightening rings each surrounding one of the suction cups.
11. A substrate handling system for a wafer, comprising the substrate handling device according to claim 1 .
12. The substrate handling system according to claim 11 , further comprising at least a replacing straightening ring to replace the straightening ring of the substrate handling device.
13. A method for substrate handling, comprising the following steps:
providing a suction cup arranged within a straightening ring,
wherein the straightening ring is releasably attached to an end effector,
wherein a first part of the suction cup is connected to a vacuum supply and wherein the suction cup projects from the straightening ring in a normal pressure state,
providing contact between a second part of the suction cup and a substrate, and
providing a reduced pressure state by means of the vacuum supply so that the substrate is directly contacted and held by the second part of the suction cup,
wherein the second part of the suction cup is in the reduced pressure state on the same level as the straightening ring, so that also the straightening ring directly contacts the substrate, wherein also the suction cup is-releasably attached to the end effector, and the straitening ring is exchangeable with another straightening ring, wherein the another straightening ring has a different height than the straightening ring.
14. The method according to claim 13 , wherein the straightening ring contacts the substrate and, in case the substrate is non-planar, at least partially straightens the substrate in the reduced pressure state.