Display substrate and manufacturing method therefor, and display device
A display substrate includes a base substrate, a light-emitting structure layer located on the base substrate, an encapsulation structure layer located on the light-emitting structure layer, a reflection layer located on the encapsulation structure layer, a hydrophilic material layer located on the reflection layer, and an optical adhesive layer located on the hydrophilic material layer.
1 . A flexible mirror display substrate, comprising: a display region, a border region located on a periphery of the display region, and a bonding region;
wherein the flexible mirror display substrate comprises a base substrate; the display region comprises:
a light-emitting structure layer, located at a side of the base substrate and comprising multiple light-emitting units;
an encapsulation structure layer, located at a side of the light-emitting structure layer away from the base substrate;
wherein the flexible mirror display substrate further comprises: a reflection layer covering the display region, the border region and the bonding region, a hydrophilic material layer covering the display region, the border region and the bonding region and an optical adhesive layer covering the display region, the border region and the bonding region;
wherein the reflection layer is located at a side of the encapsulation structure layer away from the base substrate, a thickness of the reflection layer ranges from 0.25 μm to 0.4 μm; wherein the reflection layer is made of one or more of the following materials: molybdenum, aluminum, argentum, titanium, an indium tin oxide/argentum/indium tin oxide multilayer composite, and a titanium/aluminum/titanium multilayer composite;
the hydrophilic material layer is located at a side of the reflection layer away from the base substrate; and
the optical adhesive layer is located at a side of the hydrophilic material layer away from the base substrate;
wherein the reflection layer is provided with light holes located in the display region and corresponding to the light-emitting units one to one, and a first exposure hole located in the bonding region and configured to expose a bonding pad of the bonding region; wherein the hydrophilic material layer is made of an inorganic material and covers the reflection layer and the light holes, and is provided with a second exposure hole located in the bonding region and configured to expose the bonding pad of the bonding region.
2 . The display substrate according to claim 1 , wherein a material of the hydrophilic material layer comprises a silicon-series super-hydrophilic oxide.
3 . The display substrate according to claim 1 , wherein a thickness of the hydrophilic material layer ranges from 1,200 angstroms to 1,700 angstroms.
4 . The display substrate according to claim 1 , wherein an orthographic projection of the hydrophilic material layer on the base substrate comprises that of the reflection layer on the base substrate; and the orthographic projection of the reflection layer on the base substrate comprises that of the encapsulation structure layer on the base substrate.
5 . The display substrate according to claim 1 , further comprising a protective layer located between the encapsulation structure layer and the reflection layer, wherein a material of the protective layer comprises at least one of the following materials: silicon nitride, silicon oxide, and a silicon nitride/silicon oxide composite layer.
6 . The display substrate according to claim 5 , wherein a thickness of the protective layer ranges from 0.2 μm to 0.4 μm.
7 . The display substrate according to claim 5 , wherein an orthogonal projection of the protective layer on the base substrate comprises that of the encapsulation structure layer on the base substrate.
8 . The display substrate according to claim 5 , wherein the encapsulation structure layer comprises a first inorganic encapsulation layer, organic encapsulation layer and second inorganic encapsulation layer which are sequentially stacked at the side of the light-emitting structure layer away from the base substrate.
9 . The display substrate according to claim 1 , wherein
the base substrate comprises a base structure layer and a driving structure layer located at a side of the base structure layer facing the light-emitting structure layer;
the base structure layer comprises a first base, second base, third base and buffer layer which are sequentially stacked;
the driving structure layer is located at a side of the buffer layer away from the first base; and
each of the first base, the second base and the third base comprises at least one of the following materials: a pressure sensitive adhesive, polyimide, polyethylene terephthalate, and a polymer soft film subjected to surface treatment.
10 . A display device, comprising the display substrate according to claim 1 .
11 . The display substrate according to claim 2 , further comprising a protective layer located between the encapsulation structure layer and the reflection layer, wherein a material of the protective layer comprises at least one of the following materials: silicon nitride, silicon oxide, and a silicon nitride/silicon oxide composite layer.
12 . The display substrate according to claim 3 , further comprising a protective layer located between the encapsulation structure layer and the reflection layer, wherein a material of the protective layer comprises at least one of the following materials: silicon nitride, silicon oxide, and a silicon nitride/silicon oxide composite layer.
13 . The display substrate according to claim 4 , further comprising a protective layer located between the encapsulation structure layer and the reflection layer, wherein a material of the protective layer comprises at least one of the following materials: silicon nitride, silicon oxide, and a silicon nitride/silicon oxide composite layer.
14 . A manufacturing method for a flexible mirror display substrate comprising a display region, a border region located on a periphery of the display region, and a bonding region; the manufacturing method comprising:
forming a light-emitting structure layer at a side of a base substrate, the light-emitting structure layer comprising multiple light-emitting units;
forming an encapsulation structure layer at a side of the light-emitting structure layer away from the base substrate;
forming a reflection layer at a side of the encapsulation structure layer away from the base substrate; wherein the reflection layer covers the display region, the border region and the bonding region, a thickness of the reflection layer ranges from 0.25 μm to 0.4 μm; wherein the reflection layer is made of one or more of the following materials: molybdenum, aluminum, argentum, titanium, an indium tin oxide/argentum/indium tin oxide multilayer composite, and a titanium/aluminum/titanium multilayer composite;
forming a hydrophilic material layer at a side of the reflection layer away from the base substrate with an inorganic material, wherein the hydrophilic material layer covers the display region, the border region and the bonding region; and
laminating an optical adhesive layer to a side of the hydrophilic material layer away from the base substrate; wherein the optical adhesive layer covers the display region, the border region and the bonding region;
wherein the reflection layer is provided with light holes located in the display region and corresponding to the light-emitting units one to one, and a first exposure hole located in the bonding region and configured to expose a bonding pad of the bonding region;
wherein the forming a hydrophilic material layer at a side of the reflection layer away from the base substrate comprises:
forming a hydrophilic material thin film located in the display region, the border region and the bonding region at the side of the reflection layer away from the base substrate, and
patterning the hydrophilic material thin film through a patterning process to form the hydrophilic material layer, the hydrophilic material layer being provided with a second exposure hole located in the bonding region and configured to expose the bonding pad of the bonding region.