Systems, methods and apparatus for dispensing fluid to an object
Systems, methods and apparatus related to pre-wetting an edge portion of a bonded wafer prior to wetting a flat, horizontal portion of the bonded wafer. The apparatus includes a frame having nozzles directed such that couplant discharged from these nozzles wet the edge of the wafer. The edge nozzles have couplant flow vectors that interface to dampen the trajectory of fluid to reduce splash and pre-wet the edges of the bonded wafer.
1. An apparatus comprising:
a frame;
a first plurality of nozzles disposed on a first region of the frame, the first plurality of nozzles having an associated orifice with a first angle of trajectory;
a second plurality of nozzles disposed on a second region of the frame, the second plurality of nozzles having an associated orifice with a second angle of trajectory;
a plurality of center nozzles disposed on a third region of the frame; and
a fixture configured to support an object relative to the frame wherein fluid from the first plurality of nozzles and fluid from the second plurality of nozzles reach an edge portion of the object prior to fluid from the plurality of center nozzles reaching a horizontal portion of the object,
the first angle of trajectory generating a first trajectory of fluid and the second angle of trajectory generating a second trajectory of fluid, the first trajectory of fluid interfacing with the second trajectory of fluid.
2. The apparatus of claim 1 , wherein the first plurality of nozzles and the second plurality of nozzles have a conical shape.
3. The apparatus of claim 1 , further comprising:
control circuitry operatively coupled to one or more of the first plurality of nozzles and the second plurality of nozzles to control operation of one or more of the first plurality of nozzles and the second plurality of nozzles.
4. The apparatus of claim 1 , wherein the first trajectory of fluid and the second trajectory of fluid have a constant flow rate.
5. The apparatus of claim 1 , wherein the fluid is water.
6. The apparatus of claim 1 , wherein the first plurality of nozzles each have a distal portion with a first angle of between 50 and 64 degrees.
7. The apparatus of claim 1 , wherein the second plurality of nozzles each have a distal portion with a first angle between 57 and 70 degrees.
8. An apparatus comprising:
a frame:
a plurality of side nozzles disposed on first and second regions of the frame;
a plurality of center nozzles disposed on a third region of the frame; and
a fixture configured to support an object relative to the frame,
wherein fluid dispensed from the plurality of side nozzles reaches an edge portion of the object prior to fluid dispensed from the plurality of center nozzles reaching a horizontal portion of the object, and
wherein the fixture includes a wafer chuck configured to support a wafer relative to the frame such that fluid from the plurality of size nozzles reaches an edge portion of the wafer prior to fluid from the plurality of center nozzles reaching a horizontal portion of the wafer.
9. The apparatus of claim 1 , wherein: the fixture includes a wafer chuck configured to support a wafer relative to the frame; and the first trajectory of fluid and the second trajectory of fluid reach an edge portion of the wafer.
10. The apparatus of claim 8 , further comprising: control circuitry operatively coupled to the plurality of side nozzles and the plurality of center nozzles to control operation of plurality of side nozzles and the plurality of center nozzles.