Granted Patent B2

US 12,288,830 · App. 17/633,081 · Granted Apr 29, 2025

Inventors: Andreas Dobner (Wenzenbach, DE); Matthias Goldbach (Pentling, DE); Georg Bogner (Lappersdorf, DE)

Assignee: OSRAM Opto Semiconductors GmbH

H01L33/0095H01L31/02005H01L31/1848H01L31/186H01L31/1876H01L33/0075H01L33/32H01L33/62H01L25/042H01L25/0753H01L25/167H01L2933/0066

Abstract

Claims (21)

1. A method for singulating components from a component composite, the method comprising:

providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded;

removing the base material in separating regions of the component composite, which include the connecting portions; and

singulating the component composite at the separating regions to form the components.

2. The method according to claim 1 , wherein singulating comprises punching.

3. The method according to claim 1 , wherein the component carrier bodies are punched out of the substrate.

4. The method according to claim 1 , wherein the connecting portions are at least partially exposed when the base material is removed.

5. The method according to claim 1 , wherein at least one depression is created in the base material at the connecting portions by removing the base material.

6. The method according to claim 5 , wherein the depression has a lateral extent corresponding to a thickness of a starting material of the substrate.

7. The method according to claim 5 , wherein side walls of the depression formed from the base material and laterally delimiting the depression form at least parts of side walls of the components after singulating.

8. The method according to claim 1 , wherein the base material is removed in the separating regions by a photostructured coating.

9. The method according to claim 8 , wherein a photosensitive coating is applied to the component composite and the photostructured coating is produced by a lithographic process, and wherein the photosensitive coating is removed in the separating regions of the component composite.

10. The method according to claim 1 , wherein the connecting portions are substrate regions of reduced thickness and the component carrier bodies comprise substrate regions of maximum thickness.

11. The method according to claim 1 , wherein the components are optoelectronic semiconductor components, and wherein each component comprises a component carrier body and at least one optoelectronic semiconductor chip arranged on the component carrier body.

12. The method according to claim 1 , wherein the base material comprises a plastic material.

13. The method according to claim 1 , wherein the substrate comprises a base body containing or consisting of metal, plastic, glass or ceramic.

14. A method for singulating components from a component composite, the method comprising:

providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded;

removing the base material in separating regions of the component composite, which include the connecting portions; and

singulating the component composite at the separating regions to form the components,

wherein the base material is a photosensitive material.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (24)